Plasma surface processor lithium battery electrode coating pretreatment
The production and manufacture of lithium ion battery is a process closely linked by each process step. Generally speaking, the production of lithium battery includes the fabrication process of electrode, fabrication process of cell and assembly process of battery. In the three stages of the process, each process can be divided into several key processes, each step will have a great impact on the final performance of the battery. So the application of plasma surface processor in lithium battery industry arises at the right moment. Lithium battery Market Analysis: With the in-depth study of the relationship between electrode material structure and performance, the design of positive and negative electrode materials with a variety of structured structures or doped with a variety of composite structures at the molecular level will strongly promote the research and application of lithium ion batteries. After nickel-Cadmium and nickel-hydrogen batteries, lithium-ion batteries will be a very long time in the future, with good market prospects. According to the demand trend, electric vehicle market will gradually become a large field of lithium battery application. GGII predicts that the global sales of new energy vehicles in 2022 will reach 6 million units, an increase of 2.7 times compared with 2017, which is affected by the following factors: continuous promotion of policies, technological progress, changes in consumer habits, popularization of supporting facilities, and the demand for lithium batteries for electric vehicles will exceed 325GWh in the same period, an increase of 3.7 times compared with 2017. Meanwhile, competition in the lithium battery industry will mainly focus on the field of new energy vehicles. Power battery in the future will be the largest in lithium ion batteries growth engine, its development in the direction of high energy density, high security is set, the trend of high-end digital lithium ion battery power battery and lithium ion battery market is the main growth point, lithium electricity under 6 microns copper foil will become key raw materials of lithium ion battery, become the focus of the mainstream enterprise layout. Selection of coating equipment and coating process: Coating process includes: uncoiling → splicing → tension control → coating → drying → rectifying → Tension control → rectifying → winding and so on. Coating technology is complex, and factors influencing the coating effect is more, such as: the manufacturing precision of equipment, the stability of the equipment operation, dynamic tension control in the process of coating, drying air flow and temperature control curve, such as size, so choose the appropriate coating process is very important, the plasma surface treatment machine will show the reliability of it. Common coating methods need to be considered from the following aspects: coating layer number, wet coating thickness, coating liquid rheological property, required coating accuracy, coating support or substrate, coating speed. Base materials - Copper foil and aluminium foil: Surface tension: the surface tension of copper and aluminum foil must be greater than the surface tension of the coating solution, otherwise the solution on the substrate tile will be very difficult, resulting in poor coating quality. One rule that must be followed is that the surface tension of the solution to be coated should be 5dynes/cm lower than the substrate, although this is only a rough calculation. The surface tension of solution and substrate can be adjusted by adjusting the formula or substrate surface treatment. The measurement of both surface tensions should also be used as a test item for quality control. Because the coating process has a high demand on the surface tension of the substrate, so the plasma cleaning can effectively solve this problem. Before sputtering, painting, bonding, welding, brazing and PVD and CVD coating, the surface of aluminum foil metal often has organic matters and oxidation layers such as grease and grease, which all need cleaning treatment to get a completely clean and non-oxidized surface. However, most of the existing technologies use chemical cleaning methods, which require solvents, are not environmentally friendly, and are prone to "hydrogen embrittle" phenomenon. The deconvolution effect is not ideal, the deconvolution speed is slow, and the mechanical performance index of aluminum foil is easily affected. The use of plasma cleaning surface processor can solve the above problems. The anode and cathode materials of lithium battery pack are coated with the anode and cathode materials of lithium battery. When the electrode materials are coated with the metal strip, the metal strip needs to be cleaned. The metal strip is generally aluminum or copper thin. Dry cleaning plasma cleaning function can effectively solve the above problems.
Introduction to cleaning principle of plasma cleaning machine
The principle of the plasma cleaning machine, mainly through the plasma acting on the surface of the material, cause a series of physical and chemical changes, the use of active particles and high-energy rays, and the surface organic pollutant molecules reaction, collision formation of small molecules volatile, removed from the surface, achieve the cleaning effect. Vacuum plasma cleaning machine is the use of rf power supply in the vacuum chamber to produce high-energy disordered plasma, under a certain pressure, the surface of the product plasma bombardment, so as to achieve the purpose of cleaning. Cleaning and etching: For example, in the plasma cleaning machine cleaning gas is usually used oxygen, after accelerating the bombardment of electrons into oxygen ions, free radicals, strong oxidation. Pollutants on the surface of parts, such as grease, flux, photographic film, mold release agent, punch oil, etc., will be rapidly oxidized into carbon dioxide and water, and through the vacuum pump discharge, in order to achieve the purpose of cleaning the surface, improve the wetting and adhesion. After plasma treatment at low temperature, the properties of the material body will not be affected. Because plasma cleaning is carried out under high vacuum conditions, the various activated ions in the plasma have a great degree of freedom, and they have a strong permeability, which can be processed for complex structures, including thin tubes and blind holes. Introduction of functional groups: By using N2, NH3, O2 and SO2 plasma to treat the polymer material, the chemical structure of the surface can be changed, so as to introduce the corresponding functional groups: -NH2, -OH, -COOH, -SO3H, etc. Such functional functional groups, such as polyethylene, polypropylene, polystyrene, polytetrafluoroethylene, etc., can be transformed into functional group materials with improved surface polarity, wettability, adhesiveness and reactivity, greatly increasing their application value. By low temperature plasma treatment of fluorine-containing gases, fluorine atoms can be introduced into the substrate surface, thus making the substrate hydrophobic, as opposed to oxygen plasma. Aggregation: Many vinyl monomers, such as ethylene, styrene, etc., can be under the condition of the plasma, without other catalyst and initiator, it can implement polymerization on the surface of workpiece, even in the conventional polymerization conditions cannot polymerization of methane, ethane, benzene, etc., can also be used under the condition of the plasma cleaning machine to clean the surface polymerization. The polymer layer can achieve the effect of being very dense and tightly bound to the matrix material.
What are the colors of different gases in the plasma cleaning machine
The arc starting device of the plasma cleaning machine enables the atoms, ions or molecules with active energy excited state to emit light further down, thus forming the color of the plasma. Because the energy levels in each gas have different energy conversion, each process gas exhibits different luminous properties, resulting in different color properties. Typical gas colors commonly used in plasma cleaning are as follows: CF4: Blue SF6: Light blue SiF4: Light blue SiCl4: Light blue Cl2: Light green CCl4: Light green H2: Pink O2: Light yellow N2: Red to yellow Br2: Red He: Red to purple Ne: Brick red Ar: Dark red The glow color of the plasma cleaning machine can be used not only to identify which process gas is, but also to qualitatively evaluate whether the process gas contains no pollutants.
Plasma cleaning machine to increase the surface viscosity of materials
Plasma cleaning machine is the key technology of ultra-fine environmental cleaning, surface activation and plasma coating. Plasma cleaning machine can not only clean and remove dirt, but also improve the surface performance of the material itself. For example, to improve the surface wettability, increase ink, coating, coating adhesion, enhance the material's surface energy, hydrophilic. Adhesiveness refers to the stability of the connection or combination between the substrate and the adhesive coating. The separation force is the standard for bonding performance and is directly applied to the separation force value during bonding (peel test, end force test). Plasma cleaning machine can improve the surface adhesion of materials, is a very environmentally friendly treatment method. If the binding force is higher than the adhesion strength of one of the two bonds, the adhesion performance is better. If the separation of attachment is not caused by the dissolution of the compound but by the fracture of the material in a pair of complexes, then the above situation is corresponding. If the coating material (paint, adhesive) completely wet the substrate, it can achieve good adhesion. Wettability can usually be determined by: Check ink; LABS testing; Contact Angle measurement. No matter what kind of substrate or coating, the basic use of plasma cleaning machine must be pretreated, the purpose is to get enough adhesion, because there are always some factors will affect the adhesion. Preprocessing includes at least one or more of the following sets of steps: Cleaning: especially for the removal of hydrocarbons (mold release agent, oil, grease, etc.), the plasma cleaning machine can be used for processing, can completely remove such substances, so as to improve the surface adhesion. Plasma activation: in order to completely bond the coating, the surface of the substrate must be greater than the surface tension of the coating. The surface energy can be increased by plasma activation, and almost every material combination can achieve complete binding. Increase surface area: A rough (clean, active) surface is much better than a smooth (smooth) surface. Through plasma treatment coarsening, surface roughness (increase surface area) can be realized, so as to realize frosting and sandblasting processing. Corrosion: chemical etching, plasma etching, micro-sandblasting. Oxidation removal: By plasma treatment, the oxide layer on the material surface is also removed.
Application of plasma surface processor in textile processing
Textile industry is one of the industries with a long history of mankind, and also an important part of the industrial revolution. For a long time, in order to adapt to the changing consumer changes and cope with the increasingly severe environmental pressure, the textile industry has been developing and making progress. Textile plasma surface treatment technology is developing rapidly in China. The early plasma surface treatment technology has been replaced by new atmospheric plasma surface treatment technology. This new technology can improve the performance of a fabric by changing its surface properties. Development Trend of textile Industry: The textile industry provides a large number of jobs, creates a lot of wealth, and also has a huge impact on many industries, including mechanical engineering, polymer materials, chemistry and fuel. Since the 1990s, market drivers have included design and innovative fabrics, as well as increased investment in new technologies by industrialized countries to reverse the long-term decline of their textile and clothing industries. Earlier, the newly industrialised countries of East Asia that had succeeded in entering western markets were beginning to find their places being taken by a new generation of developing countries. In the whole textile industry chain, the competition between enterprises and western countries is increasingly intensified. Most countries with developed garment industry have established r&d centers, which are engaged in extensive improvement research and basic research work. Textile plasma surface treatment: The textile industry has long recognized that the surface performance of fabrics is a critical factor in many processing processes and applications, and the specific requirements for the surface performance of fabrics are often very different from that of base fabrics. The surface properties of the fabric not only determine the dyeing rate and color fastness of the fabric, but also determine the simplicity of the finishing process of the fabric, determine the binding strength between the coating and the base cloth, and play a crucial role in the biocompatibility between the coating and the base cloth. In addition, surface properties play a key role in the disinfection performance and biocompatibility of medical implants requiring liquid chemical treatment. Conventional textile processing technology consumes a large amount of energy and water resources in the processing process, causing serious water pollution, high cost and environmental damage. In the conventional fabric treatment process, the surface treatment of the fabric is carried out at the same time as the base fabric treatment, which will adversely affect the overall performance of the fabric. Therefore, the textile industry urgently needs to choose alternative surface treatment technology to reduce production costs, protect the environment, and produce new products with long life, high quality and good performance. Certain properties of fabrics can be adapted to meet specific needs by changing the function or shape of the fabric surface. By etching the fiber surface, cracks and cracks can be created on the fiber surface. This etching can help enhance the wettability of the fabric, thus achieving more effective dyeing or deep dyeing. Conversely, by reducing the wettability of the fabric can be achieved waterproof effect. The new chemical function of fabric surface can promote the reaction between fabric surface and dyes, thus greatly improving the adhesion between layers. It is a very complicated process to change the surface property of fabric by plasma surface treatment. The reactions initiated by the particles in the plasma usually occur at a depth of 10nm from the surface of the material. The radiation caused by short-wave ultraviolet radiation in the plasma is very deep, within 100nm of the surface. The working gas and other process parameters of plasma can change the interaction and range of action between the two reactions. The outermost layer of the fabric is only a few atoms thick, usually less than 1nm, but it determines how the fabric interacts with other media. The chemical composition of the outermost layer of the fiber surface determines the interlaminar bonding ability of the fabric and the suitability of the fabric for impregnation. The outermost layer of the fiber chemical structure and composition can be modified by plasma. The fabric surface treatment not only needs to choose the appropriate process parameters, but also the original surface performance of the fabric is also important. At present, plasma surface treatment technology has been applied to the surface modification of textiles and the modification of base fabrics, which has successfully improved many kinds of fabrics from traditional fabrics to advanced composite fabrics. The results show that the surface energy of fiber and fabric can
Application of semiconductor plasma cleaning machine in wafer cleaning
With the continuous development of semiconductor technology, the requirement of process technology is higher and higher, especially the surface quality of semiconductor chip. The main reason is that the particles and metal impurities on the surface of the chip will seriously affect the quality and yield of the device. In the current IC production, there is still more than 50% material loss due to the pollution of the wafer surface. In semiconductor manufacturing, almost every process needs cleaning, and the quality of wafer cleaning has a serious impact on device performance. It is precisely because wafer cleaning is the most important and frequent step in semiconductor manufacturing process, and its process quality will directly affect the yield, performance and reliability of the device, so companies and research institutions at home and abroad have been constantly studying the cleaning process. Plasma cleaning, as an advanced dry cleaning technology, has the characteristics of environmental protection. With the rapid development of microelectronics industry, plasma cleaning machine has been used more and more in semiconductor industry. Plasma cleaning has the advantages of simple process, easy operation, no waste treatment and environmental pollution. Plasma cleaning is commonly used in photoresist removal. A small amount of oxygen is introduced into the plasma reaction system. Under the action of a strong electric field, oxygen produces plasma, which rapidly oxidizes the photoresist into volatile gas and is pumped away. This cleaning technology has the advantages of easy operation, high efficiency, clean surface, no scratch and so on, which is helpful to guarantee the product quality. And do not use acid, alkali, organic solvents, more and more attention by people. The following is a brief introduction to the impurities and classification of semiconductors: Semiconductor manufacturing requires the participation of some organic and inorganic materials. In addition, because the process is always carried out by people in the purification room, the semiconductor chip will inevitably be contaminated with various impurities. According to the sources and properties of pollutants, they can be roughly classified into four categories: particles, organic matter, metal ions and oxides. 1.1 particles: Particles are mainly polymers, photoresist and etching impurities. This contaminant is usually adsorbed on the wafer surface and affects the geometric pattern formation and electrical parameters of the photolithography process. The removal method of this kind of pollutant is mainly to clean the particles through physical or chemical methods, gradually reduce the contact area between particles and the surface of the wafer, and finally remove. 1.2 Organic matters: Organic impurities come from a wide range of sources, such as human skin oils, bacteria, oil, vacuum oils, photoresist, cleaning solvents, etc. These contaminants usually form an organic film on the surface of the wafer to prevent the cleaning solution from reaching the wafer surface, resulting in incomplete surface cleaning and leaving contaminants such as metal impurities on the surface intact. Removal of such contaminants is usually done in the first step of the cleaning process, using mainly sulfuric acid and hydrogen peroxide. 1.3 metals: Common metal impurities in semiconductor technology include iron, copper, aluminum, chromium, tungsten, titanium, sodium, potassium, lithium and so on. The sources of these impurities include various containers, pipes, chemical reagents, and metal contamination in semiconductor wafer processing. Chemical methods are often used to remove such impurities. Cleaning fluids prepared with various reagents and chemicals react with metal ions to form metal ion complexes, which are separated from the wafer surface. 1.4 Oxide: A natural oxide layer forms on the surface of a semiconductor chip exposed to oxygen and water. Not only does this oxide film block many of the steps in semiconductor manufacturing, but it also contains metal impurities that, under certain conditions, can transfer to the chip and form electrical defects. The removal of this oxide film is usually accomplished by immersion in dilute hydrofluoric acid.
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