Plasma cleaning machine working with the use of gas

• Categories:Technical Support
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2020-09-12
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(Summary description)Plasma cleaning machine due to its own characteristics in the process of production of many products have a place for use. In the cleaning process of plasma cleaning machine, it is necessary to cooperate with different gases to achieve the ideal cleaning effect of plasma cleaning machine. Divided by gas: One of the gases used is argon (Ar), an inert gas. In the vacuum chamber cleaning process, argon (Ar) is often used to effectively remove surface nanometer pollutants. It is often used in lead bonding, chip bonding copper lead frame, PBGA and other processes. If you want to increase the corrosion effect, please feed oxygen (O2). By cleaning the vacuum chamber with oxygen (O2), organic pollutants, such as photoresist, can be effectively removed. Oxygen (O2) is more used for high-precision chip bonding, light source cleaning and other processes. Some oxides that are difficult to remove can be cleaned with hydrogen (H2), provided that they are used in a very tight vacuum. There are also special gases similar to carbon tetrafluoride (CF4), sulfur hexafluoride (SF6), etc., which are more effective in etching and removing organic compounds. But the use premise of these gases is to have absolutely corrosion resistant gas path and cavity structure, in addition to their own to wear a good protective cover and gloves to work. Another common gas to talk about is nitrogen. This gas is mainly used in combination with on-line plasma for surface activation and modification of materials. It can also be used in a vacuum. Nitrogen (N2) is the best choice to improve the surface permeability of materials. Now the plasma cleaning machine is usually a 2-way gas, sometimes we will try to mix the gas proportion with cleaning, to achieve different effects.