Vacuum plasma processing system CRF-VPO-10L-S

Large processing space, increase processing capacity, adopt PLC + touch screen control system, accurately control equipment operation;

The capacity and number of layers of the equipment cavity can be customized according to customer requirements to meet customer needs; maintenance and repair costs are low, which is convenient for customer cost control;

High precision, fast response, good controllability and compatibility, perfect functions and professional technical support.

 

Vacuum plasma cleaning manufacturer machine suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: activation of the surface of high-frequency boards, surface cleaning of multilayer boards, de-drilling stains, surface cleaning of soft boards and rigid-flex board, de-drilling stains, activation of soft boards before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire bonding and welding; silica gel, plastic, polymer field: surface roughening, etching, and activation of silica gel, plastic, and polymer.