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Professional plasma plasma high-tech enterprise dedicated to providing manufacturing equipment and process solutions for the electronics industry
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Plasma cleaning system Plasma metal surface cleaning technology
Using low temperature plasma cleaning system, will not cause any damage to the product, and low temperature plasma metal surface cleaning technology is widely used in the change of the surface mechanical properties of metal materials, such as material wear, hardness, friction, fatigue, corrosion resistance, etc. 1, enhance the adhesion of the metal surface: After the special metal low temperature plasma surface treatment machine, the surface morphology of the material has a microscopic change, the low temperature plasma surface treatment machine to the metal material, can make the adhesion of the material surface to reach more than 70 daines value, can meet a variety of bonding, coating, printing and other processes, at the same time to achieve the effect of eliminating static electricity. 2, enhance the corrosion resistance of the metal surface: Existing plasma ferroalloy cleaning machines can improve the friction and corrosion properties of ferroalloys. Because the plasma is injected into the product from all directions at the same time, there is no size limit, so it can handle the more complex shape of the sample. Low-temperature plasma surface treatment technology is used to coat the metal surface with polyphenylene, aluminum coating and other technologies are mostly used to protect the metal surface of spacecraft. 3, improve metal hardness and wear resistance: The early research on the application of plasma immersion ion implantation mainly focuses on the surface treatment of metal materials by nitrogen plasma. The results show that the surface wear resistance of the product is improved due to the formation of TiN and CrN superhard layers. In addition to plasma dry cleaning, there are chemical cleaning. 1. Passivation processing: After being soaked by special agents, a dense passivation film is formed on the surface of stainless steel, iron and copper materials to isolate the product from space and prevent the oxidation of the workpiece surface. Characteristics: the color of the passivation film will not change the size and color of the workpiece. And the original solution is impregnated at room temperature (in addition to stainless iron, stainless iron needs to be heated). 2. Pickling passivation: What is the effect of pickling passivation? It is composed of pickling and passivation of two in one potion, also for the original liquid normal temperature soaking treatment, but not suitable for stainless steel use. After pickling and passivation, the surface of the workpiece is matte silver white. Can effectively remove weld spot.
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Low temperature plasma treatment to improve the water resistance of wood bonding strength
Because of its excellent performance and environmental protection factors, wood-based panel plays an important role in furniture, building materials and other fields. However, the wood-based panels made of urea-formaldehyde resin glue, phenolic resin glue and melamine formaldehyde resin glue are widely used at present, which have problems such as large consumption of petroleum resources and continuous release of formaldehyde. In order to further improve the environmental protection of wood-based panel products, soybean protein adhesive (soybean gum) was modified by physical, chemical or biological methods to make the wood surface have good wettability, which has been widely paid attention in the field of wood adhesive. However, compared with aldehyde adhesives, bean adhesives still have some shortcomings in terms of water resistance, bonding strength and adhesive quantity. In order to improve the quality of wood-based board, plasma surface modification is one of the effective methods to improve the wettability of glue on board surface. A large number of polar oxygen-containing functional groups can be formed on the surface of poplar veneer under oxygen RF plasma treatment, and the surface roughness is improved, which is beneficial to adhesive bonding. Using atmospheric pressure air dielectric barrier discharge plasma technology to treat veneer surface simplifies the process and creates conditions for industrial application. The parameters such as plasma treatment speed and power have obvious effects on the physical and chemical properties of the sheet surface. Wood was modified by atmospheric plasma to improve its surface wettability. Using nanocellulose (NCC) modified soybean glue as binder, the surface of poplar veneer was treated by atmospheric pressure air dielectric barrier discharge plasma to prepare soybean glue plywood. After atmospheric plasma treatment, the wood surface was etched, and a large number of polar functional groups were produced, which improved the wettability of the glue on the wood surface, thus increasing the bonding strength of the wood, and further reducing the amount of adhesive. On the one hand, the surface of poplar veneer is physically etched and micro-nano pores are produced after plasma treatment, which is beneficial to the penetration of modified soybean gum into the veneer surface. On the other hand, the high-energy particles generated by the atmospheric low temperature plasma make the surface of poplar veneer change chemicly, produce more polar functional groups containing oxygen and nitrogen, improve the polar interaction between the glue and wood, and make the glue more easily penetrate into the pores of the veneer surface, forming a deep nail structure. Therefore, the interfacial bond strength of the plywood treated by low temperature plasma can be significantly improved, and the bond strength of the plywood treated by low temperature plasma can reach 0.78MPa, which is increased by 20% and reaches the national standard. This indicates that the normal pressure and low temperature plasma treatment can reduce the amount of glue and reduce the production cost under the condition that the bonding strength reaches the standard. The high energy particles in the plasma impact the wood surface at high speed and degrade the polymer in the wood cell wall. These small irregular scratches on the surface of poplar increased the surface roughness, promoted the penetration of modified bean gum into the surface of poplar veneer, and increased the interfacial bonding strength. The surface of poplar veneer was etched to form a microporous structure, and the surface roughness of veneer was increased, which improved the permeability of nano-cellulose modified soybean gum. After treatment, new free radicals were generated on the surface of poplar veneer, which enhanced the polarity between modified bean gum and veneer surface.
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Application of Plasma Surface Treatment in Microassembly Technology Application of Plasma Surface Treatment in Microassembly Technology
Overview of microgroup assembly technology: From the beginning of micro assembly concept put forward, especially surface-mount technology development to a high level of specific stages, namely the guide feet must be less than 3 mm between components in surface-mount technology, with the further development of technology, now also refers to various forms of element SMT technology, such as circuit lead spacing is small, such as modules, components, systems or SMT technology. There is another saying that micro-assembly technology is short for micro-circuit assembly technology, that is, the assembler uses assembly equipment, tools, and micro-welding, interconnection and packaging technology to assemble a variety of micro components, integrated circuit chips, micro structural parts, etc., on the multi-layer interconnect substrate. Processes, methods and techniques for making it a highly reliable, high-density, two-dimensional microelectronic product (module/component/component/subsystem/system). The main application objects of micro - assembly technology are: micro - components, micro - spacing, micro - structure and micro - connection. The application of micro-assembly technology mainly includes: device level packaging, circuit module level assembly, micro-assembly or micro-system level assembly. The main contents of micro-assembly technology are as follows: 1) chip welding (conductive adhesive connection, eutectic welding, reverse assembly welding, etc.); 2) Interconnection of chemical plates (lead connection, automatic connection of carrier belt, micro-convex connection, etc.); 3) Device 3D assembly (wafer level 2D assembly, chip level 2D assembly, package level H-dimensional assembly); 4) Stereo assembly (chip level stereo assembly, board level stereo assembly). The main characteristics of microassembly technology are: 1) on a single printed plate (or substrate) to assemble a plurality of components (including outer package and no outer package) and other small components to form circuit modules (or components, Microsystems, subsystems); 2) the circuit module or component has a specific function and performance; 3) Independent circuit modules or components are generally not externally packaged, but can also be externally packaged (when the substrate is equipped with unpackaged components or specially required components); 4) Through motherboard and vertical interconnection technology, multiple independent circuit modules or components can be assembled into three-dimensional components -- dimensional three-dimensional assembly; 5) Multiple independent circuit modules or components can form a higher level system through motherboard, connection and plug interconnection or cable interconnection technology -- complete machine interconnection technology; 6) Multi-disciplinary optimization and micro-assembly design should be carried out according to the requirements of micro-assembly design with the pin spacing less than 3mm of the components. Plasma surface treatment process: In the process of microassembly, plasma surface treatment technology is a very important link, which directly affects the quality of the functional modules of microassembly. In the process of microassembly, plasma cleaning process is mainly used in the following two aspects. (1) point conductive adhesive before: the contaminants on the substrate will make the substrate wettability worse, point conductive adhesive is adverse to the tile glue, glue is round. Plasma surface treatment technology can greatly improve the wetting property of the substrate surface, which is beneficial to the adhesion between the conductive adhesive layer and the chip, and improve the bonding strength of the chip. (2) before the lead connection: chip affixed on the substrate, after high temperature curing, the substrate contaminants may contain particles and oxides, so that the lead and chip or substrate connection is not strong, resulting in insufficient connection strength. Isoionization treatment can obviously improve the surface activity before lead connection and thus enhance the strength of lead connection. The objects of plasma surface treatment in microassembly mainly include chip bonding zone, substrate, guide frame, ceramic substrate, etc. In this experiment, the substrate was cleaned, and silver and oxidation were generated on the surface of the substrate. Plasma cleaning machine was used to clean the substrate, and hydrogen and nitrogen mixture was selected as the cleaning process gas. During the cleaning process of plasma surface treatment, hydrogen plasma was effective enough to remove oxides on the substrate. The experimental results show that the process parameters such as pressure, power, time and gas flow can be effectively controlled in the cleaning process, and a better cleaning effect can be achieved.
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Comparison of contact Angle before and after plasma cleaning before plastic IC sealant
Plasma cleaning is a pollution-free stripping cleaning. When plasma cleaning is used, different chip cleaning techniques vary greatly. For example, the surface of metal fragments cannot be cleaned with oxygen to prevent oxidation. The application of plasma cleaning technology in LED packaging can be roughly divided into the following categories. (1) dispensing and packaging before: if there are pollutants in the substrate dispensing silver glue, silver glue is easy to form a ball, reduce chip adhesion. Plasma cleaning can increase the surface roughness of the workpiece, which is conducive to the success of dispensing silver. At the same time, it can save the amount of silver glue and reduce the cost. (2) Before lead bonding, the chip is pasted on the lead frame substrate, and should be cured at high temperature. If there are contaminants on the surface of the chip, it will affect the bonding effect between the lead and the chip and the substrate, resulting in incomplete bonding or poor adhesion and low strength. Plasma cleaning before bonding can significantly improve the surface activity, bonding strength and tensile uniformity of the wires. (3) before curing: the existence of pollutants will also lead to the formation of bubbles in the process of epoxy resin injection, so that the chip is easy to damage in the temperature change, reduce the service life of the chip. Plasma cleaning enables the chip and substrate to bond more tightly to the gel, reducing the formation of bubbles, and significantly improves the characteristics of the components. The contact Angle test of the chip shows that the contact Angle of the sample without plasma cleaning is about 39°~65°. After chemical plasma cleaning, the chip contact Angle is about 150°~20°. After the chip is cleaned by the physical reaction plasma, the contact Angle is 20°~27°. This shows that the plasma surface treatment of the encapsulated chip is effective. The contact angles of copper lead frames before and after plasma cleaning were compared by means of contact Angle tester. The contact Angle before cleaning is 46°~50°, and the contact Angle after cleaning is 14°~24°, which meets the requirements of chip surface treatment. Today, with the rapid development of integrated circuit technology in accordance with Moore's law, microelectronics manufacturing technology has become the frontier technology representing advanced manufacturing technology, and is also an important standard to measure the manufacturing level of a country. With the improvement of IC chip integration, the number of pins increases and the pin spacing decreases. Particulate pollutants, oxides and epoxy resins on chips and substrates will restrict the rapid development of integrated circuit packaging industry to a large extent. The on-line plasma cleaning technology, which is beneficial to environmental protection, good cleaning uniformity, good repeatability, strong controllability, strong 3D processing ability and directional selective processing, is applied to the integrated circuit packaging technology, and will promote the faster development of the integrated circuit packaging industry.
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The application of graphene in integrated circuit is introduced in Plasma cleaning machine
It is no exaggeration to say that graphene is the star material of the 21st century. In 2004, the discovery of graphene overthrew the two-dimensional structure "thermodynamic fluctuation at a finite temperature are not allowed to two-dimensional crystal under free existence" of cognition, shocked the whole physics, its discoverer, department of physics and astronomy at the university of Manchester, England Geim and Novoselov have therefore won the nomination of the Nobel Prize for physics in 2008, and won the 2010 Nobel Prize for physics. Compared with silicon, graphene has unique advantages in integrated circuits. Silicon-based microcomputer processors can only perform a certain number of operations per second at room temperature, but electrons pass through graphene with almost no resistance and generate very little heat. In addition, graphene itself is a good heat conductor and can dissipate heat very quickly. Because of its excellent properties, graphene can be used to make electronic products at much faster speeds. Speed is just one advantage of graphene. Silicon cannot be cut into pieces smaller than 10nm, or it will lose its attractive electronic properties. Compared to silicon, graphene's basic physical properties do not change when it is partitioned, and its electronic properties may even behave differently. As a result, graphene, which is smaller than silicon, can continue to maintain Moore's law when silicon is no longer separable, and thus has the potential to be a silicon replacement to drive microelectronics forward. Therefore, the unique physical and chemical properties of graphene also arouse the great interest of scientists in the fields of physics, chemistry and materials. The above is the introduction of graphene in the integrated circuit of CRF plasma cleaning machine manufacturers.
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After the plasma surface treatment effect test how to identify
Although we know that the surface properties of materials will change after plasma surface treatment, but the naked eye can not tell whether the material has been treated or not. So, is there a simple way to quickly tell whether the material has been treated or not? The following are some commonly used rapid identification methods. The user of the plasma surface treatment device can tell at a glance whether the plasma treatment has been performed by displaying the label and observing the plasma indicator compound. It takes almost no time to complete the tests. Can be used in a variety of plasma equipment for a variety of processing purposes, including cleaning, activation, etching or coating. Over the course of weeks or months, these indicators will determine whether your product or semi-finished product has been identified before plasma treatment. 1. Identification label The pasted label film is a film treated with special coating. It can be placed directly in the box as a reference or pasted on the components. When the dark indicator point disappears, the plasma treatment is completed successfully. Device testing may also use an indication label, in which case the label may be placed in a vacuum chamber. 2, ADP- plasma indicator The plasma indicator is a label made of a special fabric. After successful plasma treatment, the fabric will dissolve. Attach this sticker to the component or model as needed. It can be used as a reference exposure for plasma jets, and the indicator has no effect on the actual plasma processing process or the device itself. Fabric can be damaged during processing. 3. Plasma indicator -- metal compound A plasma indicator is a liquid metallic compound that decomposes in a plasma to give a shiny surface to objects treated by the plasma. Droplets applied to the component or reference sample, when treated by isoionization, turn to a shiny metallic coating, in sharp contrast to the original colorless droplets. The metal film produced in the plasma is visually outstanding because of its reflectivity compared with the various colors of the object. 4. Dain pen test Dain pen can directly draw a line on the product, can show the difference between the treatment and the treatment, different Dain pen to measure the results are different, need to be used according to the actual situation.
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