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<span class="bt">Vacuum plasma processing system</span><br><span class="ms">Vacuum plasma processing system</span>

Vacuum plasma processing system

Designed for surface cleaning and modification in the semiconductor IC/package field, and can be used to process various electronic materials, including plastic, metal, glass, etc.


Surface cleaning and modification in the field of semiconductor IC
Surface cleaning, de-drilling and activation of printed circuit board industry
Surface roughening, etching, and activation in the fields of silica gel, plastics, and polymers
Surface modification and cleaning in the automotive electronics industry
Surface cleaning in the aviation industry
<span class="bt">Fully automatic On-Line AP plasma processing system</span><br><span class="ms">Vacuum plasma processing system</span>

Fully automatic On-Line AP plasma
processing system

AP wide-format plasma cleaning machine is suitable for FPC&PCB surface treatment, surface treatment of composite materials, glass, ITO, panels and other industries.


Processing temperature can be ≤35℃
Flexible On-Line installation method
The energy of electrons and ions can reach more than 10eV
The efficiency of material batch processing can be more than 10 times higher than that of low-pressure glow discharge devices
<span class="bt">Jet type AP plasma processing system</span><br><span class="ms">Vacuum plasma processing system</span>

Jet type AP plasma processing system

It is specially designed for installation on the production line and is suitable for efficient cleaning, activation and coating of touch screen, glass, metal, plastic, textile, recycled or composite materials.


Surface treatment and modification of consumer electronics
LCD panel surface cleaning and modification
FPC&PCB surface cleaning and activation
Surface cleaning of aerospace electrical connectors in the defense industry
Screen printing and transfer printing pretreatment for general industry

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Recommended Products

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Consumer electronics industry

Most products have organic or inorganic contaminants on the surface, which will affect the quality of the product during subsequent processing, especially when bonding, printing, and laminating processes are required. At this time, plasma is required for surface cleaning.

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New energy industry

Such as: 1. The glass substrate removes surface contaminants and greatly improves the hydrophilicity of the workpiece surface; 2. The surface modification of the ITO anode can improve the photovoltaic performance of the device; 3. By using plasma technology, the surface of the silicon wafer can be activated and greatly improved Its surface adhesion.

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Automotive Manufacturing

With the development of economy, consumers have higher and higher requirements for automobile performance, such as automobile appearance, operating comfort, reliability, and durability. In order to meet the requirements of consumers, automakers pay more attention to detail optimization and improvement when producing cars.

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Semiconductor chip industry

Plasma treatment on the surface of the chip and the package substrate can effectively increase its surface activity, greatly improve the fluidity of the bonding epoxy resin on its surface, improve the bonding wettability of the chip and the package substrate, and reduce the chip and substrate Layering, improving thermal conductivity, improving the reliability and stability of IC packaging, and increasing product life.

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Medical industry

For example, the coronary artery stent used in interventional therapy should be coated with anti-coagulation and anti-epidermal proliferation materials after plasma cleaning.

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Heavy industry

Such as: 1. The lithium battery separator industry has improved the surface characteristics of the material through plasma treatment and greatly improved the battery performance; 2. The aerospace connector has improved the surface characteristics of the material through plasma treatment and greatly improved the battery performance; enhanced its surface activity to make The bonding effect is significantly improved.

Heavy industry

Used in the treatment of battery separators to improve alkali absorption and hydrophilicity. The battery separators are all polymer materials with weak polarity. It is difficult for molecules to penetrate. After plasma treatment, the surface characteristics of the material are improved, and the battery performance is greatly improved.
2020-06-10 0

Medical industry

Urinary catheters have brought good news to patients who need indwelling urinary catheters, and are used more and more clinically. However, with the increase in their applications, the difficulty of catheter removal has become more and more common. Especially for long-term indwelling urinary catheters, sometimes due to the aging of the rubber, the balloon lumen will be blocked, and it may cause serious complications when forcibly removed. In order to prevent the aging of the surface of silicone rubber in contact with the human body, oxygen plasma treatment is required on the surface.
2020-06-10 0

Semiconductor chip industry

The bonding between the chip and the package substrate is often two materials with different properties. The surface of the material is usually hydrophobic and inert, and its surface bonding performance is poor. The interface is prone to voids during the bonding process. After sealing and packaging The chip brings great hidden dangers. Plasma treatment on the surface of the chip and the package substrate can effectively increase the surface activity, greatly improve the fluidity of the bonding epoxy resin on the surface, and improve the adhesion of the chip and the package substrate. Junction wettability reduces the delamination between the chip and the substrate, improves the thermal conductivity, improves the reliability and stability of the IC package, and increases the life of the product.
2020-06-10 0

Automotive Manufacturing

With the development of economy, consumers have higher and higher requirements for automobile performance, such as automobile appearance, operating comfort, reliability, and durability. In order to meet the requirements of consumers, automakers pay more attention to detail optimization and improvement when producing cars, such as
2020-06-10 0

New energy industry

Using plasma technology to bombard the surface of the material can effectively remove surface contaminants and greatly improve the hydrophilicity of the workpiece surface. The angle of the water droplets after cleaning is less than 5 degrees, laying a good foundation for the next process.
2020-06-10 0

Consumer electronics industry

Used to clean Wafer and remove surface photoresist. It has a high degree of uniformity and a stable etching rate.
2020-07-28 0
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ABOUT

Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd. (CRF plasma machine) is a high-tech enterprise integrating R&D, manufacturing and sales. The company has established plasma division; surface treatment division; metal stamping division; sheet metal division; precision metal mold division; painting division. Products are widely used in communications; automobiles; home appliances; textiles; aerospace; bioengineering; precision manufacturing and other industries. The company adheres to the spirit of integrity, hard work, and innovation, based on China and facing the world.

News Center

2022
01-19

Chengfeng Zhizao Plasma introduces the importance of ethylene as a chemical raw material for industrial development

Chengfeng Zhizao Plasma introduces the importance of ethylene as a chemical raw material for industrial development: The mixed gas of methane and ethane widely exists in natural gas, oilfield gas, refinery gas and catalytic cracking gas, and the relative content of ethane is small. Separating and purifying methane and ethane and then utilizing them separately is costly. Without separation, directly using methane containing part of ethane as raw material to carry out the conversion reaction is a practical need from many occasions. The proven oil reserves in my country are 2.27×1017t and the natural gas reserves are 1.97×1021 m3. With the continuous development and utilization of the above resources, the amount of ethane in natural gas, oilfield gas, refinery gas and catalytic cracking gas will increase sharply. . Therefore, it is necessary to carry out the research on the ethane conversion reaction, which is of great significance for the rational utilization of ethane. As an important organic chemical raw material, ethylene is one of the symbols to measure the development level of a country's chemical industry. As we all know, the production of ethylene from ethane has always been one of the main processes of petrochemical industry. The traditional method is high-temperature cracking and dehydrogenation, which is a strong endothermic process. It not only requires high temperature (generally higher than 850 °C), but also needs to be carried out under negative pressure (adding a large amount of superheated steam for dilution), which consumes a lot of energy. , the operation is complicated, and the product separation is very difficult. If catalytic dehydrogenation is used, the reaction temperature can be lower than that of pyrolysis dehydrogenation, but it still has its limitations and is not sufficiently competitive. Moreover, with the continuous depletion of petroleum resources, the potential for preparing raw material ethylene from petroleum is nearly exhausted, and it is difficult to compete with petrochemicals economically from coal, and the oxidative dehydrogenation of gaseous alkanes is a realistic and effective way to fill this gap. way. Under the situation of increasingly tight energy supply, further efficient utilization of gaseous carbon resources has important strategic significance.
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2022
01-16

Surface modification of bamboo powder/PETG composites by low temperature plasma treatment technology

Surface modification of bamboo powder/PETG composites by low temperature plasma treatment technology: Wood-plastic composite material is a composite material made of thermoplastics and bamboo fibers with a small amount of chemical additives and fillers and other auxiliary agents, through a special composite method, and has the dual characteristics of plastic and bamboo, that is, it has the following Advantages: good acid and alkali resistance, chemical resistance, salt water resistance, can be used at low temperature, UV resistance, no rot, no cracking or warping and other mechanical properties, low price, long service life, easy to shape, easy to process , recyclable, no formaldehyde and other harmful gas release, etc., has been widely used in automobile manufacturing, construction, transportation, packaging and other fields. However, due to the poor wettability and poor adhesion of the surface of the bamboo-plastic composite material, the bonding process on the surface is greatly affected. In order to improve the wettability of the material surface, the ideal modification method is low temperature plasma treatment technology. Plasma is an ionized gas-like substance", containing electrons, positive ions and neutral particles, a high-energy aggregate of various particles. Plasma is divided into high-temperature plasma and low-temperature plasma according to temperature. Usually, low temperature plasma Plasma treatment techniques are used for the modification of material surfaces. The energy of the active particles in the plasma of low temperature plasma treatment technology is generally close to or exceeds the bond energy of C-C or other carbon bonds, which will modify the surface of the composite material and cause complex physical and chemical changes on the surface of the material, such as Etching, cross-linking, etc. to improve the contact angle and surface energy of the polymer surface. The increase of plasma discharge power of low temperature plasma treatment technology increases the number of active particles in the plasma atmosphere, the energy increases, the etching effect of active particles on the surface of the sample is strengthened, the contact angle of the surface of the sample decreases, and the surface of the sample decreases. Wetting is improved. With the increase of the discharge power, the contact angle of the sample surface increases with the increase of the discharge power. As the treatment time increases, the thickness of the oxide layer increases and the polarity of the oxygen-containing functional groups increases. After low-temperature plasma treatment of the sample, the water absorption rate of the sample increases with the increase of the low-temperature plasma discharge power; after the low-temperature plasma treatment of the sample, the water absorption rate of the sample decreases with the increase of the low-temperature plasma discharge power . This is because after the low-temperature plasma treatment technology plasma treats the sample, increasing the low-temperature plasma discharge power will promote the conversion of inactive particles inside the low-temperature plasma into active particles with higher energy that are easy to participate in the reaction, which is beneficial to the low-temperature plasma. The reaction between the body and the surface of the sample increases the oxygen content on the surface of the sample, the number of polar oxygen-containing functional groups increases, and the water absorption rate increases. With the further increase of the power, the energy obtained by the active particles from the electric field increases, and the probability of the particles colliding with each other increases, resulting in the loss of particle energy and the weakening of the molecular interaction between the active particles and the sample surface, resulting in wetting. The relative decline of the property, the water absorption rate decreased. This is because with the increase of treatment time, the number of polar oxygen-containing functional groups introduced on the surface of the sample increases, and the surface polarity increases. Low-temperature plasma treatment technology After plasma treatment, the amount of -COC on the surface of the sample increases, but with the increase of low-temperature plasma treatment time, the amount of -COC on the surface gradually decreases. The oxide layer thickens, and the attractive -COC on the surface of the sample is further oxidized to -C=O.
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2022
01-14

Pipe and wire plasma cleaning machine surface treatment to improve the surface tension of non-polar plastics

Pipe and wire plasma cleaning machine surface treatment to improve the surface tension of non-polar plastics: The tube wire has a low surface tension, which can adhere well to the paint surface. Surface tension can be maximized in many cases (in fact all cases) to achieve the desired adhesion by using plasma cleaning machine surface treatments. Scenarios for plasma surface activation and cleaning of pipes and wires: The surface of the material is activated by plasma cleaning using an oxygen plasma cleaner and then the plastic wires are etched. This can increase their surface energy. When cleaning the pipe, it is important to increase the surface area, which promotes good bonding. Plasma surface cleaning and activation process: The effect of oxygen plasma on the surface tension of non-polar plastics is obvious. The reason is that, due to the high reactivity of oxygen radicals, polar bonds are formed, which constitute the adhesion points of the coating liquid. In this way, the surface tension is increased, wetting is accelerated and the adhesion is improved.
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2022
01-20

Pure ethane can undergo dehydrogenation reaction under the action of plasma plasma at low temperature and atmospheric pressure

Pure ethane can undergo dehydrogenation reaction under the action of plasma plasma at low temperature and atmospheric pressure: Under atmospheric pressure pulsed corona plasma conditions, the conversion rate of C2H6 and the yield of C2H2 increased with the increase of energy density, the yield of C2H4 increased slightly, but the yield of CH4 did not change much with the increase of plasma energy density. When the plasma energy density was 860 kJ/mol, the conversion of C2H6 was 23.2%, and the sum of the yields of C2H4 and C2H2 was 11.6%. It is generally believed that in a flow plasma reactor, when the flow rate of the reactant gas is constant, the high-energy electron density and its average energy in the system are mainly determined by the plasma energy density. The plasma power increases, the high-energy electron density and its average energy in the system increase, the elastic and inelastic collision probability between high-energy electrons and C2H6 molecules and the transmitted energy increase, and the CH bond and CC bond of C2H6 are more likely to break, and their breakage increases. The concentration of the free radicals formed also increases, and the probability of the free radicals to form products by recombination also increases. Therefore, the conversion rate of C2H6 and the yield of C2H2 tend to increase with the increase of plasma power. The insignificant upward trend of C2H4 yield and CH4 yield with the increase of plasma injection power may be related to the fact that C2H4 and CH4 are the primary reaction products of the reaction, and C2H2 is more stable. Chemical bond Dissociation energy/(kJ/mol) Dissociation energy/(eV/mol) CH3—CH3 367.8 3.8 C2H5—H 409.6 4.2 CH2=CH2 681.3 7.1 C2H3—H 434.7 4.5 CH≡CH 964.9 10.0 C2H—H 501.7 5.2 The main gas phase products of the conversion reaction of pure C2H6 under plasma conditions are: C2H4, C2H2, H2 and CH4, and the solid product is carbon deposition. In order to explore the possible mechanism of the conversion of pure ethane under the action of plasma, the conversion of pure ethylene was investigated under the same plasma conditions. The main products of the reaction were: C2H2, CH4 and a small amount of carbon deposits. According to the above experimental facts, combined with the mechanism of methane conversion reaction and plasma characteristics under the action of plasma, it is speculated that the process of C2H6 conversion reaction under plasma conditions is as follows. (1) The plasma field produces high-energy electrons. The free electrons are accelerated under the action of the electric field E to generate high-energy electrons e*: e + E → e* (3-26) (2) Initiates a free radical reaction. High-energy electrons collide elastically and inelastically with ethane molecules. Depending on the energy of the high (3-26) energy electrons, the collision leads to an increase in the kinetic energy or internal energy of the ethane molecule, which breaks the C-H and C-O bonds of ethane to generate various free radicals: C2H6 + e* → C2H5 + H + e (3-27) C2H6 + e* → 2CH3 + e (3-28) According to the chemical bond dissociation energy data in Table 3-1, the reaction formula (3-28) (C-C bond breaking) is more than the reaction Equation (3-27) (C-H bond cleavage) is easier to carry out. (3) Chain transfer reaction: H + C2H6 → C2H5 + H2 (3-29) CH3 + C2H6 → C2H5 + CH4 (3-30) CH3 + e* → CH2 + H (3-31) CH2 + e* → CH + H (3-32) CH + e* → C + H (3-33) (4) Chain termination reaction: CH3 + H → CH4 (3-34) CH2 + CH2 → C2H4 (3-35) CH3 + CH → C2H4 (3-36) CH + CH → C2H2 (3-37) Under the low temperature and normal pressure, pure ethane can undergo dehydrogenation reaction under the action of plasma to generate acetylene, ethylene, a small amount of methane and carbon deposits, but there are problems such as low conversion rate and the formation of carbon deposits on the reactor wall. According to the ethane dehydrogenation reaction mechanism under chemical catalytic conditions, for the ethane dehydrogenation reaction under plasma conditions, the CH bond of ethane is preferentially broken to form C2H5 radicals, and the C2H5 radicals are further dehydrogenated to ethylene. Key pathways for hydrogen reactions in practical applications. Therefore, the effect of the added gas and plasma on the ethane dehydrogenation reaction is particularly important.
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2022
01-17

The effect of atmospheric plasma discharge voltage on the conversion reaction of plasma CH4 to H2

The effect of atmospheric plasma discharge voltage on the conversion reaction of plasma CH4 to H2: With the increase of the discharge voltage, the conversion rate of methane and the yield of C2 hydrocarbons showed an upward trend, and the selectivity of C2 hydrocarbons increased first and then decreased. When the atmospheric plasma discharge voltage was 16 kV, the selectivity of C2 hydrocarbons was large. According to literature reports, the emission intensity changes of CH active species under low temperature atmospheric plasma conditions are directly affected by the working pressure and discharge parameters. The degree of methane cracking in the plasma can be detected by the strength of the CH active species. Because the intensity of the same spectral line is proportional to the particle density of the component, the relative intensity of the spectral line can be inferred from the change of each process parameter. The number of particles varies with the corresponding process parameters. With increasing discharge voltage, the emission intensity of atmospheric plasmaCH active species increases with the increase of discharge voltage. The reason is that under the condition of constant gas flow rate, the energy obtained by the electrons accelerated by the electric field is low when the input voltage is low, and the total collision cross-sectional area in the low-energy state is also low, and the collision probability between CH4 and high-energy electrons is small, so This results in fewer active species being generated. With the increase of the discharge voltage, the ionization rate and electron density increase, and the cross-section of the collision between high-energy electrons and CH4 also increases, which means that the collision probability increases and the generated CH active species increase. It was also noticed that the coke deposits on the reactor walls increased with increasing voltage during the experiment.
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2022
01-12

The performance of the modified catalyst by low temperature plasma treatment on Ni/Al2O3 catalyst for CO2 reforming methane

The performance of the modified catalyst by low temperature plasma treatment on Ni/Al2O3 catalyst for CO2 reforming methane: Low-temperature plasma is a system in a thermodynamically non-equilibrium state and has important applications in the field of catalysts. Plasma treatment has the performance of Ni/Al2O3 catalyst for catalyzing CO2 reforming methane. The catalyst surface after plasma treatment and then roasting has high low-temperature catalytic activity and strong anti-carbon deposition ability. Compared with conventional catalysts, the catalyst is prepared by plasma technology, and the dispersion of metal active species of the catalyst is obviously improved, and the catalyst activity is increased. Low-temperature plasma can be effectively used to directly synthesize ultrafine particle catalysts, improve the dispersion of catalyst active components, catalyst surface treatment, precipitation of active components into the matrix, and synergistic effect of catalysts, etc. The catalyst prepared or treated by low temperature plasma has the advantages of large specific surface area and fast reduction rate, thereby improving the catalytic activity of the catalyst. After the low temperature plasma modification, the structure of the solid base catalyst was changed in a friendly manner, the catalytic activity of the catalyst was effectively improved, and the thiol conversion rate was significantly improved. The morphology and particle size of the modified catalysts changed significantly. Compared with the unmodified catalyst, the treated catalyst has obvious particles, but part of it is still amorphous. Plasma-treated catalyst particles are distinct but non-uniform in particle size. The plasma-treated catalyst particles are elliptical and spherical, with uniform size and good dispersion, large porosity and no agglomeration. After the low temperature plasma modification, the average particle size of the catalyst components was reduced, and the particle dispersion of the catalyst was significantly improved. Activated carbon has the advantages of large adsorption capacity, good chemical stability, large specific surface area and large pores, etc. It can be used to adsorb mercaptans in air and liquid phase, and is a suitable catalyst carrier for desulfanization. The use of low-temperature plasma technology can destroy the original crystal structure of the catalyst and generate more holes to improve the activity of the catalyst. The specific surface area of ​​the low-temperature plasma-modified catalyst increases, and the number of micropores increases. Since it is the micropores that determine the adsorption of thiols, and the adsorption capacity also depends on the micropores, the modification of the low-temperature plasma can make the catalyst more active and the conversion rate of thiols higher. Under the action of plasma, a small amount of H2O and CO2 covered by the basic center of the catalyst are further removed, thereby reducing the possibility of reacting with MgO, and the basic center of the catalyst is exposed and enriched on the surface of the catalyst, which is beneficial to improve the reduction performance of the catalyst and adsorption performance, thereby improving catalyst activity.
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Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd.

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TEL:0755-3367 3020 / 0755-3367 3019

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E-mail:sales-sfi@sfi-crf.com

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ADD:Mabao Industrial Zone, Huangpu, Baoan District, Shenzhen