Used to clean Wafer and remove surface photoresist. It has a high degree of uniformity and a stable etching rate.

The main material of FPC printed circuit board (soft board) is composed of polyimide resin. Due to the heat generated during drilling, it is easy to leave a large amount of resin slag in the hole, resulting in the copper plating layer on the hole wall and the inner The layers of the circuit are poorly connected, and even break and open circuits. At present, the industry mostly uses resin leavening agents and potassium permanganate liquids to remove slag in the holes.

With the rapid development of smart phones, people’s requirements for mobile phone camera pixels are getting higher and higher.

Improving the added value of the fabric has significant effects on the fabric's antistatic property, anti-pilling property, easy stain removal, water and oil repellency, etc.

In LCD display assembly, many processes require plasma treatment technology. For example, before evaporating or sputtering ITO film on glass substrate, it is difficult to clean the glass surface due to the dirty glass surface, and the cleaning effect cannot be achieved.