Application in surface treatment of special plasma equipment for wafer processing by Chengfeng Zhizhi

• Categories:Industry News
• Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
• Origin:
• Time of issue:2021-11-16
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(Summary description)Application in surface treatment of special plasma equipment for wafer processing by Chengfeng Zhizhi: Wafer processing is a large part of the capital investment in the domestic semiconductor industry chain. Plasma equipment is currently widely used in silicon wafer foundry. Chengfeng Zhizhi also has special wafer processing plasma equipment. The foundry part of China has invested a lot of money in the entire semiconductor industry chain. Specifically, foundry is to manufacture circuits and electronic components on silicon wafers. For the entire semiconductor industry chain, this step is more complex in technology and has a wide range of investment areas. Plasma equipment is mainly used to remove particles on the surface of the wafer, completely remove photoresist and other organic compounds, activate and roughen the surface of the wafer, improve the wettability of the wafer surface, etc. The plasma equipment has a significant effect on wafer surface treatment. , Currently widely used in wafer processing. The photolithography wafer process is an important process in the entire foundry process. The principle of this method is to cover the surface of the wafer with a high light-sensitivity light-blocking layer, and then irradiate light to the surface of the wafer through the mask, and the light-blocking agent irradiated by the light will react, thereby Realize the movement of the circuit. Wafer etching: the process of exposing the surface area of ​​the wafer with photoresist. It is mainly divided into two types: wet etching and dry etching. In short, wet etching is limited to a pattern size of 2 microns, while dry etching is used for finer and more demanding circuits. Plasma processing for wafer-level packaging is a dry cleaning method that has the characteristics of good consistency and controllability. At present, plasma equipment has been gradually popularized and applied in lithography and etching processes. If you are interested in the equipment or want to know more details, please click Chengfeng Zhizao online customer service consultation, Chengfeng Zhizao is waiting for your call!