Chengfeng Zhizhi plasma cleaning technology has been widely used in many fields

• Categories:Company Dynamics
• Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
• Origin:
• Time of issue:2021-11-18
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(Summary description)Chengfeng Zhizhi plasma cleaning technology has been widely used in many fields: Among IC packaging types, Quad Flat Package (QFPS) and Thin Small Outline Package (TSOP) are two types of packaging required by the current packaging density trend. In the past few years, Ball Grid Array Package (BGAS) has been recognized as a standard package type, especially the Plastic Ball Grid Array Package (PBGAS), which provides millions of them each year. Plasma cleaning technology is widely used in PBGAS and flip chip processes and other polymer-based substrates to facilitate bonding and reduce delamination. Plasma cleaning technology is usually introduced in the following steps in IC packaging: before chip bonding and wire bonding, and before chip packaging. Before epoxy conductive adhesive sheet, if the front surface of the carrier is cleaned with plasma equipment, it can improve the adhesion of epoxy resin, remove oxides to facilitate solder reflow, improve the connection between the chip and the carrier, reduce the peeling phenomenon, and improve Heat dissipation performance. When eutectic sintering the chip onto the carrier with alloy solder, if the quality of solder reflow and sintering is affected due to contamination or old surface on the carrier, cleaning the carrier with plasma before sintering is also effective to ensure the sintering quality. Before wire bonding, plasma cleaning the pad and substrate will significantly improve the bonding strength and the uniformity of the bond wire tension. Cleaning the bonding points means removing the thin, contaminated surface. When the IC is plasticized, it is required that the plastic packaging material and various materials such as chips, carriers, and metal bonding feet have good adhesion. If there is contamination or poor surface activity, it will cause the surface layer of the plastic package to peel off. Packaging after plasma cleaning can effectively improve surface activity, improve adhesion, and improve packaging reliability. After the substrate and chip are cleaned by plasma, one of the indicators for detecting whether there is a cleaning effect is the wettability of the surface. The contact angle of the pad packaging tape before and after plasma treatment is measured, and the contact angle of the sample before and after plasma cleaning is: 70° to 80° before cleaning on the solder fill paint, 15° to 20° after cleaning; contaminated gold plating The contact angle of the solder joints before cleaning is 60° to 70°, and after cleaning, it is less than 20° or lower. Of course, the contact angle measurement can only be used as an indication method to obtain the expected results. That is to say, there are also two factors: wire bond thickness and good mold adhesion. Moreover, the cleaning effects of different manufacturers, different products and different cleaning processes are different, which shows that the improvement of wetting characteristics. It is very beneficial for plasma cleaning technology to be used before the packaging process. Plasma cleaning technology has been widely used in many fields and has become an essential equipment in many precision manufacturing industries. Plasma technology combines plasma physics, chemistry, and chemical reactions at the gas-solid interface. It spans a variety of fields, including chemical engineering, materials, and energy. Therefore, it will be extremely challenging and full of opportunities. With the rapid growth of semiconductors and optoelectronic materials in the future, the application demand in this area will also increase.