Precautions when selecting oxygen, hydrogen, and nitrogen for vacuum plasma processor

• Categories:Company Dynamics
• Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
• Origin:
• Time of issue:2021-11-09
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(Summary description)Precautions when selecting oxygen, hydrogen, and nitrogen for vacuum plasma processor: There are many materials processed by the surface treatment technology of the vacuum plasma processor. They have different processing requirements and uses. At this time, the process gas we choose will be different. The process gas used in the surface treatment of the plasma processor is oxygen, Argon, nitrogen, compressed air hydrogen, carbon tetrafluoride, etc., are commonly used in oxygen, hydrogen, and nitrogen. The gases selected by the plasma processor technology are these three process gases. What should be paid attention to? How to choose? 1. The gas selected is oxygen: Oxygen is mainly used for surface activation of polymer materials and removal of organic pollutants, but it cannot be used for easy oxidation of metal surfaces. In the vacuum plasma state of the vacuum plasma processor, the oxygen plasma is light blue, and part of the discharge is white; the light in the environment is bright, and the discharge in the vacuum chamber may not be seen when observed with the naked eye. 2. The selected gas is hydrogen: As a process gas, hydrogen is widely used in industries such as microelectronics, semiconductors, and circuit board manufacturing. When using hydrogen, pay attention: because hydrogen is a dangerous gas, it will self-detonate when combined with oxygen without ionization. Therefore, it is generally not allowed to mix the two gases in the vacuum plasma processor equipment. In the vacuum plasma state, hydrogen plasma is red, similar to argon plasma, and slightly deeper than argon plasma under the same discharge environment. 3. The gas is selected as nitrogen: Nitrogen particles are heavier. It is a gas between activated gas and inert gas. It can achieve bombardment and etching, and it can also prevent oxidation of part of the metal surface. Plasma, which is a mixture of nitrogen and other gases, is usually used to process some special materials. In the vacuum plasma state, nitrogen plasma appears red, and under the same discharge environment, nitrogen plasma is brighter than argon plasma and hydrogen plasma. The above are the precautions when choosing oxygen, hydrogen, and nitrogen for the vacuum plasma processor. If you want to know more product details or have questions about the use of the equipment, please click on the online customer service consultation of Chengfeng Zhizao, and Chengfeng Zhizao is waiting for you Call!