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The application of plasma cleaner technology in semiconductor wafer cleaning has become a mature process

  • Categories:Industry News
  • Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
  • Origin:
  • Time of issue:2022-03-23
  • Views:

(Summary description)The application of plasma cleaner technology in semiconductor wafer cleaning has become a mature process: In the semiconductor production process, almost every process needs to be cleaned, and the quality of wafer cleaning has a serious impact on device performance. It is precisely because wafer cleaning is an important and frequent process in the semiconductor manufacturing process, and its process quality will directly affect the yield, performance and reliability of the device, so major domestic and foreign companies, research institutions and other research on the cleaning process. It's been going on and on. As an advanced dry cleaning technology, plasma cleaning machine has the characteristics of green and environmental protection. With the rapid development of the microelectronics industry, plasma cleaning machine technology is also used more and more in the semiconductor industry. With the continuous development of semiconductor technology, the requirements for process technology are getting higher and higher, especially for the surface quality of semiconductor wafers. The main reason is that the contamination of particles and metal impurities on the surface of wafers will seriously affect In terms of device quality and yield, in the current integrated circuit production, more than 50% of the material is still lost due to the contamination problem on the wafer surface. Application of plasma cleaner in semiconductor wafer cleaning process. Plasma cleaning has the problems of simple process, convenient operation, no waste disposal and environmental pollution. But it cannot remove carbon and other non-volatile metal or metal oxide impurities. Plasma cleaning machines are often used in the removal process of photoresist. A small amount of oxygen is introduced into the plasma reaction system, and under the action of a strong electric field, the oxygen generates plasma, and the photoresist is rapidly oxidized into a volatile gaseous substance. was taken away. In the degumming process, the plasma cleaning machine has the advantages of convenient operation, high efficiency, clean surface, no scratches, and it is beneficial to ensure the quality of the product. Moreover, it does not use acids, alkalis and organic solvents as cleaning raw materials, and does not pollute the environment. Plasma treatment technology is an irreplaceable mature process, no matter in the implantation of chip source ions, or the coating of wafers, or what our low-temperature plasma surface treatment equipment can achieve: removal of oxidation on the surface of wafers Ultra-purification treatment and surface activation of film, organic matter, demasking, etc., improve the wettability of wafer surface. The application scope of plasma cleaning machine technology mainly includes medical equipment, sterilization, disinfection, glue box, optical cable factory, cable factory, university laboratory cleaning experimental tools, shoe soles and shoe uppers are bonded, automotive glass coating film before. Cleaning, plasma treatment to make the bond stronger, bonding work on car lights, bonding of glass and iron, textiles, plastics, paper, printing and optoelectronic materials or metals, etc., can all be treated by plasma.

The application of plasma cleaner technology in semiconductor wafer cleaning has become a mature process

(Summary description)The application of plasma cleaner technology in semiconductor wafer cleaning has become a mature process:
In the semiconductor production process, almost every process needs to be cleaned, and the quality of wafer cleaning has a serious impact on device performance. It is precisely because wafer cleaning is an important and frequent process in the semiconductor manufacturing process, and its process quality will directly affect the yield, performance and reliability of the device, so major domestic and foreign companies, research institutions and other research on the cleaning process. It's been going on and on. As an advanced dry cleaning technology, plasma cleaning machine has the characteristics of green and environmental protection. With the rapid development of the microelectronics industry, plasma cleaning machine technology is also used more and more in the semiconductor industry.
With the continuous development of semiconductor technology, the requirements for process technology are getting higher and higher, especially for the surface quality of semiconductor wafers. The main reason is that the contamination of particles and metal impurities on the surface of wafers will seriously affect In terms of device quality and yield, in the current integrated circuit production, more than 50% of the material is still lost due to the contamination problem on the wafer surface.
Application of plasma cleaner in semiconductor wafer cleaning process. Plasma cleaning has the problems of simple process, convenient operation, no waste disposal and environmental pollution. But it cannot remove carbon and other non-volatile metal or metal oxide impurities. Plasma cleaning machines are often used in the removal process of photoresist. A small amount of oxygen is introduced into the plasma reaction system, and under the action of a strong electric field, the oxygen generates plasma, and the photoresist is rapidly oxidized into a volatile gaseous substance. was taken away. In the degumming process, the plasma cleaning machine has the advantages of convenient operation, high efficiency, clean surface, no scratches, and it is beneficial to ensure the quality of the product. Moreover, it does not use acids, alkalis and organic solvents as cleaning raw materials, and does not pollute the environment.
Plasma treatment technology is an irreplaceable mature process, no matter in the implantation of chip source ions, or the coating of wafers, or what our low-temperature plasma surface treatment equipment can achieve: removal of oxidation on the surface of wafers Ultra-purification treatment and surface activation of film, organic matter, demasking, etc., improve the wettability of wafer surface.
The application scope of plasma cleaning machine technology mainly includes medical equipment, sterilization, disinfection, glue box, optical cable factory, cable factory, university laboratory cleaning experimental tools, shoe soles and shoe uppers are bonded, automotive glass coating film before. Cleaning, plasma treatment to make the bond stronger, bonding work on car lights, bonding of glass and iron, textiles, plastics, paper, printing and optoelectronic materials or metals, etc., can all be treated by plasma.

  • Categories:Industry News
  • Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
  • Origin:
  • Time of issue:2022-03-23 17:30
  • Views:
Information

The application of plasma cleaner technology in semiconductor wafer cleaning has become a mature process:
In the semiconductor production process, almost every process needs to be cleaned, and the quality of wafer cleaning has a serious impact on device performance. It is precisely because wafer cleaning is an important and frequent process in the semiconductor manufacturing process, and its process quality will directly affect the yield, performance and reliability of the device, so major domestic and foreign companies, research institutions and other research on the cleaning process. It's been going on and on. As an advanced dry cleaning technology, plasma cleaning machine has the characteristics of green and environmental protection. With the rapid development of the microelectronics industry, plasma cleaning machine technology is also used more and more in the semiconductor industry.

With the continuous development of semiconductor technology, the requirements for process technology are getting higher and higher, especially for the surface quality of semiconductor wafers. The main reason is that the contamination of particles and metal impurities on the surface of wafers will seriously affect In terms of device quality and yield, in the current integrated circuit production, more than 50% of the material is still lost due to the contamination problem on the wafer surface.
Application of plasma cleaner in semiconductor wafer cleaning process. Plasma cleaning has the problems of simple process, convenient operation, no waste disposal and environmental pollution. But it cannot remove carbon and other non-volatile metal or metal oxide impurities. Plasma cleaning machines are often used in the removal process of photoresist. A small amount of oxygen is introduced into the plasma reaction system, and under the action of a strong electric field, the oxygen generates plasma, and the photoresist is rapidly oxidized into a volatile gaseous substance. was taken away. In the degumming process, the plasma cleaning machine has the advantages of convenient operation, high efficiency, clean surface, no scratches, and it is beneficial to ensure the quality of the product. Moreover, it does not use acids, alkalis and organic solvents as cleaning raw materials, and does not pollute the environment.
Plasma treatment technology is an irreplaceable mature process, no matter in the implantation of chip source ions, or the coating of wafers, or what our low-temperature plasma surface treatment equipment can achieve: removal of oxidation on the surface of wafers Ultra-purification treatment and surface activation of film, organic matter, demasking, etc., improve the wettability of wafer surface.
The application scope of plasma cleaning machine technology mainly includes medical equipment, sterilization, disinfection, glue box, optical cable factory, cable factory, university laboratory cleaning experimental tools, shoe soles and shoe uppers are bonded, automotive glass coating film before. Cleaning, plasma treatment to make the bond stronger, bonding work on car lights, bonding of glass and iron, textiles, plastics, paper, printing and optoelectronic materials or metals, etc., can all be treated by plasma.

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