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<span class="bt">Vacuum plasma processing system</span><br><span class="ms">Vacuum plasma processing system</span>

Vacuum plasma processing system

Designed for surface cleaning and modification in the semiconductor IC/package field, and can be used to process various electronic materials, including plastic, metal, glass, etc.


Surface cleaning and modification in the field of semiconductor IC
Surface cleaning, de-drilling and activation of printed circuit board industry
Surface roughening, etching, and activation in the fields of silica gel, plastics, and polymers
Surface modification and cleaning in the automotive electronics industry
Surface cleaning in the aviation industry
<span class="bt">Fully automatic On-Line AP plasma processing system</span><br><span class="ms">Vacuum plasma processing system</span>

Fully automatic On-Line AP plasma
processing system

AP wide-format plasma cleaning machine is suitable for FPC&PCB surface treatment, surface treatment of composite materials, glass, ITO, panels and other industries.


Processing temperature can be ≤35℃
Flexible On-Line installation method
The energy of electrons and ions can reach more than 10eV
The efficiency of material batch processing can be more than 10 times higher than that of low-pressure glow discharge devices
<span class="bt">Jet type AP plasma processing system</span><br><span class="ms">Vacuum plasma processing system</span>

Jet type AP plasma processing system

It is specially designed for installation on the production line and is suitable for efficient cleaning, activation and coating of touch screen, glass, metal, plastic, textile, recycled or composite materials.


Surface treatment and modification of consumer electronics
LCD panel surface cleaning and modification
FPC&PCB surface cleaning and activation
Surface cleaning of aerospace electrical connectors in the defense industry
Screen printing and transfer printing pretreatment for general industry

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Recommended Products

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Consumer electronics industry

Most products have organic or inorganic contaminants on the surface, which will affect the quality of the product during subsequent processing, especially when bonding, printing, and laminating processes are required. At this time, plasma is required for surface cleaning.

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New energy industry

Such as: 1. The glass substrate removes surface contaminants and greatly improves the hydrophilicity of the workpiece surface; 2. The surface modification of the ITO anode can improve the photovoltaic performance of the device; 3. By using plasma technology, the surface of the silicon wafer can be activated and greatly improved Its surface adhesion.

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Automotive Manufacturing

With the development of economy, consumers have higher and higher requirements for automobile performance, such as automobile appearance, operating comfort, reliability, and durability. In order to meet the requirements of consumers, automakers pay more attention to detail optimization and improvement when producing cars.

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Semiconductor chip industry

Plasma treatment on the surface of the chip and the package substrate can effectively increase its surface activity, greatly improve the fluidity of the bonding epoxy resin on its surface, improve the bonding wettability of the chip and the package substrate, and reduce the chip and substrate Layering, improving thermal conductivity, improving the reliability and stability of IC packaging, and increasing product life.

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Medical industry

For example, the coronary artery stent used in interventional therapy should be coated with anti-coagulation and anti-epidermal proliferation materials after plasma cleaning.

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Heavy industry

Such as: 1. The lithium battery separator industry has improved the surface characteristics of the material through plasma treatment and greatly improved the battery performance; 2. The aerospace connector has improved the surface characteristics of the material through plasma treatment and greatly improved the battery performance; enhanced its surface activity to make The bonding effect is significantly improved.

Heavy industry

Used in the treatment of battery separators to improve alkali absorption and hydrophilicity. The battery separators are all polymer materials with weak polarity. It is difficult for molecules to penetrate. After plasma treatment, the surface characteristics of the material are improved, and the battery performance is greatly improved.
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Medical industry

Urinary catheters have brought good news to patients who need indwelling urinary catheters, and are used more and more clinically. However, with the increase in their applications, the difficulty of catheter removal has become more and more common. Especially for long-term indwelling urinary catheters, sometimes due to the aging of the rubber, the balloon lumen will be blocked, and it may cause serious complications when forcibly removed. In order to prevent the aging of the surface of silicone rubber in contact with the human body, oxygen plasma treatment is required on the surface.
2020-06-10 0

Semiconductor chip industry

The bonding between the chip and the package substrate is often two materials with different properties. The surface of the material is usually hydrophobic and inert, and its surface bonding performance is poor. The interface is prone to voids during the bonding process. After sealing and packaging The chip brings great hidden dangers. Plasma treatment on the surface of the chip and the package substrate can effectively increase the surface activity, greatly improve the fluidity of the bonding epoxy resin on the surface, and improve the adhesion of the chip and the package substrate. Junction wettability reduces the delamination between the chip and the substrate, improves the thermal conductivity, improves the reliability and stability of the IC package, and increases the life of the product.
2020-06-10 0

Automotive Manufacturing

With the development of economy, consumers have higher and higher requirements for automobile performance, such as automobile appearance, operating comfort, reliability, and durability. In order to meet the requirements of consumers, automakers pay more attention to detail optimization and improvement when producing cars, such as
2020-06-10 0

New energy industry

Using plasma technology to bombard the surface of the material can effectively remove surface contaminants and greatly improve the hydrophilicity of the workpiece surface. The angle of the water droplets after cleaning is less than 5 degrees, laying a good foundation for the next process.
2020-06-10 0

Consumer electronics industry

Used to clean Wafer and remove surface photoresist. It has a high degree of uniformity and a stable etching rate.
2020-07-28 0
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ABOUT

Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd. (CRF plasma machine) is a high-tech enterprise integrating R&D, manufacturing and sales. The company has established plasma division; surface treatment division; metal stamping division; sheet metal division; precision metal mold division; painting division. Products are widely used in communications; automobiles; home appliances; textiles; aerospace; bioengineering; precision manufacturing and other industries. The company adheres to the spirit of integrity, hard work, and innovation, based on China and facing the world.

News Center

2021
04-24

Small vacuum plasma cleaning machine vacuum plasma cleaning surface material modification

Small vacuum plasma cleaning machine vacuum plasma cleaning surface material modification Small vacuum plasma cleaning machine can improve the adhesion of the material surface, improve the adhesion performance of the material, solve the problem of adhesion. The effect of vacuum plasma cleaning is very obvious when the contact Angle is measured during the actual operation, and the uniform and thorough adhesion of material modification is improved. Small vacuum plasma cleaning machine is a method to improve the surface adhesion, improve the bonding properties of materials, and solve the problem of bonding. A lot of materials in the factory, originally rely on the corona treatment effect, but the effect of plasma treatment is far better than ordinary treatment. Small vacuum plasma cleaning machine Equipment parameters of vacuum plasma cleaning machine: Customized cavity plasma cleaners from 2 litres to 23 litres or more are available. Here we focus on small vacuum plasma cleaners. The equipment uses a temperature control system to ensure that heat/humidity sensitive materials are not damaged. Can be processed on any product, different products after the actual treatment of the effect is not the same, specific through the contact Angle tester hydrophilicity test, through a large number of tests we found that almost all materials after plasma treatment, hydrophilicity has changed to different degrees. Oxygen argon plasma and hydrogen plasma cleaning: Using different types of gases (oxygen, argon, nitrogen, hydrogen, helium, etc.), small vacuum plasma cleaners can change a variety of properties of the substrate surface. This includes but is not limited to: 1. Improvement of surface tension/surface energy/contact Angle characteristics. 2, improve the adhesion of the surface. 3. Hydrogen plasma is very effective in removing oxides from glass or metal products. 4. Change the wettability of the surface to produce hydrophilicity or hydrophobicity (increase or decrease the adhesion of the liquid)- for pretreatment, coating and coating. 5, coating process: adhesion, wettability, corrosion resistance and wear resistance, electrical conductivity and insulation, magnetic induction, reflective/reflective, anti-microbial, scratch resistance, waterproof, coloring, etc. Plasma activation refers to the treatment of a polymer to improve its ability to be coated or printed. This is done by oxidizing the outer layer of the polymer using an oxygen plasma. Argon is often used in easily oxidized metals. This can not only produce cleaning products, but also increase the polarity, directly improve the printing and coating performance of polymer products, oxygen plasma is also activated by plasma.
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2021
04-22

Plasma etching solutions for two-dimensional materials in integrated circuits

In recent years, there are many two-dimensional materials similar to graphene that have been discovered and studied. Due to its ultra-high mobility, people have paid wide attention to them, such as molybdenum sulfide, black phosphorus, silicon, tungsten selenide and so on. The common characteristics of this kind of two-dimensional materials are: ① is a layered structure, all atoms are located in one or two planes. These materials can form two-dimensional electron-gas transport in the two-dimensional direction, which enables them to have very high mobility in the undoped state, and the threshold voltage is very small. The device does not need to use the reverse region to operate, and does not need to use deep Wells to limit leakage and migration. These advantages will save a lot of plasma doping process for chip processing and greatly save the cost. The difficulty, of course, is finding the right dielectric layer and metal electrode; Predictably, once such materials are used in chip manufacturing, how to improve the contact resistance becomes a whole new problem. ② At present, such materials are not widely available. This kind of two-dimensional material has high activity, rigidity and easy fracture. At the beginning of the study are dispersed by ultrasonic material plasma in benign solvent in the monolayer or multilayer structure, the method of material area is not too big, but with the in-depth study and industrial demand, this kind of material is expected to the growth of large area, only need to explore the substrate material and the growth conditions. (3) Such materials often do not have band structure or very narrow band, which leads to their high activity, easy to capture or release charge. In industry this makes the process more difficult. The thermal conductivity and hardness are also good, and often have the characteristics of the dominant direction of heat conduction and the dominant direction of electrical transmission is different. ⑤ in the direction of the vertical two-dimensional surface conductivity is very low, even insulation. The above characteristics of these materials are both high performance and low practicability characteristics, but there is no doubt that every shortcomings to overcome will make it a step forward in the use of the road, will also bring great commercial value. The etching of these materials is generally difficult, because they are characterized by strong activity, small volume and extremely thin thickness of the target material. It is difficult to control the etching parameters when using strong chemical etching plasma etching. It's obviously not a good idea to use a high-energy plasma, because that would damage the film. At present, there is no mature etching technology to carry out patterning. According to the development of etching technology in recent years, the increasingly mature atomic layer etching or remote plasma etching technology is expected to solve the etching problem of this kind of material. Atomic layer etching has the characteristic of precise positioning etching quantity, and distal plasma etching is the representative of low damage etching technology. In principle, plasma etching of two-dimensional materials is expected to be solved by it, and of course, it is hoped that other new etching processes will emerge. At present, the semiconductor device processing of these two-dimensional materials is mostly in the laboratory stage. The main method of film formation is to peel the lamellar structure from the bulk material. Most of these 2D materials are highly active and have the characteristics of instability when they meet water and air. With time in the air, the morphology of black phosphorus peel changes constantly, and its thickness also increases. It is formed by the interaction with water and oxygen in the air, and this material property will greatly affect the stability of the device. Large area processing difficulties and harsh stability conditions are two major problems in the industrialization of two-dimensional materials. The above is the CRF plasma etching manufacturer of two-dimensional materials in the application of plasma etching solutions in integrated circuits.
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2021
04-20

Plasma surface processor function to improve the adhesion of material surface

A new type of composite material was prepared by plasma surface processor in two component injection molding. Using plasma surface processor plasma technology, two incompatible materials can be formed in the need to firmly bond to each other to improve the adhesion, which is important is hard and soft adhesive bonding, such as silicone rubber and polypropylene composite. Adopts the split injection molding technology to produce the composite material, not only saves the cost, but also can produce the new product which has the strict special requirement to the material. A two-component injection can be used on the contact surface of body parts. Plasma Pretreatment for Two-component Injection Molding In the process of injection molding, one component material is first injected, and after the injection mold is opened, the plasma surface processor spray gun is used to treat the part that needs to be bonded with the second component material, and through the treatment of one component material, it can achieve reliable bonding with the second component material. Plasma surface processor plasma technology is used to realize the application of different general materials in medical equipment processing.
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2021
05-10

Application of Low Temperature Plasma Technology in Plasma Processor

        Using low-temperature plasma surface treatment technology, using plasma surface activation treatment technology, after laboratory analysis, the plasma processor can obtain a uniform film layer with high performance, high coating rate, and strong permeability on the surface of the material, and can be used in Change its surface adhesion performance in a short time. Low temperature plasma technology         Application of plasma processor in various application fields:         1. Automobile manufacturing industry: EPDM sealing, flocking and coating pretreatment;         2. Plasma activation cleaning of PPPE and other materials: Before spraying, it is necessary to perform low-temperature plasma technology plasma cleaning with cell phone cover, cell phone glass, tempered film, etc., to increase the cleanliness of the product surface, significantly improve the surface activity, and enhance the adhesion effect;         3. Electronics industry: In the production line, plasma processor plasma system processes labels that replace hot melt and diffusion; single-sided pretreated PP film is stable and long-lasting, and can be used for water-based dispersing adhesives; mobile phone plastic shells and moped shells, Pre-treatment of paint;         4. Optoelectronics manufacturing industry: flexible and non-flexible printed circuit board contacts are cleaned, liquid crystal fluorescent tubes "contacts" are cleaned;         5. Metal and coating industry: pretreatment of aluminum profile, plasma processor replaces roughening and primer to obtain a stable oxide layer; aluminum foil deoiling-non-humidity chemical treatment; stainless steel laser welding pretreatment;         6. Chemical fiber and textile industry: Low-temperature plasma technology is used for fiber pretreatment speed up to 60 meters per minute; the glass surface and the surface before mirror bonding are cleaned;         7. Printing and coding industry: Plasma treatment of automatic box gluer can improve the adhesion of UV and film-coated folding cartons, reduce the amount of glue used, and effectively reduce production costs; PP and PE material screen printing, before pad printing Treatment to increase the adhesion of the ink layer; PE, PTFE, silicon rubber wire and cable pre-treatment for coding.
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2021
05-08

Cu surface modification in atmospheric plasma surface treatment system inhibits micro-discharge

Cu surface modification to suppress microdischarge in atmospheric plasma surface treatment system: In power transmission lines, conductors may be damaged during line construction (such as on-site production of cable joints, erection of high-voltage overhead lines, etc.), which is easy to cause serious distortion of local electric field. Under the action of strong field, the air around the conductor will be ionized, and even the electrons in the metal body will be pulled out, thus leading to local micro-discharge. Atmospheric plasma surface treatment system Long-term partial microdischarge is one of the important factors causing insulation failure of transmission lines, which seriously affects the safe and stable operation of transmission lines. Therefore, finding an effective method to suppress the microdischarge caused by microdefects on the surface of conductors has become a research hotspot. The plasma of atmospheric plasma surface treatment system has the advantages of high concentration of highly active particles and low excitation temperature, which has been widely used in many fields. With the rise and development of the subject of material surface modification, the method of using plasma surface modification has been widely concerned. Plasma surface modification uses the energetic active particles in the plasma to bombard the surface of the material and endue the surface with new properties. Since it only acts on the surface, the original bulk properties of the material remain unchanged. It should be pointed out that plasma has no requirement on the substrate material, so it can be used for surface modification of metal materials as well as insulating materials. Atmospheric plasma surface treatment system technology is used to modify insulating materials, fluorine treatment and SiO film deposition, which can effectively regulate the modified groups and improve the insulating properties of materials. After the surface modification of epoxy resin by atmospheric plasma, the surface roughness of the material increases, and the introduction of fluorine-containing groups increases the voltage of the epoxy in vacuum. Plasma jet driven by RF power supply deposited silicon oxide thin films on silicon wafer, using HMDSO and O2 as reaction precursors, the thin films were obtained under favorable treatment conditions by optimizing O2 flow rate and RF power supply. The surface of copper and copper was treated by air dispersion discharge. It was found that the surface hydrophilicity and surface energy of copper and copper were effectively improved by plasma treatment in the atmospheric plasma surface treatment system. Li Wenyao et al. used the method of atmospheric pressure plasma enhanced chemical vapor deposition to deposit SiO2-like insulating film on copper and copper, and made use of the good dielectric properties and high resistivity of the silicon oxide film itself to suppress the occurrence of corona. The work function of metals is the main factor affecting the field emission threshold electric field. With a slight change in the work function, titanium tetrachloride (TiC4) is a common precursor for the preparation of TiO2. TiO2 can be generated through hydrolysis, and the reaction is easy to proceed at room temperature without producing organic waste. Using titanium tetrachlide (TiCl4) as a titanium source, low temperature plasma jet was used to deposit TiO2 films on the surface of copper and copper to change the surface characteristics of the conductor and block the microdefects, so as to inhibit the occurrence of microdischarge. After plasma treatment, the surface work function of Cu wafers is increased from 4.65eV to 4.87eV, the electric field distortion is improved, and the field intensity is reduced from 1.4x106 V/m to 9.89x105V/m. The plasma treatment method can improve the electric field distortion to a certain extent and inhibit the occurrence of local microdischarge.
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2021
05-07

Plasma cleaning machine to improve surface adhesion for enterprise production cost savings

Plasma cleaning machine to improve surface adhesion for enterprise production cost savings Plasma cleaning machine can improve the surface adhesion effect of materials, used for surface activation and surface modification of materials, plasma treatment can be used for a variety of materials: metals, ceramics, composites, plastics, polymers and biomaterials. Plasma cleaning machine Plasma cleaning machine is a kind of surface activation treatment equipment used to improve the surface adhesion effect. It can be used as a good tool to improve the surface hydrophilicity, activation surface and modification surface. Plasma cleaning machine can be widely used in the field of surface engineering, including surface cleaning, surface activation, surface energy etching and bonding surface preparation, surface modification and surface treatment, etc. Polymers and biomaterials are treated by surface activation methods such as activation, grafting and surface coating to improve hydrophilic adhesion. The company's products are designed for enterprise production, laboratory, material research institute and many need adhesive, surface printing enterprise design and manufacture. Major applications include materials science, microfluidics, polymer science, biomedical materials, optics and dentistry, and medical plants, which are environmentally friendly dry cleaning processes that can significantly reduce costs and labor for businesses. Surface treatment of glass before adhesion and other applications by plasma washers: contact Angle measurements of treated glass show that the surface wettability is significantly enhanced. Plasma treatment for microfluidic device manufacturing: Plasma treatment for PDMS contact Angle measurements significantly lower than before. Plasmas treat biomaterials by changing surface wettability and surface modification. The advantage of plasma cleaning is that it does not damage the surface of the material to be treated, and can obtain effective adhesion effect.
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Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd.

Adhere to quality as the foundation, honesty as the way of business, innovation as the source of development, and service as the pinnacle of value

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粤ICP备19006998号
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TEL:0755-3367 3020 / 0755-3367 3019

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E-mail:sales-sfi@sfi-crf.com

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ADD:Mabao Industrial Zone, Huangpu, Baoan District, Shenzhen