Designed for surface cleaning and modification in the semiconductor IC/package field, and can be used to process various electronic materials, including plastic, metal, glass, etc.
Surface cleaning and modification in the field of semiconductor IC
Surface cleaning, de-drilling and activation of printed circuit board industry
Surface roughening, etching, and activation in the fields of silica gel, plastics, and polymers
Surface modification and cleaning in the automotive electronics industry
Surface cleaning in the aviation industry