Application of plasma Cleaning Machine process in PBGA

• Categories:Industry News
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2020-12-19
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(Summary description)The key preconditions for the bonding process of microelectronic packaging technology are small surface roughness and small contact Angle. In particular, the complex package structure, such as plastic sealed welded ball array (PBGA) package and laminated package structure. PBGA packaging and extension technology is widely used due to its high installation and fixed efficiency and good thermoelectric properties. In the application of PBGA, one of the main problems of plasma cleaning machine is the interface stripping, such as the interface between the chip/plastic sealant and the substrate/plastic sealant. The PBGA package structure is more complex than traditional peripheral lead frame packages, such as the plastic quadrangle flat package (PQFP). In order to avoid peeling, the multilayer interface should have high adhesion strength. Usually the stripping occurs first at the edge of the chip, and within a short period of time, under stress, it expands inward. When the adhesion between the two surfaces disappears, the wafer welding point is directly controlled by the thermal mismatch stress between the chip and the organic substrate. The electrical failure is caused by solder fatigue and cracks after peeling. Plasma cleaning machine is used for cleaning, argon, oxygen plasma gas, more widely used is containing argon oxygen CF4 gas, cleaning effect is better. Plasma cleaning of the substrate improves the peel resistance prior to the adhesion and molding processes in the PBGA. After plasma cleaning, pressure welding reliability is greatly improved.