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Professional plasma plasma high-tech enterprise dedicated to providing manufacturing equipment and process solutions for the electronics industry

New energy industry

  • Categories:New energy indu
  • Author:
  • Origin:
  • Time of issue:2020-06-10
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(Summary description)Using plasma technology to bombard the surface of the material can effectively remove surface contaminants and greatly improve the hydrophilicity of the workpiece surface. The angle of the water droplets after cleaning is less than 5 degrees, laying a good foundation for the next process.

New energy industry

(Summary description)Using plasma technology to bombard the surface of the material can effectively remove surface contaminants and greatly improve the hydrophilicity of the workpiece surface. The angle of the water droplets after cleaning is less than 5 degrees, laying a good foundation for the next process.

  • Categories:New energy indu
  • Author:
  • Origin:
  • Time of issue:2020-06-10 14:12
  • Views:
Information
Glass base board:
 
Using plasma technology to bombard the surface of the material can effectively remove surface contaminants and greatly improve the hydrophilicity of the workpiece surface. The angle of the water droplets after cleaning is less than 5 degrees, laying a good foundation for the next process.
 

plasma technology-Sing Fung Intelligent Manufacturing

Surface modification of anode:
 
The surface modification of the ITO anode with plasma technology can effectively optimize its surface chemical composition and greatly reduce the sheet resistance, thereby effectively increasing the energy conversion efficiency and improving the photovoltaic performance of the device.
 

ITO plasma cleaning machine-Sing Fung Intelligent Manufacturing

Pre-treatment of protective film:
 
The surface of the silicon chip is very bright and reflects a lot of sunlight. Therefore, it is very necessary to deposit a layer of silicon nitride protective film with very low reflection coefficient on it. By using plasma technology, the surface of the silicon wafer can be activated, and its surface adhesion can be greatly improved.

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Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd.

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TEL：0755-3367 3020 / 0755-3367 3019

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E-mail：sales-sfi@sfi-crf.com

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ADD：Mabao Industrial Zone, Huangpu, Baoan District, Shenzhen