The function of plasma cleaning machine to clean micro holes

• Categories:Industry News
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2020-08-14
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(Summary description)With the miniaturization of the aperture of THE HDI plate, the traditional chemical cleaning process can no longer meet the requirements of the cleaning of the blind hole structure, and the liquid surface tension makes it difficult for the liquid to penetrate into the hole, especially when treating the laser drilling microblind hole plate, the reliability is not good. At present, the hole cleaning technology applied to the microburied blind hole mainly includes supergenerated wave cleaning and plasma cleaning, while ultrasonic cleaning mainly achieves the purpose of cleaning based on cavitation effect. It belongs to wet treatment, and the cleaning time is long, and it depends on the deconvolution performance of the cleaning liquid, which increases the disposal problem of the waste liquid. At present, the commonly used process is mainly plasma cleaning process. The plasma treatment process is simple, environmentally friendly, and the cleaning effect is obvious, which is very effective for blind hole structure. Plasma cleaning means that highly activated plasma moves in direction under the action of electric field, and has gas-solid chemical reaction with drilling pollution of hole wall, and at the same time, the generated gas products and some non-reactive particles are discharged by air pump. In the first stage, high purity N2 is used to generate the plasma, and the printed board is preheated at the same time, so that the polymer material is in a certain activated state. In the second stage, O2 and CF4 are used as the original gases. After mixing, O and F plasma is generated, which reacts with acrylic acid, PI, FR4 and glass fiber, etc., to achieve the purpose of decontamination. In the third stage, O2 is used as the original gas, and the generated plasma and reaction residue make the hole wall clean. In the process of plasma cleaning, in addition to plasma chemical reaction, the plasma also has physical reaction with the material surface. Plasma particles knock off the atoms on the surface of the material or the atoms attached to the surface of the material, which is conducive to cleaning the etching reaction. With the development of materials and technology, the structure of buried blind hole will become smaller and more refined. In to fill the holes, blind holes on plating using the traditional chemical degumming slag method will be more and more difficult, and plasma processing cleaning method can effectively get rid of disadvantages of wet method in addition to the glue residue, can achieve the blind hole and small hole is better cleaning effect, which can guarantee the blind hole plating when fill hole to achieve good effect.