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Plasma Cleaning Process Application of Plasma Cleaning to Bonding Line

  • Categories:Technical Support
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2021-05-07
  • Views:

(Summary description)Plasma Cleaning Process Application of Plasma Cleaning to Bonding Line At present, the development trend of integrated circuit is miniaturization, high power and multi-function, and the users' requirements for the reliability of products are becoming higher and higher, which puts forward many new problems for the microelectronics manufacturing technology and process. The failure of the bonding line is one of the main reasons for the circuit failure in the manufacturing process of Thick and Thin Film Hybrid IC. According to statistics, more than 70% of the product failures of hybrid integrated circuits are caused by the failure of bond lines. The reason is that the bonding zone will inevitably be polluted in the production process. If the bonding zone is directly bonded without treatment, it will cause defects such as false welding, unwelding, low bonding strength and so on, so that the long-term reliability of the product is not guaranteed. Plasma cleaning process can effectively remove photoresist, solvent residue, epoxy spillage and other organic pollutants in the bonding zone. Therefore, plasma cleaning treatment before bonding can greatly reduce the failure rate of bonding and improve the reliability of products. Plasma cleaning has the characteristics of cleaning clean, not damaging the chip, not reducing the adhesion of the film layer, and it has incomparable advantages over conventional liquid phase cleaning: From the working principle, it uses electric energy to produce a low-temperature working environment, without affecting the bonding (welding) of the components and the performance of the components themselves. At the same time, the plasma cleaning also eliminates the danger and trouble caused by chemical reaction. Isogenous cleaning produces gaseous material, rather than liquid waste, which can be discharged directly into the air. This eliminates the need for expensive waste disposal systems. Plasma cleaning is through the selection and adjustment of process parameters such as power, pressure, time, gas type and other process control, easy to operate, simple. In the plasma cleaning process, high-energy electrons collide with gas molecules to dissociate or ionize them. A variety of particles generated can be used to bombardment the surface to be cleaned or react with the surface to be cleaned, so as to effectively remove organic pollutants on the surface to be cleaned or improve the surface state. In the process of plasma cleaning with Ar gas, the huge energy generated by the impact of Ar ions on the surface can remove organic pollutants, and the mechanical energy generated by the bombardment can separate the chemical bonds of large molecules in the polymer into small molecules and vaporize them. In the process of plasma cleaning with O2, oxygen ions react with organic molecules to form H2O or CO2 gasification. When cleaning with a mixture of Ar and O2, the reaction rate is much faster than using any single gas. The argon ion is accelerated by negative bias pressure, and the kinetic energy formed can improve the reaction ability of oxygen. In this way, the surface of the device which is seriously polluted can be cleaned. Plasma cleaning process before bonding Plasma cleaning function: (1) The bonding strength generally increases after cleaning; (2) The range decreases after cleaning; (3) The discreteness of bonding strength decreases after cleaning; (4) Cleaning improves the failure mode. Plasma cleaning process before the bonding line can effectively remove the organic pollutants brought by various processes in the film bonding zone. So as to achieve the purpose of improving the bonding strength and reducing the desoldering. Plasma cleaning can reduce the product failure caused by bonding failure, and provide a powerful process guarantee to increase the long-term reliability of bonding and improve the quality of products.

Plasma Cleaning Process Application of Plasma Cleaning to Bonding Line

(Summary description)Plasma Cleaning Process Application of Plasma Cleaning to Bonding Line

At present, the development trend of integrated circuit is miniaturization, high power and multi-function, and the users' requirements for the reliability of products are becoming higher and higher, which puts forward many new problems for the microelectronics manufacturing technology and process. The failure of the bonding line is one of the main reasons for the circuit failure in the manufacturing process of Thick and Thin Film Hybrid IC. According to statistics, more than 70% of the product failures of hybrid integrated circuits are caused by the failure of bond lines.

The reason is that the bonding zone will inevitably be polluted in the production process. If the bonding zone is directly bonded without treatment, it will cause defects such as false welding, unwelding, low bonding strength and so on, so that the long-term reliability of the product is not guaranteed. Plasma cleaning process can effectively remove photoresist, solvent residue, epoxy spillage and other organic pollutants in the bonding zone. Therefore, plasma cleaning treatment before bonding can greatly reduce the failure rate of bonding and improve the reliability of products.



Plasma cleaning has the characteristics of cleaning clean, not damaging the chip, not reducing the adhesion of the film layer, and it has incomparable advantages over conventional liquid phase cleaning: From the working principle, it uses electric energy to produce a low-temperature working environment, without affecting the bonding (welding) of the components and the performance of the components themselves. At the same time, the plasma cleaning also eliminates the danger and trouble caused by chemical reaction.

Isogenous cleaning produces gaseous material, rather than liquid waste, which can be discharged directly into the air. This eliminates the need for expensive waste disposal systems. Plasma cleaning is through the selection and adjustment of process parameters such as power, pressure, time, gas type and other process control, easy to operate, simple.

In the plasma cleaning process, high-energy electrons collide with gas molecules to dissociate or ionize them. A variety of particles generated can be used to bombardment the surface to be cleaned or react with the surface to be cleaned, so as to effectively remove organic pollutants on the surface to be cleaned or improve the surface state. In the process of plasma cleaning with Ar gas, the huge energy generated by the impact of Ar ions on the surface can remove organic pollutants, and the mechanical energy generated by the bombardment can separate the chemical bonds of large molecules in the polymer into small molecules and vaporize them. In the process of plasma cleaning with O2, oxygen ions react with organic molecules to form H2O or CO2 gasification. When cleaning with a mixture of Ar and O2, the reaction rate is much faster than using any single gas. The argon ion is accelerated by negative bias pressure, and the kinetic energy formed can improve the reaction ability of oxygen. In this way, the surface of the device which is seriously polluted can be cleaned.

Plasma cleaning process before bonding Plasma cleaning function:

(1) The bonding strength generally increases after cleaning;

(2) The range decreases after cleaning;

(3) The discreteness of bonding strength decreases after cleaning;

(4) Cleaning improves the failure mode.

Plasma cleaning process before the bonding line can effectively remove the organic pollutants brought by various processes in the film bonding zone. So as to achieve the purpose of improving the bonding strength and reducing the desoldering. Plasma cleaning can reduce the product failure caused by bonding failure, and provide a powerful process guarantee to increase the long-term reliability of bonding and improve the quality of products.

  • Categories:Technical Support
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2021-05-07 09:06
  • Views:
Information

Plasma Cleaning Process Application of Plasma Cleaning to Bonding Line

At present, the development trend of integrated circuit is miniaturization, high power and multi-function, and the users' requirements for the reliability of products are becoming higher and higher, which puts forward many new problems for the microelectronics manufacturing technology and process. The failure of the bonding line is one of the main reasons for the circuit failure in the manufacturing process of Thick and Thin Film Hybrid IC. According to statistics, more than 70% of the product failures of hybrid integrated circuits are caused by the failure of bond lines.

The reason is that the bonding zone will inevitably be polluted in the production process. If the bonding zone is directly bonded without treatment, it will cause defects such as false welding, unwelding, low bonding strength and so on, so that the long-term reliability of the product is not guaranteed. Plasma cleaning process can effectively remove photoresist, solvent residue, epoxy spillage and other organic pollutants in the bonding zone. Therefore, plasma cleaning treatment before bonding can greatly reduce the failure rate of bonding and improve the reliability of products.

Plasma cleaning process

Plasma cleaning has the characteristics of cleaning clean, not damaging the chip, not reducing the adhesion of the film layer, and it has incomparable advantages over conventional liquid phase cleaning: From the working principle, it uses electric energy to produce a low-temperature working environment, without affecting the bonding (welding) of the components and the performance of the components themselves. At the same time, the plasma cleaning also eliminates the danger and trouble caused by chemical reaction.

Isogenous cleaning produces gaseous material, rather than liquid waste, which can be discharged directly into the air. This eliminates the need for expensive waste disposal systems. Plasma cleaning is through the selection and adjustment of process parameters such as power, pressure, time, gas type and other process control, easy to operate, simple.

In the plasma cleaning process, high-energy electrons collide with gas molecules to dissociate or ionize them. A variety of particles generated can be used to bombardment the surface to be cleaned or react with the surface to be cleaned, so as to effectively remove organic pollutants on the surface to be cleaned or improve the surface state. In the process of plasma cleaning with Ar gas, the huge energy generated by the impact of Ar ions on the surface can remove organic pollutants, and the mechanical energy generated by the bombardment can separate the chemical bonds of large molecules in the polymer into small molecules and vaporize them. In the process of plasma cleaning with O2, oxygen ions react with organic molecules to form H2O or CO2 gasification. When cleaning with a mixture of Ar and O2, the reaction rate is much faster than using any single gas. The argon ion is accelerated by negative bias pressure, and the kinetic energy formed can improve the reaction ability of oxygen. In this way, the surface of the device which is seriously polluted can be cleaned.

Plasma cleaning process before bonding Plasma cleaning function:

(1) The bonding strength generally increases after cleaning;

(2) The range decreases after cleaning;

(3) The discreteness of bonding strength decreases after cleaning;

(4) Cleaning improves the failure mode.

Plasma cleaning process before the bonding line can effectively remove the organic pollutants brought by various processes in the film bonding zone. So as to achieve the purpose of improving the bonding strength and reducing the desoldering. Plasma cleaning can reduce the product failure caused by bonding failure, and provide a powerful process guarantee to increase the long-term reliability of bonding and improve the quality of products.

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