The use of plasma plasma surface treatment cleaning machine pretreatment technology on wafers

• Categories:Technical Support
• Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
• Origin:
• Time of issue:2022-04-07
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(Summary description)The use of plasma plasma surface treatment cleaning machine pretreatment technology on wafers: The connection quality of the chip leads is a key factor affecting the reliability of the device. The lead connection area should be guaranteed to be free of pollution and the connection effect should be good. The presence of contaminants such as oxides, organic residues, etc. will seriously impair the pull value of the lead connections. The traditional wet cleaning does not completely remove or cannot remove the contaminants in the bonding area, while plasma cleaning can effectively remove the surface dirt on the bonding area and activate the surface, which can significantly improve the bonding strength of the leads. Greatly improve the reliability of packaged devices. During the bonding process, there is often a certain adhesiveness between the chip and the package substrate. This bonding is usually hydrophobic and inert, and the bonding performance is poor. It can effectively improve the surface activity of the wafer, greatly improve the fluidity of the bonding epoxy resin on the surface of the wafer and the package substrate, and increase the efficiency of the wafer and the package. adhesion between substratesWetability, reduce the delamination of the chip and the substrate, increase the reliability and stability of the chip package, and prolong the service life of the product. The glow plasma produced by plasma surface treatment and cleaning machine can effectively remove the original contaminants and impurities on the surface of the treated material, and can produce etching to make the surface of the sample rough, form many tiny pits, and increase the contact area, improve the wettability of the surface (as the saying goes, enhance the adhesion of the surface, enhance the hydrophilicity). Plasma plasma surface treatment cleaning machine has a wide range of applications, which can solve technical problems such as bonding, printing, spraying, and destaticization, and achieve the goals pursued by modern manufacturing processes such as high quality, high reliability, high efficiency, low cost, and environmental protection. . Many factory operators, when using plasma surface treatment equipment, always consult the manufacturer, how dangerous is the plasma surface treatment equipment? Plasma plasma surface treatment cleaners produce trace amounts of ozone when they start up. Ozone gas is basically harmless to the human body. However, if the use environment is relatively closed and the ventilation conditions are poor, it will be too high, causing the surrounding people to smell irritating odors and causing slight dizziness and headache. Therefore, the production workshop of plasma equipment needs to keep unblocked with the outside air. If the use space is relatively closed and the ventilation conditions are poor, a special ventilation system needs to be installed. In flip-chip packaging, the use of plasma treatment technology to process the chip and the package carrier can not only achieve ultra-cleaning of the surface of the weld, but also significantly improve the activity of the weld, which can effectively prevent false welding and reduce voids. To improve the reliability of welding, it can also improve the edge height and tolerance of the welding seam, improve the mechanical strength of the package, reduce the internal shear force formed between the interfaces due to the thermal expansion coefficient of different materials, and improve the reliability of the product. life. The glow generated by the plasma surface treatment cleaning machine when it is in close contact can cause a burning sensation in the human body. Therefore, the material cannot be touched by hand when the plasma beam is processing the material. Generally, the distance between the direct injection plasma nozzle and the nozzle is 50 mm, and the distance between the rotating plasma nozzle and the nozzle is 30 mm (different distances for different types of equipment). In order to ensure the safe operation of the equipment, please use AC220V/380V power supply, and do a good job of grounding to ensure that the air supply source is dry and clean. The plastic packaging type of the lead frame still accounts for more than 80% of the microelectronic packaging field. The delamination of the copper lead frame leads to poor sealing performance after encapsulation, and leads to chronic outgassing. It also affects the bonding and wire bonding quality of the chip. To ensure the ultra-cleanness of the lead frame is to ensure the reliability of the package. And the key to the yield, the plasma treatment of the plasma surface treatment cleaning machine can realize the ultra-cleaning and activation of the surface of the lead frame. Compared with the traditional wet cleaning, the yield of the finished product is greatly improved, and there is no waste water discharge, reducing the chemical The purchase cost of the potion. Porcelain products are encapsulated, usuall