Mechanical structure and function of on-line plasma cleaning machine system equipment

• Categories:Technical Support
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2021-04-07
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(Summary description)As a kind of precision dry cleaning equipment, plasma cleaning machine can effectively remove pollutants in the process of IC packaging, improve the surface performance of materials, and increase the surface energy of materials. Compared with the traditional independent plasma cleaning equipment, the online plasma cleaning equipment has high degree of automation, high cleaning efficiency, high equipment cleanliness, wide application range, and is suitable for large-scale fully automated production. Plasma cleaning technology has the advantages of low cost, easy to use, low maintenance cost and environmental protection. It can be used for surface treatment before chip bonding process, lead bonding and flip chip packaging process. With the deep research and wide application of plasma cleaning technology in the world, the demand for plasma cleaning equipment increases exponentially. However, plasma cleaning is still in its infancy in China. Many companies use plasma cleaning machines are basically imported from abroad. Under the monopoly of developed countries, the price of plasma equipment is relatively high. Therefore, the use of the existing mature plasma cleaning technology and equipment manufacturing base, increase equipment automation function, combining the development of conventional plasma cleaning equipment, reference of foreign equipment structure form, the fully automatic cleaning operation mode that adapted to the integrated circuit module, suitable for mass production of integrated circuit online cleaning equipment, is of great significance. The system on the basis of the mechanical structure of the plasma cleaning system, with reference to separate plasma cleaning, using automatic operation mode, can be linked to upstream and downstream production process, satisfy the requirement of the device packaging industry for mass production, thoroughly remove tiny residue and dirt particles size less than 1 um organic film, greatly improve the surface performance, improve the reliability of the welding, encapsulation, bonding and so on the follow-up process, to ensure that electronic products in the bad environment under the condition of high precision, high reliability. As a kind of precision dry cleaning equipment, on-line plasma cleaning equipment can effectively remove contaminants and improve the surface properties of materials. It has the advantages of high automation, high cleaning efficiency, high cleanliness of equipment and wide application range. On - line plasma cleaning equipment is on the basis of mature plasma cleaning technology and equipment manufacturing, increase the automatic loading and unloading function, material transfer function and other functions. The key is the lead frame in the IC package of pre-treatment cleaning, glue packaging, chip bonding, plastic sealing. While greatly improving the bonding performance and bonding strength, it can avoid the secondary contamination caused by human factors that contact the lead frame for a long time, and the chip damage that may be caused by batch cleaning in the cavity for a long time. The scheme basically meets the design requirements of automatic material handling in on-line plasma cleaning system. Compared with the traditional plasma cleaning system, it reduces the overcost of manual operation and improves the automation level of the equipment.