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Operating principle of vacuum plasma cleaning machine pump

  • Categories:Company Dynamics
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2020-10-26
  • Views:

(Summary description)Low pressure vacuum plasma cleaning machine is a kind of cleaning equipment that depends on the activation of the material in the plasma state to remove the surface stains of the object. It belongs to dry cleaning in industrial cleaning, which requires vacuum pump to produce vacuum conditions that meet cleaning requirements. The required plasma is mainly produced by specific gas molecules in special occasions such as vacuum and discharge, such as low-pressure gas glow plasma. Plasma cleaning needs to be in the vacuum state, so a vacuum pump is needed to complete the vacuum pumping work.   Its main principle steps are as follows: first, the workpiece to be cleaned is sent to the vacuum chamber for fixation, then the vacuum pump and other devices are started, vacuum is pumped, and the vacuum is discharged to about 10Pa vacuum degree. Then the gas used for plasma cleaning is introduced into the vacuum chamber (different gases, such as oxygen, hydrogen, argon, nitrogen, etc., are selected according to different cleaning materials), and the pressure is maintained at about 100Pa. A high frequency voltage is applied between the electrode and the grounding device in the vacuum chamber, which causes the gas to be broken down and ionized by glow discharge to produce plasma. After the plasma generated in the vacuum chamber has completely covered the cleaned workpiece, the cleaning work begins. The cleaning process lasts from tens of seconds to several minutes. The whole process depends on electromagnetic bombardment and surface treatment in the field of plasma. Most physical cleaning processes require high energy and low pressure. Before the bombardment, the atoms and ions on the surface of the object are bombarded to their maximum velocity. Because it takes a lot of energy to speed up the plasma, atoms and ions can travel faster in the plasma. The lower pressure is needed to increase the average distance between the atoms before they collide, and the longer the average free path, the greater the chance of bombarding the ions on the surface of the object being washed. This allows for surface treatment, cleaning and etching (there is a slight etching process during cleaning); When the cleaning is complete, the evaporating dirt and cleaning gas are expelled, while the air is returned to the indoor vacuum to return to normal atmospheric pressure.   During cleaning, in the vacuum environment of vacuum chamber controlled by vacuum pump, the gas flow determines the luminance chroma: if the color is heavy, it means that the vacuum degree is low and the gas flow is large; If it is white, it means high vacuum and low gas flow. The specific needs according to the need of the treatment effect to determine the vacuum pump to achieve the vacuum degree.   As a kind of precision dry cleaning equipment, vacuum plasma cleaning machine manufacturers mainly used for cleaning hybrid integrated circuit, monolithic integrated circuit shell and ceramic substrate; It is suitable for precise cleaning of semiconductor, thick film circuit, component before packaging, silicon wafer after etching, vacuum electronics, connector and relay, etc. It can remove organic matter and oxide layer such as grease and oil on metal surface. It can also be used for surface activation of plastics, rubber, metals, ceramics, and life science experiments.

Operating principle of vacuum plasma cleaning machine pump

(Summary description)Low pressure vacuum plasma cleaning machine is a kind of cleaning equipment that depends on the activation of the material in the plasma state to remove the surface stains of the object. It belongs to dry cleaning in industrial cleaning, which requires vacuum pump to produce vacuum conditions that meet cleaning requirements. The required plasma is mainly produced by specific gas molecules in special occasions such as vacuum and discharge, such as low-pressure gas glow plasma. Plasma cleaning needs to be in the vacuum state, so a vacuum pump is needed to complete the vacuum pumping work.

 

Its main principle steps are as follows: first, the workpiece to be cleaned is sent to the vacuum chamber for fixation, then the vacuum pump and other devices are started, vacuum is pumped, and the vacuum is discharged to about 10Pa vacuum degree. Then the gas used for plasma cleaning is introduced into the vacuum chamber (different gases, such as oxygen, hydrogen, argon, nitrogen, etc., are selected according to different cleaning materials), and the pressure is maintained at about 100Pa. A high frequency voltage is applied between the electrode and the grounding device in the vacuum chamber, which causes the gas to be broken down and ionized by glow discharge to produce plasma. After the plasma generated in the vacuum chamber has completely covered the cleaned workpiece, the cleaning work begins. The cleaning process lasts from tens of seconds to several minutes. The whole process depends on electromagnetic bombardment and surface treatment in the field of plasma. Most physical cleaning processes require high energy and low pressure. Before the bombardment, the atoms and ions on the surface of the object are bombarded to their maximum velocity. Because it takes a lot of energy to speed up the plasma, atoms and ions can travel faster in the plasma. The lower pressure is needed to increase the average distance between the atoms before they collide, and the longer the average free path, the greater the chance of bombarding the ions on the surface of the object being washed. This allows for surface treatment, cleaning and etching (there is a slight etching process during cleaning); When the cleaning is complete, the evaporating dirt and cleaning gas are expelled, while the air is returned to the indoor vacuum to return to normal atmospheric pressure.

 

During cleaning, in the vacuum environment of vacuum chamber controlled by vacuum pump, the gas flow determines the luminance chroma: if the color is heavy, it means that the vacuum degree is low and the gas flow is large; If it is white, it means high vacuum and low gas flow. The specific needs according to the need of the treatment effect to determine the vacuum pump to achieve the vacuum degree.

 

As a kind of precision dry cleaning equipment, vacuum plasma cleaning machine manufacturers mainly used for cleaning hybrid integrated circuit, monolithic integrated circuit shell and ceramic substrate; It is suitable for precise cleaning of semiconductor, thick film circuit, component before packaging, silicon wafer after etching, vacuum electronics, connector and relay, etc. It can remove organic matter and oxide layer such as grease and oil on metal surface. It can also be used for surface activation of plastics, rubber, metals, ceramics, and life science experiments.


  • Categories:Company Dynamics
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2020-10-26 09:14
  • Views:
Information

Operating principle of vacuum plasma cleaning machine pump:

 

Low pressure vacuum plasma cleaning machine is a kind of cleaning equipment that depends on the activation of the material in the plasma state to remove the surface stains of the object. It belongs to dry cleaning in industrial cleaning, which requires vacuum pump to produce vacuum conditions that meet cleaning requirements. The required plasma is mainly produced by specific gas molecules in special occasions such as vacuum and discharge, such as low-pressure gas glow plasma. Plasma cleaning needs to be in the vacuum state, so a vacuum pump is needed to complete the vacuum pumping work.

 

Its main principle steps are as follows: first, the workpiece to be cleaned is sent to the vacuum chamber for fixation, then the vacuum pump and other devices are started, vacuum is pumped, and the vacuum is discharged to about 10Pa vacuum degree. Then the gas used for plasma cleaning is introduced into the vacuum chamber (different gases, such as oxygen, hydrogen, argon, nitrogen, etc., are selected according to different cleaning materials), and the pressure is maintained at about 100Pa. A high frequency voltage is applied between the electrode and the grounding device in the vacuum chamber, which causes the gas to be broken down and ionized by glow discharge to produce plasma. After the plasma generated in the vacuum chamber has completely covered the cleaned workpiece, the cleaning work begins. The cleaning process lasts from tens of seconds to several minutes. The whole process depends on electromagnetic bombardment and surface treatment in the field of plasma. Most physical cleaning processes require high energy and low pressure. Before the bombardment, the atoms and ions on the surface of the object are bombarded to their maximum velocity. Because it takes a lot of energy to speed up the plasma, atoms and ions can travel faster in the plasma. The lower pressure is needed to increase the average distance between the atoms before they collide, and the longer the average free path, the greater the chance of bombarding the ions on the surface of the object being washed. This allows for surface treatment, cleaning and etching (there is a slight etching process during cleaning); When the cleaning is complete, the evaporating dirt and cleaning gas are expelled, while the air is returned to the indoor vacuum to return to normal atmospheric pressure.

 

During cleaning, in the vacuum environment of vacuum chamber controlled by vacuum pump, the gas flow determines the luminance chroma: if the color is heavy, it means that the vacuum degree is low and the gas flow is large; If it is white, it means high vacuum and low gas flow. The specific needs according to the need of the treatment effect to determine the vacuum pump to achieve the vacuum degree.

 

As a kind of precision dry cleaning equipment, vacuum plasma cleaning machine manufacturers mainly used for cleaning hybrid integrated circuit, monolithic integrated circuit shell and ceramic substrate; It is suitable for precise cleaning of semiconductor, thick film circuit, component before packaging, silicon wafer after etching, vacuum electronics, connector and relay, etc. It can remove organic matter and oxide layer such as grease and oil on metal surface. It can also be used for surface activation of plastics, rubber, metals, ceramics, and life science experiments.

vacuum plasma cleaning machine

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