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What are the causes of plasma catheter etching?

  • Categories:Company Dynamics
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2022-08-16
  • Views:

(Summary description)Plasma treatment technology is an emerging technology that developed rapidly in the 20th century, and has become a key technology in some important industries (such as microelectronics, semiconductors, materials, aerospace, metallurgy, etc.) , surface modification and other aspects of the application has created great economic benefits. The advantages of plasma treatment are many, the most important is that the treatment effect is limited to the surface without affecting the bulk properties. The surface of the catheter is cleaned, disinfected and sterilized by the plasma method. For the silicon treatment on the surface of the catheter, an organic solvent needs to be used, which will cause pollution to the environment. The material used in the oxygen plasma method is oxygen or air, which does not pollute the environment. It is an environmentally friendly new surface treatment. method. There was no significant difference in the infrared absorption of these major groups before and after sample treatment. The energy of the active particles in the plasma is generally several to a dozen eV, while the chemical bond energy in the rubber material molecules is mostly 3-6 eV. The energy of the particles in the plasma is greater than or equal to the bonding energy of the rubber material molecules, so the bonding bonds can be broken to form new bonds, but because its energy is much lower than that of the radiation, the plasma treatment only occurs on the surface of the substrate, while the Does not damage the substrate. Etching-deposition is a pair of opposite and simultaneous chemical reactions that the plasma acts on the surface of the material to be treated. The oxygen plasma treats the film wrapped on the surface of the catheter, and its chemical structure is similar to that of the rubber material. This is practically beneficial as it avoids harmful side effects due to surface treatments. The contact angle of the catheter surface was 84° without treatment, 67° after treatment with oxygen plasma, and decreased by 17° after treatment, indicating that the hydrophilicity of the catheter was better improved. After the surface of the urinary catheter is treated by oxygen plasma, etching occurs, the surface is clean, and a small amount of hydrophilic groups are generated, thereby improving its hydrophilic performance and reducing the contact angle. After the oxygen plasma treatment, the burrs on the surface of the catheter are passivated, the coarse particles become smaller, and the surface becomes smooth. This is consistent with the measurement results of the surface contact angle. Causes of catheter etching include physical sputtering as well as chemical etching. The very low content of charged active species in the plasma plays an extremely important role in the surface treatment of materials. Since the moving speed of electrons is much greater than that of ions, the surface potential of the material placed in the plasma is negative relative to the plasma potential (called the drift potential. The high-speed electrons excite, ionize or break the reactive molecules into free radical fragments, The positive ions continuously bombard the surface of the material to be treated, which significantly affects the chemical reaction that occurs on the surface. Chemical etching is due to the fact that the energy of the active particles in the plasma is close to or slightly greater than the bond energy of the chemical bonds of the molecules of the material being processed. The closeness of this energy level makes the chemical bonds of the catheter material molecules exposed to the plasma easily broken, or the formation of small molecules from the matrix, or the formation of new chemical bonds, resulting in cross-linking, or the formation of free radicals. The effect of chemical etching is not obvious; from the results of SEM analysis, the effect of physical sputtering is obvious; the measurement results of contact angle suggest that physical sputtering and chemical etching work at the same time. Therefore, it can be inferred that the role of physical sputtering in the initial stage of oxygen plasma treatment on the catheter surface is dominant. Oxygen plasma treatment of the surface of the catheter leads to its surface etching, which makes the surface smooth and hydrophilic. The chemical structure of the surface film formed by the oxygen plasma treatment does not change much, so as to avoid the side effects of the urinary catheter in practical application.

What are the causes of plasma catheter etching?

(Summary description)Plasma treatment technology is an emerging technology that developed rapidly in the 20th century, and has become a key technology in some important industries (such as microelectronics, semiconductors, materials, aerospace, metallurgy, etc.) , surface modification and other aspects of the application has created great economic benefits. The advantages of plasma treatment are many, the most important is that the treatment effect is limited to the surface without affecting the bulk properties. The surface of the catheter is cleaned, disinfected and sterilized by the plasma method.
For the silicon treatment on the surface of the catheter, an organic solvent needs to be used, which will cause pollution to the environment. The material used in the oxygen plasma method is oxygen or air, which does not pollute the environment. It is an environmentally friendly new surface treatment. method. There was no significant difference in the infrared absorption of these major groups before and after sample treatment. The energy of the active particles in the plasma is generally several to a dozen eV, while the chemical bond energy in the rubber material molecules is mostly 3-6 eV. The energy of the particles in the plasma is greater than or equal to the bonding energy of the rubber material molecules, so the bonding bonds can be broken to form new bonds, but because its energy is much lower than that of the radiation, the plasma treatment only occurs on the surface of the substrate, while the Does not damage the substrate.
Etching-deposition is a pair of opposite and simultaneous chemical reactions that the plasma acts on the surface of the material to be treated. The oxygen plasma treats the film wrapped on the surface of the catheter, and its chemical structure is similar to that of the rubber material. This is practically beneficial as it avoids harmful side effects due to surface treatments. The contact angle of the catheter surface was 84° without treatment, 67° after treatment with oxygen plasma, and decreased by 17° after treatment, indicating that the hydrophilicity of the catheter was better improved. After the surface of the urinary catheter is treated by oxygen plasma, etching occurs, the surface is clean, and a small amount of hydrophilic groups are generated, thereby improving its hydrophilic performance and reducing the contact angle.
After the oxygen plasma treatment, the burrs on the surface of the catheter are passivated, the coarse particles become smaller, and the surface becomes smooth. This is consistent with the measurement results of the surface contact angle. Causes of catheter etching include physical sputtering as well as chemical etching. The very low content of charged active species in the plasma plays an extremely important role in the surface treatment of materials. Since the moving speed of electrons is much greater than that of ions, the surface potential of the material placed in the plasma is negative relative to the plasma potential (called the drift potential. The high-speed electrons excite, ionize or break the reactive molecules into free radical fragments, The positive ions continuously bombard the surface of the material to be treated, which significantly affects the chemical reaction that occurs on the surface.
Chemical etching is due to the fact that the energy of the active particles in the plasma is close to or slightly greater than the bond energy of the chemical bonds of the molecules of the material being processed. The closeness of this energy level makes the chemical bonds of the catheter material molecules exposed to the plasma easily broken, or the formation of small molecules from the matrix, or the formation of new chemical bonds, resulting in cross-linking, or the formation of free radicals. The effect of chemical etching is not obvious; from the results of SEM analysis, the effect of physical sputtering is obvious; the measurement results of contact angle suggest that physical sputtering and chemical etching work at the same time. Therefore, it can be inferred that the role of physical sputtering in the initial stage of oxygen plasma treatment on the catheter surface is dominant. Oxygen plasma treatment of the surface of the catheter leads to its surface etching, which makes the surface smooth and hydrophilic. The chemical structure of the surface film formed by the oxygen plasma treatment does not change much, so as to avoid the side effects of the urinary catheter in practical application.

  • Categories:Company Dynamics
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2022-08-16 10:49
  • Views:
Information

Plasma treatment technology is an emerging technology that developed rapidly in the 20th century, and has become a key technology in some important industries (such as microelectronics, semiconductors, materials, aerospace, metallurgy, etc.) , surface modification and other aspects of the application has created great economic benefits. The advantages of plasma treatment are many, the most important is that the treatment effect is limited to the surface without affecting the bulk properties. The surface of the catheter is cleaned, disinfected and sterilized by the plasma method.
For the silicon treatment on the surface of the catheter, an organic solvent needs to be used, which will cause pollution to the environment. The material used in the oxygen plasma method is oxygen or air, which does not pollute the environment. It is an environmentally friendly new surface treatment. method. There was no significant difference in the infrared absorption of these major groups before and after sample treatment. The energy of the active particles in the plasma is generally several to a dozen eV, while the chemical bond energy in the rubber material molecules is mostly 3-6 eV. The energy of the particles in the plasma is greater than or equal to the bonding energy of the rubber material molecules, so the bonding bonds can be broken to form new bonds, but because its energy is much lower than that of the radiation, the plasma treatment only occurs on the surface of the substrate, while the Does not damage the substrate.
Etching-deposition is a pair of opposite and simultaneous chemical reactions that the plasma acts on the surface of the material to be treated. The oxygen plasma treats the film wrapped on the surface of the catheter, and its chemical structure is similar to that of the rubber material. This is practically beneficial as it avoids harmful side effects due to surface treatments. The contact angle of the catheter surface was 84° without treatment, 67° after treatment with oxygen plasma, and decreased by 17° after treatment, indicating that the hydrophilicity of the catheter was better improved. After the surface of the urinary catheter is treated by oxygen plasma, etching occurs, the surface is clean, and a small amount of hydrophilic groups are generated, thereby improving its hydrophilic performance and reducing the contact angle.
After the oxygen plasma treatment, the burrs on the surface of the catheter are passivated, the coarse particles become smaller, and the surface becomes smooth. This is consistent with the measurement results of the surface contact angle. Causes of catheter etching include physical sputtering as well as chemical etching. The very low content of charged active species in the plasma plays an extremely important role in the surface treatment of materials. Since the moving speed of electrons is much greater than that of ions, the surface potential of the material placed in the plasma is negative relative to the plasma potential (called the drift potential. The high-speed electrons excite, ionize or break the reactive molecules into free radical fragments, The positive ions continuously bombard the surface of the material to be treated, which significantly affects the chemical reaction that occurs on the surface.
Chemical etching is due to the fact that the energy of the active particles in the plasma is close to or slightly greater than the bond energy of the chemical bonds of the molecules of the material being processed. The closeness of this energy level makes the chemical bonds of the catheter material molecules exposed to the plasma easily broken, or the formation of small molecules from the matrix, or the formation of new chemical bonds, resulting in cross-linking, or the formation of free radicals. The effect of chemical etching is not obvious; from the results of SEM analysis, the effect of physical sputtering is obvious; the measurement results of contact angle suggest that physical sputtering and chemical etching work at the same time. Therefore, it can be inferred that the role of physical sputtering in the initial stage of oxygen plasma treatment on the catheter surface is dominant. Oxygen plasma treatment of the surface of the catheter leads to its surface etching, which makes the surface smooth and hydrophilic. The chemical structure of the surface film formed by the oxygen plasma treatment does not change much, so as to avoid the side effects of the urinary catheter in practical application.

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