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Professional plasma plasma high-tech enterprise dedicated to providing manufacturing equipment and process solutions for the electronics industry

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Vacuum plasma processing system CRF-VPO-2L-S
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Vacuum plasma processing system CRF-VPO-2L-S

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Model:
CRF-VPO-2L-S
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Description
Parameters
Parameters
Features
Large processing space, increase processing capacity, adopt PLC + touch screen control system, accurately control equipment operation;
The capacity and number of layers of the equipment cavity can be customized according to customer requirements to meet customer needs; maintenance and repair costs are low, which is convenient for customer cost control;
High precision, fast response, good controllability and compatibility, perfect functions and professional technical support.
 
Scope of application
Vacuum plasma system machine suitable for printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: activation of the surface of high-frequency boards, surface cleaning of multilayer boards, de-drilling stains, surface cleaning of soft boards and rigid-flex board, de-drilling stains, activation of soft boards before reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before wire bonding and welding; silica gel, plastic, polymer field: surface roughening, etching, and activation of silica gel, plastic, and polymer.
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Name

Vacuum plasma processing system

Model

CRF-VPO-2L-S

Control system

PLC+touch screen

Power supply

380V/AC,50/60Hz, 3kw

RF Power

1000W/40KHz

Volume

10L(Option)

Electrode of plies

2(Option)

Area

220(W)*230(D)*230(H)

Gas

Two working gas options: Ar, N2, CF4, O2

 

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Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd.

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TEL:0755-3367 3020 / 0755-3367 3019

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E-mail:sales-sfi@sfi-crf.com

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ADD:Mabao Industrial Zone, Huangpu, Baoan District, Shenzhen