Vacuum plasma surface cleaning machine circuit board plasma treatment changes in chemical and physica

• Categories:Company Dynamics
• Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
• Origin:
• Time of issue:2022-03-07
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(Summary description)Vacuum plasma surface cleaning machine circuit board plasma treatment changes in chemical and physical: The operation process, timeliness and treatment plan of the processing line of the vacuum plasma surface cleaning machine, the high-energy plasma is generated by the radio frequency power supply under a certain pressure, and then the surface of the processed surface object is bombarded by the plasma to produce a microscopic surface peeling effect. In the vacuum chamber, a high-energy plasma is generated by the radio frequency power supply under a certain pressure, and then the surface of the machined object is bombarded by the plasma to produce a microscopic surface peeling effect (the peeling depth can be adjusted by adjusting the plasma bombardment time. , The role of plasma is nano-scale, so it will not damage the processing object) to achieve the purpose of operation. Vacuum plasma surface cleaning machine reactive plasma means that the active particles in the plasma can chemically react with the surface of the refractory material, thereby introducing a large number of polar groups, making the surface of the material change from non-polar to polar, and increasing the surface tension , the bondability is enhanced. Reactive plasma active gases are mainly O2, H2, NH3, CO2, H20, S02, HVH20, air, glycerol vapor and ethanol vapor. Under the action of the plasma, some active atoms, free radicals and unsaturated bonds appear on the surface of the refractory plastic. These active groups will react with the active particles in the plasma to generate new active groups. However, materials with active groups will be affected by the action of oxygen or the movement of molecular segments, causing the surface active groups to disappear. Before the circuit board (FPC/PCB) is shipped, the surface will be cleaned with a vacuum plasma surface cleaning machine plasma. Under normal circumstances, downstream customers of circuit boards will conduct incoming inspections of products, such as Wire Bonding Test, Wire Pull Test, etc. When the surface is not cleaned, there are often some contaminations that lead to testing. Fail. In order to avoid the above problems, surface plasma cleaning before shipment has become a trend in this era of increasing pursuit of quality. Because the plasma treatment of vacuum plasma surface cleaning machine is manifested in chemical changes and physical changes. In the physical change, the surface of the material is modified and roughened, and the number of protrusions on the surface after etching increases, increasing the surface area. If exposed to polluted air, mixed with dust, oil, impurities, the surface energy will gradually decrease. During chemical changes, oxygen-containing polar groups, such as hydroxyl and carboxyl groups, are introduced during plasma treatment. These active molecules are time-sensitive and are prone to chemical changes with other substances. The surface energy retention time after treatment is not easy to determine. Different gases, power, processing time, and placement environment will have an impact on the surface aging of the material. The proven aging of FPC products after cleaning is: 1 week (confirmed with contact angle measurement data, the smaller the contact angle value, the higher the dyne value).