Welcome to Shenzhen Sing Fung Intelligent Manufacturing Co., Ltd.
E-mail:shaobo@sfi-crf.com
The cleaning characteristics of plasma cleaning machine under different action
- Categories:Company Dynamics
- Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
- Origin:
- Time of issue:2020-10-12
- Views:
(Summary description)Plasma cleaning machine in different role, its cleaning characteristics are also different, the following introduced a few for everyone to discuss oh. 1. Cleaning function: it can remove the weak bonds on the surface of the matrix and typical CH-based organic pollutants and oxides. Main features: for the material surface function and no erosion of the interior, can get a super clean surface, ready for the next process. 2. Etching: The typical gas combination is used to form etchable gas equivalence ionites and organic materials on the surface of the object to produce other gases such as CO, CO2, H2O, etc., so as to achieve the purpose of plasma etching. Main features: uniform etching of material workpiece; No harm to the workpiece substrate; It can effectively remove the foreign matter on the surface and achieve the ideal etching degree. Activation: Three groups -- C=O Carbonyl, -COOH Carboxyl, and OH Hydroxyl -- are formed on the substrate surface. These groups have stable hydrophilic properties and have positive effects on adhesion. Main features: active atoms, free radicals and unsaturated bonds can appear on the surface of the polymer. These active groups react with the active particles in the plasma to generate new active groups, increase the surface energy, change the surface chemical characteristics, and effectively enhance the surface adhesion and adhesion. 4. Coating (grafting and deposition) : In plasma coating and plating, two kinds of gases enter the reaction chamber at the same time, and the gases polymerize under the action of plasma. This application requires more rigor than activation and cleaning. Typical applications are the formation of protective coatings, applied to fuel containers, scratch-proof surfaces, similar to PTFE coating, waterproof coating, etc. Main features: it can make the molecular chain on the surface of the material break to generate new radical, double bond and other active groups, and thus generate crosslinking, grafting and other reactions in the process; The active gases can aggregate on the surface of the material to produce a sedimentary layer. The presence of the sedimentary layer will effectively improve the adhesion, coating and printing of the material surface. Shenzhen Sing Fung Intelligent Manufacturing Co., Ltd. LTD. Is a high-tech enterprise engaged in plasma equipment research and development, manufacturing, production and sales. As a professional plasma equipment manufacturer, has many years of experience in plasma technology services.
The cleaning characteristics of plasma cleaning machine under different action
(Summary description)Plasma cleaning machine in different role, its cleaning characteristics are also different, the following introduced a few for everyone to discuss oh.
1. Cleaning function: it can remove the weak bonds on the surface of the matrix and typical CH-based organic pollutants and oxides.
Main features: for the material surface function and no erosion of the interior, can get a super clean surface, ready for the next process.
2. Etching: The typical gas combination is used to form etchable gas equivalence ionites and organic materials on the surface of the object to produce other gases such as CO, CO2, H2O, etc., so as to achieve the purpose of plasma etching.
Main features: uniform etching of material workpiece; No harm to the workpiece substrate; It can effectively remove the foreign matter on the surface and achieve the ideal etching degree.
Activation: Three groups -- C=O Carbonyl, -COOH Carboxyl, and OH Hydroxyl -- are formed on the substrate surface. These groups have stable hydrophilic properties and have positive effects on adhesion.
Main features: active atoms, free radicals and unsaturated bonds can appear on the surface of the polymer. These active groups react with the active particles in the plasma to generate new active groups, increase the surface energy, change the surface chemical characteristics, and effectively enhance the surface adhesion and adhesion.
4. Coating (grafting and deposition) : In plasma coating and plating, two kinds of gases enter the reaction chamber at the same time, and the gases polymerize under the action of plasma. This application requires more rigor than activation and cleaning. Typical applications are the formation of protective coatings, applied to fuel containers, scratch-proof surfaces, similar to PTFE coating, waterproof coating, etc.
Main features: it can make the molecular chain on the surface of the material break to generate new radical, double bond and other active groups, and thus generate crosslinking, grafting and other reactions in the process; The active gases can aggregate on the surface of the material to produce a sedimentary layer. The presence of the sedimentary layer will effectively improve the adhesion, coating and printing of the material surface.
Shenzhen Sing Fung Intelligent Manufacturing Co., Ltd. LTD. Is a high-tech enterprise engaged in plasma equipment research and development, manufacturing, production and sales. As a professional plasma equipment manufacturer, has many years of experience in plasma technology services.
- Categories:Company Dynamics
- Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
- Origin:
- Time of issue:2020-10-12 09:51
- Views:
The cleaning characteristics of plasma cleaning machine under different action:
Plasma cleaning machine in different role, its cleaning characteristics are also different, the following introduced a few for everyone to discuss oh.
1. Cleaning function: it can remove the weak bonds on the surface of the matrix and typical CH-based organic pollutants and oxides.
Main features: for the material surface function and no erosion of the interior, can get a super clean surface, ready for the next process.
2. Etching: The typical gas combination is used to form etchable gas equivalence ionites and organic materials on the surface of the object to produce other gases such as CO, CO2, H2O, etc., so as to achieve the purpose of plasma etching.
Main features: uniform etching of material workpiece; No harm to the workpiece substrate; It can effectively remove the foreign matter on the surface and achieve the ideal etching degree.
Activation: Three groups -- C=O Carbonyl, -COOH Carboxyl, and OH Hydroxyl -- are formed on the substrate surface. These groups have stable hydrophilic properties and have positive effects on adhesion.
Main features: active atoms, free radicals and unsaturated bonds can appear on the surface of the polymer. These active groups react with the active particles in the plasma to generate new active groups, increase the surface energy, change the surface chemical characteristics, and effectively enhance the surface adhesion and adhesion.
4. Coating (grafting and deposition) : In plasma coating and plating, two kinds of gases enter the reaction chamber at the same time, and the gases polymerize under the action of plasma. This application requires more rigor than activation and cleaning. Typical applications are the formation of protective coatings, applied to fuel containers, scratch-proof surfaces, similar to PTFE coating, waterproof coating, etc.
Main features: it can make the molecular chain on the surface of the material break to generate new radical, double bond and other active groups, and thus generate crosslinking, grafting and other reactions in the process; The active gases can aggregate on the surface of the material to produce a sedimentary layer. The presence of the sedimentary layer will effectively improve the adhesion, coating and printing of the material surface.
Shenzhen Sing Fung Intelligent Manufacturing Co., Ltd. LTD. Is a high-tech enterprise engaged in plasma equipment research and development, manufacturing, production and sales. As a professional plasma equipment manufacturer, has many years of experience in plasma technology services.
Scan the QR code to read on your phone
TEL:0755-3367 3020 / 0755-3367 3019
E-mail:sales-sfi@sfi-crf.com
ADD:Mabao Industrial Zone, Huangpu, Baoan District, Shenzhen