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Plasma processor plasma cleaning machine to eliminate the problem of color box opening
Plasma processor plasma cleaning machine to eliminate the problem of color box opening: The color box opening glue processing device adopts the direct injection plasma processor. The plasma cleaning machine produces oxygen-based active substances containing a large number of oxygen atoms during operation. Spraying oxygen-containing plasma onto the surface of the material can separate the organic pollutant carbon molecules attached to the surface of the material into carbon dioxide and then remove it; at the same time, it can effectively improve the surface contact of the material, and improve the strength and reliability. Witnessed by many customers, color boxes made of coated paper, glazing paper, coated paper, aluminized paper, impregnated cardboard, UV coating, OPP, PP, PET, etc. It can be processed with a direct injection plasma processor and is more efficient. The packaging industry is facing ever-increasing demands for good design and quality. Manufacturers are increasingly using glossy printing, soft-touch or holographic to attract customers. At the same time, in order to ensure that there is no friction and moisture during the circulation process. Modern packaging technologies can surface film or polish printed products, and even use composite materials such as PP, PVC, etc. The cleaning of the plasma cleaning machine affects the speed: inconsistent materials, inconsistent processes, inconsistent acceptance criteria, inconsistent distance between the nozzle plasma and the material, plasma power and intake pressure will affect the plasma speed. Usually ask how fast the production line will be able to meet the production requirements, we can not give an accurate answer, depending on the actual needs. The use of direct spraying plasma machine processor can greatly improve the bonding strength, the bonding quality is stable, the product consistency is good, no dust, and the environment is clean. The packaging of medicine, food, etc. meets the hygienic and safety requirements, which is conducive to environmental protection. In order to improve the bonding effect, the traditional methods of partial gluing, partial glazing, surface polishing or cutting paste, mechanical polishing, perforation and special glue are cancelled. It greatly reduces the production cost of the color factory and improves the industrial production efficiency. According to the experience of the majority of users, the plasma cleaning machine can bond mobile phone buttons, mobile phone cases and other surfaces within a range of 2-8 meters, and the general speed is within 2-8 meters; within a range of 5-20 meters, it is processed before sealing and coating. After painting in the range of 2-8 meters, the coating film and the surface of the mobile phone cover are cleaned of organic matter, generally in the range of 2-10 meters, with double gun spraying, spraying in the range of 0.5-1.5 meters, and generally producing in the range of 12-25 meters ;Use the plasma cleaning machine direct-injection nozzle on the folder gluer, coat the film material within 400 meters, slightly slower in the UV glossy box, spray the PVC card with UV ink surface treatment within 110 meters, within 12-25 meters Production; if you need to consult other industrial speed parameters, please contact Chengfeng Zhizao. Chengfeng Zhizao specializes in R&D and production of plasma cleaning machines/plasma processors in batches with favorable prices. Welcome to inquire.
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Plasma stripping cleaning machine stripping etching process processing glass cover cleaning
Plasma stripping cleaning machine stripping etching process processing glass cover cleaning: Today, when 5G communication technology is fully moving towards the 5G era, high-frequency 5G signals impose strict requirements on the signal transmittance of mobile phone materials. China's 5G commercial network will be put into operation in many cities in China. Since metal casings will block 5G signals, manufacturers are switching to non-metallic materials such as plastic, glass, ceramics, sapphire and other non-metallic materials to make mobile phone casings. In order to make the shell more beautiful and more powerful, various coating processes have followed the trend, and the manufacturer's stripping requirements for plasma stripping cleaning machines are becoming more and more strict. Glass cover coating, also known as glass cover spraying, is suitable for the 5G industry, covering mobile phone cover coating, glass cover, display coating, protective layer, optical material coating, etc. Like makeup, paint can be used both to change your image and to make yourself more beautiful. It can make the glass cover and bottom plate more beautiful, and also has the functions of anti-fingerprint, anti-glare, anti-ultraviolet, acid and alkali resistance, and anti-oxidation. For the glass case of the mobile phone, in order to realize the function and decorate the glass case on the front and back of the mobile phone, a variety of coating processes are used. Coating processing is a very delicate process, which has high requirements on the cleanliness of the substrate surface. Any tiny dirt, oil stains, fingerprints, water vapor, solid particles, etc., will cause trachoma, discoloration, and oil spots on the coating. and other adverse phenomena. When the quality of the coating is not good, it is necessary to reprocess the defective coating by stripping. At present, the plasma stripping cleaning machine process and stripping solution are still the mainstream of stripping. Compared with the stripping solution, the plasma etching stripping process has its advantages mainly in three aspects, namely the advantages of plasma surface treatment. Plasma stripping cleaning machine stripping is an environmentally friendly process, without any waste gas, waste liquid and other pollutants. Compared with expensive stripping solutions, stripping of plasma processors can only consume electricity. A single plasma surface treatment machine, once per hour, greatly reduces the cost. The stripping of the plasma stripping cleaning machine is through the plasma glow reaction to ensure that the high-density, low-temperature plasma obtains a better surface activation effect. Clean the surface organic matter, resin, dust, oil, impurities, etc., and increase the surface energy. The surface of the material is roughened by modification, the surface protrusion after etching is increased, and the surface area is increased. The oxygen-containing polar groups, such as hydroxyl, carboxyl and other active molecules are introduced. A plasma cleaning machine is used for strip surface treatment, which can effectively remove defective coatings. It is used for the rework of defective industrial coatings such as glass cover plates, display touch screens, protective sheets, optical materials, electronic circuits, etc. For spraying processes such as AF, AS, AG, AR, etc., a plasma pretreatment device (generally low temperature and atmospheric pressure rotary spraying, etc.) is used to perform fine pretreatment cleaning, etching and activation on the surface of the substrate, and a very thin high tension can be obtained. The surface of the coating is conducive to the strong bonding force of the spraying liquid and the uniform thickness. For spraying processes such as AF, AS, AG, AR, etc., a plasma pretreatment device (generally low temperature and atmospheric pressure rotary spraying, etc.) is used to perform fine pretreatment cleaning, etching and activation on the surface of the substrate, and a very thin high tension can be obtained. The surface of the coating is conducive to the strong bonding force of the spraying liquid and the uniform thickness. The plasma surface treatment machine for stripping is a product equipped with a rotary nozzle plasma surface treatment machine, which needs to be stripped on the assembly line through sliding table, reciprocating motion, cleaning and stripping. According to production capacity requirements, customers can customize assembly lines of different specifications, with 1, 2, 4 plasmas and other quantities for a single machine. AF----Anti-fingerprint is anti-fingerprint in Chinese. AF plasma coating machine is also known as AF spraying machine, AF plasma spraying machine, anti-fingerprint and so on. Anti-Smudge means anti-fouling in Chinese. AS plasma coating machine is also known as AS plasma coating machine, oil-proof plasma coating machine, spraying machine, etc. AG----anti-glare, Chinese called anti-glare, also called AG pla
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Plasma surface treatment of modified nanoparticles increases interfacial area in composite films
Plasma surface treatment of modified nanoparticles increases interfacial area in composite films: Due to its excellent dielectric properties, polyimide film has been widely used in variable frequency speed regulation traction motors as a basic insulating material for inter-turn insulation and ground insulation. Studies have shown that high-energy particles and thermal effects generated by corona discharge will damage the organic polymer structure and promote the degradation of polyimide, which is the fundamental cause of the insulation failure of inverter motors. Adding nanoparticles as fillers to polymers will bring special electrical properties to insulating materials, such as high dielectric constant, low loss, and corona resistance. key to performance. However, due to their large specific surface energy, nanoparticles will agglomerate in insulating materials, which greatly reduces the nano-effect. Surface modification of nanoparticles can improve the compatibility of nanoparticles with the matrix and reduce the amount of nanoparticles. Agglomeration to improve the interfacial area between nanoparticles and polymer matrix. Therefore, it is of great significance to study the influence mechanism of the surface modification of nanoparticles on the corona resistance of polyimide nanocomposite films. At present, chemical methods are generally used to modify the surface of nanoparticles, which can improve the electrical properties of nano-dielectrics to a certain extent, but scholars at home and abroad are still exploring methods to further improve the properties of insulating materials. In recent years, low temperature plasma technology has been widely used in the surface modification of polymer materials. Plasma treatment of nanoparticles only changes their surface properties without affecting their own properties, the treatment process is simple, no chemical solvent is required, and the treatment effect is good. Under the action of plasma, a large number of active groups such as hydroxyl (-OH) will be generated on the surface of the nanoparticles, which will react with the silanol bonds generated by the hydrolysis of the silane coupling agent to form hydrogen bonds. After plasma treatment of the surface of the nanoparticles, a strong absorption peak appeared there, indicating that a good interaction was formed between the silane coupling agent and the nanoparticles, and a large amount of the silane coupling agent was coated on the surface of the nanoparticles. The absorption peaks of the nanoparticles treated with plasma and those without plasma treatment were basically the same, indicating that the plasma treatment did not change the chemical bonds of the nanoparticles themselves. Using plasma to treat the surface of nanoparticles can effectively improve the coupling effect of nanoparticles and silane coupling agent, thereby improving the dispersion characteristics of nanoparticles in polyimide composite films and increasing the interface between nanoparticles and polymer matrix area. The adhesive layer is closely connected with the organic and inorganic two phases through the silane coupling agent, and has strong interaction, so the corona resistance is strong. In the boundary layer, the interaction between polymer chains and the bonding layer and inorganic nanoparticles is formed, and the corona resistance is slightly weaker than that of the bonding layer. The loose layer is an interface with weak interaction with the boundary layer, and its corona resistance is weak. When a partial discharge occurs on the surface of the material, the surface of the polymer in the area with high electric field strength is first damaged. When the discharge proceeds to the loose layer, the layer is damaged by the discharge because of its poor corona resistance. When the discharge is further deepened, when the charge enters the boundary layer or the bonding layer, due to the strong corona resistance formed by the strong interaction in the interface area, the discharge effect cannot further damage the area, and instead, it is changed along the interface area to " ” shape development, extending the discharge path, thereby improving the corona resistance of the polymer material. After the nanoparticles are plasma treated, the interface area in the composite film is greatly increased, so that the dielectric double-layer structure in the interface area overlaps, the electrical conductivity of the film is improved, and a conductive channel is formed inside the film along the overlapping area. The dissipation of electric charge inside the film is promoted, the electric field inside the film is improved, and the corona resistance life of the film is improved.
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The use of plasma plasma surface treatment cleaning machine pretreatment technology on wafers
The use of plasma plasma surface treatment cleaning machine pretreatment technology on wafers: The connection quality of the chip leads is a key factor affecting the reliability of the device. The lead connection area should be guaranteed to be free of pollution and the connection effect should be good. The presence of contaminants such as oxides, organic residues, etc. will seriously impair the pull value of the lead connections. The traditional wet cleaning does not completely remove or cannot remove the contaminants in the bonding area, while plasma cleaning can effectively remove the surface dirt on the bonding area and activate the surface, which can significantly improve the bonding strength of the leads. Greatly improve the reliability of packaged devices. During the bonding process, there is often a certain adhesiveness between the chip and the package substrate. This bonding is usually hydrophobic and inert, and the bonding performance is poor. It can effectively improve the surface activity of the wafer, greatly improve the fluidity of the bonding epoxy resin on the surface of the wafer and the package substrate, and increase the efficiency of the wafer and the package. adhesion between substratesWetability, reduce the delamination of the chip and the substrate, increase the reliability and stability of the chip package, and prolong the service life of the product. The glow plasma produced by plasma surface treatment and cleaning machine can effectively remove the original contaminants and impurities on the surface of the treated material, and can produce etching to make the surface of the sample rough, form many tiny pits, and increase the contact area, improve the wettability of the surface (as the saying goes, enhance the adhesion of the surface, enhance the hydrophilicity). Plasma plasma surface treatment cleaning machine has a wide range of applications, which can solve technical problems such as bonding, printing, spraying, and destaticization, and achieve the goals pursued by modern manufacturing processes such as high quality, high reliability, high efficiency, low cost, and environmental protection. . Many factory operators, when using plasma surface treatment equipment, always consult the manufacturer, how dangerous is the plasma surface treatment equipment? Plasma plasma surface treatment cleaners produce trace amounts of ozone when they start up. Ozone gas is basically harmless to the human body. However, if the use environment is relatively closed and the ventilation conditions are poor, it will be too high, causing the surrounding people to smell irritating odors and causing slight dizziness and headache. Therefore, the production workshop of plasma equipment needs to keep unblocked with the outside air. If the use space is relatively closed and the ventilation conditions are poor, a special ventilation system needs to be installed. In flip-chip packaging, the use of plasma treatment technology to process the chip and the package carrier can not only achieve ultra-cleaning of the surface of the weld, but also significantly improve the activity of the weld, which can effectively prevent false welding and reduce voids. To improve the reliability of welding, it can also improve the edge height and tolerance of the welding seam, improve the mechanical strength of the package, reduce the internal shear force formed between the interfaces due to the thermal expansion coefficient of different materials, and improve the reliability of the product. life. The glow generated by the plasma surface treatment cleaning machine when it is in close contact can cause a burning sensation in the human body. Therefore, the material cannot be touched by hand when the plasma beam is processing the material. Generally, the distance between the direct injection plasma nozzle and the nozzle is 50 mm, and the distance between the rotating plasma nozzle and the nozzle is 30 mm (different distances for different types of equipment). In order to ensure the safe operation of the equipment, please use AC220V/380V power supply, and do a good job of grounding to ensure that the air supply source is dry and clean. The plastic packaging type of the lead frame still accounts for more than 80% of the microelectronic packaging field. The delamination of the copper lead frame leads to poor sealing performance after encapsulation, and leads to chronic outgassing. It also affects the bonding and wire bonding quality of the chip. To ensure the ultra-cleanness of the lead frame is to ensure the reliability of the package. And the key to the yield, the plasma treatment of the plasma surface treatment cleaning machine can realize the ultra-cleaning and activation of the surface of the lead frame. Compared with the traditional wet cleaning, the yield of the finished product is greatly improved, and there is no waste water discharge, reducing the chemical The purchase cost of the potion. Porcelain products are encapsulated, usuall
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Low-temperature plasma surface modification of metal biomaterials by graft polymerization of metal-polymers
Low-temperature plasma surface modification of metal biomaterials by graft polymerization of metal-polymers: The application of metal biomaterials in low temperature plasma surface modification mainly includes three aspects: improving biocompatibility, immobilizing bioactive macromolecules, and improving the physiological corrosion resistance of metal materials. Grafting is a commonly used plasma surface modification method. The grafting of appropriate monomers or polymers can improve the hydrophilicity, adhesion, corrosion resistance, electrical conductivity and biocompatibility of metal polymers. When a metal material is implanted into a living body, it must meet the requirements of biocompatibility. Biological compatibility is the degree to which a substance is compatible with blood and tissue. Surface modification of metal biomaterials with functional groups such as grafting, polymerization, and hydrophilicity is a surface modification method of metal biomaterials that is currently studied. It is mainly used to improve the biocompatibility of materials and induce the growth of living cells. biological activity of the material. Plasma surface modification of PEG was carried out by AgnesR, Denes, etc., so that PEG was grafted on the surface of stainless steel. The XPS results showed that the introduction of a large number of low-temperature plasma surface modification -CH2-CH2-O groups on the surface of stainless steel can significantly Improve the hydrophilicity of the material surface. Reduce roughness and greatly reduce the adsorption of bacteria on the surface of the material. Coronary angioplasty (PTCA) is often used in clinical treatment of coronary vascular disease. That is to say, a metal dilator is used to support the blood vessel inside the blood vessel, but the polymer metallized Stern fixation membrane used still has a high coagulation property, so the blood vessel will become more narrow. Lahann et al. used a CVD method to perform a chlorination reaction on the polymer metal surface, followed by SO2 microwave plasma treatment. The study found that after SO2 plasma treatment, the contact angle was reduced to 15 degrees, and the hydrophilicity of the material surface was improved. The grafting of organic organic grafts on the metal plasma surface or the metallization of the polymer surface involves the adhesion of the polymer to the metal. Zhang et al. investigated the adhesion of PTFE (PTFE) to metallic aluminum. First, PTFE was pretreated with argon plasma (frequency 40kHz, power 35W, argon pressure 80Pa). Then use acrylate glycerol, GMA, heat to evaporate aluminum, make it and GMA graft copolymerization reaction, generate hydrogen oxide and peroxide, and then use heat to evaporate aluminum, use GMA, the graft copolymer of PTFE and A's The adhesion is 22 times that of PTFE and Al and 3 times that of PTFE and Al pretreated with Ar plasma only. Calcium and phosphorus are the basic components of bone tissue. Depositing a layer of calcium phosphate or hydroxyapatite (HA) on the surface of metal implants can effectively improve its compatibility with bone tissue and enhance osteogenic induction. . The modification can be performed by plasma spraying (PSC). Polypropylene was treated by three methods (mechanical roughening method, low temperature plasma surface modification with oxygen, nitrogen and argon gas, and intermediate layer method), and the adhesion characteristics of metal polymer on the polymer were studied, The results show that the mechanical roughening method can effectively improve the adhesion between polypropylene and copper, but the effect of plasma treatment is better, especially Ar plasma, in the process of polypropylene polymerization, the intermediate layer contains C- 0 key, strong adhesion. Arc discharge (>10000°C) is generated through the high potential difference between the electrodes, ionizing the gas around the electrodes into plasma, and then hitting the modified powdery substance suspended on the surface at high speed, causing it to settle on the metal surface. Plasma spraying is a widely used deposition method. The coating can form a high bonding force between the substrate and the surface modification layer to obtain a fully covered coating (40~54m). Coatings formed by this process can rapidly nucleate and grow in body fluids. However, due to high temperature treatment, there are disadvantages such as uneven density, inconsistent structure, and large variation in bond strength, and hydroxyapatite is easily decomposed during the spraying process, and is prone to desolubilization under body fluid conditions. After spraying the HA coating, heat treatment or steam bath is also required to improve the composition and structure of the coating. If the vapor pressure is 0.15 MPa and the temperature is 125 ℃, and the steam bath is treated for 6 h, most of the amorphous HA phase will be transformed into crystals, and other decomposition products generated during spraying will
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SiO polymer electronic paste ultra-fine glass powder polymerized on the surface of plasma-modified powder
SiO polymer electronic paste ultra-fine glass powder polymerized on the surface of plasma-modified powder: The ultra-fine powder in the electronic paste is generally inorganic powder, the large particle size is generally not more than 15pum, the average particle size is less than 5pum, the specific surface area is large, it is easy to agglomerate to form large secondary particles, and it is difficult to be used in organic carriers. dispersion. The uniformity and stability of the dispersion in the organic carrier have a great influence on the printing performance of the paste and the performance of the prepared electronic components. Using hexamethyldisiloxane (HMDSO) as a monomer, a thin layer of silicon oxide polymer was polymerized and coated on the surface of inorganic glass powder by plasma to improve its dispersibility in organic carrier and adjust the rheology of electronic paste , printing suitability and sintering performance, improve the performance of electronic paste to meet the requirements of new electronic components and screen printing technology progress. The parameters affecting plasma polymerization are: background vacuum, working pressure, ratio of monomer HMDSO to working gas argon, power supply, processing time, working temperature, etc. For the untreated powder tablet, when the contact angle is measured, the potassium permanganate aqueous solution with a mass fraction of 0.1% is instantly absorbed on the surface of the powder tablet, and after the treatment, the droplet can be stabilized on the powder tablet. Exists without wetting the powder. The longer the discharge time, the higher the monomer concentration in the gas, and the higher the power supply, the larger the powder contact angle. This is mainly because the more low-surface-energy SiOx polymers formed by polymerization on the powder surface, the stronger the surface hydrophobicity. When the SiO polymerized on the surface of the powder, the polymer completely covers the surface of the powder, the contact angle reaches a large, and the surface energy reaches a low saturation state. Therefore, it is possible to change or control the surface energy of the powder by changing the amount of SiO coated on the surface of the powder and the amount of polymer, improving its dispersibility in the organic carrier, and adjusting and controlling the rheological properties of the electronic slurry, Printability and sintering properties. Plasma-polymerized powders are smoother, finer, and less wet than untreated powders. The treated powder can move farther and flow better when splashed. Fineness is a direct index to evaluate the dispersion quality of ultrafine powder. Therefore, the powder treated by plasma polymerization is not easy to agglomerate and has good dispersion performance. The initial viscosity of the electronic paste prepared with untreated powder increased slightly, indicating the existence of powder agglomerates in the paste. The viscosity of the electronic paste prepared by the powder after treatment conforms to the viscosity change law of a typical pseudoplastic fluid, and the viscosity is shear thinning. When the electronic paste is screen printed, its viscosity is required to be rapidly thinned and non-stick to the screen under the action of the scraper, and the viscosity can be rapidly increased after printing to ensure the accuracy of the printed graphics. The rheology and printability of the electronic paste prepared from the powder treated by plasma polymerization were better. After plasma treatment, the dispersion performance of the powder in the organic carrier has been significantly improved. During the plasma treatment process, the SiO formed by polymerization on the surface of the powder reduces the surface energy of the powder and prevents the agglomeration between the powders: on the one hand, it reduces the surface energy difference with the organic carrier, and on the other hand, it reduces the surface energy of the powder. Active groups are added on the surface of the particles, which increases the compatibility between the powder and the organic carrier, so that the powder is not easy to agglomerate and is easy to stably disperse in the organic carrier.
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