Welcome to Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd.

E-mail:shaobo@sfi-crf.com

img
搜索
确认
取消
News Center

News Center

Professional plasma plasma high-tech enterprise dedicated to providing manufacturing equipment and process solutions for the electronics industry
News

The application of plasma automatic cleaning machine processing circuit board LED bonding packaging technology

  • Categories:Technical Support
  • Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
  • Origin:
  • Time of issue:2022-07-13
  • Views:

(Summary description)The application of plasma automatic cleaning machine processing circuit board LED bonding packaging technology: Printed circuit boards, printed boards, PCBs, etc. are also called printed boards. The printed circuit board is prone to problems such as unclear printing, blurred printing, easy falling off of ink or non-staining of the printed circuit board during the printing process. The main reasons for this phenomenon are: first, the green paint surface of the circuit board is not clean, with oil stains, sweat stains, particles and other dirt; second, the ink quality is poor, and the amount of ink is insufficient, which has little effect. Third, the squeegee is not sharp enough or is blurred due to improper operation during the screen printing process. LED is more and more favored by people because of its high light efficiency, low power consumption, health and environmental protection (no ultraviolet, infrared, no radiation), protection of eyesight, long life and other advantages, and is known as the 21st century. new light source. In the packaging process LEDLED will produce pollution and oxidation. The bonding colloid between the lampshade and the lamp holder is not strong enough, and there are tiny gaps, air enters through the gap, and gradually causes the surface of the electrode to oxidize, resulting in the death of the lamp holder. The application of plasma automatic cleaning machine cleaning technology to clean LED packaging products does not pollute the environment, environmental protection and no pollution, which can solve this problem for LED packaging manufacturers. To solve the above problems. Mainly consider the following issues: whether the screen frame is in good condition, whether the image production is clear, whether the ink scraping is correct, whether the screen frame is installed smoothly, whether the pressure is uniform, whether the screen frame height is balanced, and whether the ink is scraped and printed. Is the pressure appropriate. After the above conditions are met, the plasma automatic cleaning machine can be used to remove glue for the manufacturing process of soft and hard boards, high-frequency PTFE, multi-layer soft boards, etc. cleaning etc. It can solve the problem of unclear printing in PCB production. There are two main reasons for the weak bonding of fluorescent diodes. In the production process, the surface will inevitably be contaminated with many pollutants (such as organic substances, oxides, epoxy resin, particles, etc.), thus affecting the bonding effect. Light-emitting diodes are mainly made of difficult-to-stick plastics such as polypropylene and PE. This kind of plastic has the characteristics of low surface energy, poor wettability, high crystallinity, good non-polarity of molecular chain and fragile edge. In the bonding and packaging process, it is easy to cause the phenomenon of loose glue opening. Plasma cleaning of electronic parts: Because the plasma is positive and negative ions, the potential value of the plasma cleaning machine for electronic parts is zero. Avoid short circuit of circuit boards and damage to electronic equipment. Plasma automatic cleaning machine can provide ultra-precise circuit board cleaning, destaticization, dust removal, area activated plasma, and solve the problem of poor coating adhesion performance. Applying an ultra-thin, long-term stable selective anti-corrosion coating on the surface of electronic components can prevent electronic components from being corroded or damaged in extreme weather conditions. The plasma automatic cleaning machine equipment properly solves these two problems during the LED lamp plasma cleaning process. The plasma automatic cleaning machine acts on the surface of the material, and the positive and negative plasma generated can realize the physical and chemical cleaning of the surface of the LED material. Removal of contaminants down to the nanometer level, can remove surface contaminants such as organics, oxides, epoxy, particles, etc. When processing PP/PE and other plastics, the plasma generated by the automatic plasma cleaning machine pretreats the parts that need to be bonded through surface activation, surface corrosion, surface grafting, surface polymerization, etc., so that the non-polar materials are activated. This ensures reliable bonding and long-term sealing.

The application of plasma automatic cleaning machine processing circuit board LED bonding packaging technology

(Summary description)The application of plasma automatic cleaning machine processing circuit board LED bonding packaging technology:
Printed circuit boards, printed boards, PCBs, etc. are also called printed boards. The printed circuit board is prone to problems such as unclear printing, blurred printing, easy falling off of ink or non-staining of the printed circuit board during the printing process. The main reasons for this phenomenon are: first, the green paint surface of the circuit board is not clean, with oil stains, sweat stains, particles and other dirt; second, the ink quality is poor, and the amount of ink is insufficient, which has little effect. Third, the squeegee is not sharp enough or is blurred due to improper operation during the screen printing process. LED is more and more favored by people because of its high light efficiency, low power consumption, health and environmental protection (no ultraviolet, infrared, no radiation), protection of eyesight, long life and other advantages, and is known as the 21st century. new light source. In the packaging process LEDLED will produce pollution and oxidation. The bonding colloid between the lampshade and the lamp holder is not strong enough, and there are tiny gaps, air enters through the gap, and gradually causes the surface of the electrode to oxidize, resulting in the death of the lamp holder. The application of plasma automatic cleaning machine cleaning technology to clean LED packaging products does not pollute the environment, environmental protection and no pollution, which can solve this problem for LED packaging manufacturers.
To solve the above problems. Mainly consider the following issues: whether the screen frame is in good condition, whether the image production is clear, whether the ink scraping is correct, whether the screen frame is installed smoothly, whether the pressure is uniform, whether the screen frame height is balanced, and whether the ink is scraped and printed. Is the pressure appropriate. After the above conditions are met, the plasma automatic cleaning machine can be used to remove glue for the manufacturing process of soft and hard boards, high-frequency PTFE, multi-layer soft boards, etc. cleaning etc. It can solve the problem of unclear printing in PCB production. There are two main reasons for the weak bonding of fluorescent diodes. In the production process, the surface will inevitably be contaminated with many pollutants (such as organic substances, oxides, epoxy resin, particles, etc.), thus affecting the bonding effect. Light-emitting diodes are mainly made of difficult-to-stick plastics such as polypropylene and PE. This kind of plastic has the characteristics of low surface energy, poor wettability, high crystallinity, good non-polarity of molecular chain and fragile edge. In the bonding and packaging process, it is easy to cause the phenomenon of loose glue opening.
Plasma cleaning of electronic parts: Because the plasma is positive and negative ions, the potential value of the plasma cleaning machine for electronic parts is zero. Avoid short circuit of circuit boards and damage to electronic equipment. Plasma automatic cleaning machine can provide ultra-precise circuit board cleaning, destaticization, dust removal, area activated plasma, and solve the problem of poor coating adhesion performance. Applying an ultra-thin, long-term stable selective anti-corrosion coating on the surface of electronic components can prevent electronic components from being corroded or damaged in extreme weather conditions. The plasma automatic cleaning machine equipment properly solves these two problems during the LED lamp plasma cleaning process. The plasma automatic cleaning machine acts on the surface of the material, and the positive and negative plasma generated can realize the physical and chemical cleaning of the surface of the LED material. Removal of contaminants down to the nanometer level, can remove surface contaminants such as organics, oxides, epoxy, particles, etc. When processing PP/PE and other plastics, the plasma generated by the automatic plasma cleaning machine pretreats the parts that need to be bonded through surface activation, surface corrosion, surface grafting, surface polymerization, etc., so that the non-polar materials are activated. This ensures reliable bonding and long-term sealing.

  • Categories:Technical Support
  • Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
  • Origin:
  • Time of issue:2022-07-13 10:29
  • Views:
Information

The application of plasma automatic cleaning machine processing circuit board LED bonding packaging technology:
Printed circuit boards, printed boards, PCBs, etc. are also called printed boards. The printed circuit board is prone to problems such as unclear printing, blurred printing, easy falling off of ink or non-staining of the printed circuit board during the printing process. The main reasons for this phenomenon are: first, the green paint surface of the circuit board is not clean, with oil stains, sweat stains, particles and other dirt; second, the ink quality is poor, and the amount of ink is insufficient, which has little effect. Third, the squeegee is not sharp enough or is blurred due to improper operation during the screen printing process. LED is more and more favored by people because of its high light efficiency, low power consumption, health and environmental protection (no ultraviolet, infrared, no radiation), protection of eyesight, long life and other advantages, and is known as the 21st century. new light source. In the packaging process LEDLED will produce pollution and oxidation. The bonding colloid between the lampshade and the lamp holder is not strong enough, and there are tiny gaps, air enters through the gap, and gradually causes the surface of the electrode to oxidize, resulting in the death of the lamp holder. The application of plasma automatic cleaning machine cleaning technology to clean LED packaging products does not pollute the environment, environmental protection and no pollution, which can solve this problem for LED packaging manufacturers.

To solve the above problems. Mainly consider the following issues: whether the screen frame is in good condition, whether the image production is clear, whether the ink scraping is correct, whether the screen frame is installed smoothly, whether the pressure is uniform, whether the screen frame height is balanced, and whether the ink is scraped and printed. Is the pressure appropriate. After the above conditions are met, the plasma automatic cleaning machine can be used to remove glue for the manufacturing process of soft and hard boards, high-frequency PTFE, multi-layer soft boards, etc. cleaning etc. It can solve the problem of unclear printing in PCB production. There are two main reasons for the weak bonding of fluorescent diodes. In the production process, the surface will inevitably be contaminated with many pollutants (such as organic substances, oxides, epoxy resin, particles, etc.), thus affecting the bonding effect. Light-emitting diodes are mainly made of difficult-to-stick plastics such as polypropylene and PE. This kind of plastic has the characteristics of low surface energy, poor wettability, high crystallinity, good non-polarity of molecular chain and fragile edge. In the bonding and packaging process, it is easy to cause the phenomenon of loose glue opening.
Plasma cleaning of electronic parts: Because the plasma is positive and negative ions, the potential value of the plasma cleaning machine for electronic parts is zero. Avoid short circuit of circuit boards and damage to electronic equipment. Plasma automatic cleaning machine can provide ultra-precise circuit board cleaning, destaticization, dust removal, area activated plasma, and solve the problem of poor coating adhesion performance. Applying an ultra-thin, long-term stable selective anti-corrosion coating on the surface of electronic components can prevent electronic components from being corroded or damaged in extreme weather conditions. The plasma automatic cleaning machine equipment properly solves these two problems during the LED lamp plasma cleaning process. The plasma automatic cleaning machine acts on the surface of the material, and the positive and negative plasma generated can realize the physical and chemical cleaning of the surface of the LED material. Removal of contaminants down to the nanometer level, can remove surface contaminants such as organics, oxides, epoxy, particles, etc. When processing PP/PE and other plastics, the plasma generated by the automatic plasma cleaning machine pretreats the parts that need to be bonded through surface activation, surface corrosion, surface grafting, surface polymerization, etc., so that the non-polar materials are activated. This ensures reliable bonding and long-term sealing.

Scan the QR code to read on your phone

Relevant Information

Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd.

Adhere to quality as the foundation, honesty as the way of business, innovation as the source of development, and service as the pinnacle of value

©Shenzhen Sing Fung Intelligent Manufacturing Co., Ltd. All rights reserved
粤ICP备19006998号
dh

TEL:0755-3367 3020 / 0755-3367 3019

dh

E-mail:sales-sfi@sfi-crf.com

dh

ADD:Mabao Industrial Zone, Huangpu, Baoan District, Shenzhen