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Plasma cleaner precision electronic package packaging and coating substrate surface cleanliness activation

  • Categories:Industry News
  • Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
  • Origin:
  • Time of issue:2021-11-07
  • Views:

(Summary description)Plasma cleaner precision electronic package packaging and coating substrate surface cleanliness activation: As a traditional mainstream high-efficiency cleaning process, solvent cleaning is widely used in various industries, but it is more complicated in the management of the cleaning process of precision electronic devices; and with the precision microelectronics process technology and coating film on the surface cleanliness of the substrate The strict requirements of activation energy and their application limitations are self-evident. Plasma cleaner technology, as a new type of surface treatment and dry cleaning process, has been well-known to everyone in recent years with the continuous intensification of its application research in various industries, especially the precision electronics industry. Plasma's solvent-free dry fine cleaning can play an important role in the elimination of ODS and organic volatile VOC cleaning agents. Compared with solvent cleaning, it has the characteristics of simple process, low cost, environmental protection and energy saving. It can also be used as a solvent type. An important supplement to deep cleaning. Plasma cleaner cleaning can be applied to various substrates and optical glass, such as surface activation, modification, and cleaning treatment before touch screen, printing, laminating, spraying, inkjet and other processes, thereby improving the surface of the material Joint durability and strength. The physical and chemical cleaning methods that have been widely used at present can be roughly divided into two categories: wet cleaning and dry cleaning. Wet cleaning is mainly based on solvent-based cleaning as the mainstream, and dry cleaning is characterized by plasma cleaning and is popular. Pay attention to. With the high requirements for surface cleanliness and activation energy of precision electronic assembly (encapsulation) and coated substrates, precision cleaning has become indispensable in related manufacturing processes. For example, before high-density interconnect HDI, PCB PTH plating, semiconductor chips, solar panels, touch screen glass, plastic, ceramic, metal and polymer panels are coated or bonded, BGAFip Chip, LCD, LED, IC chips And bracket packaging or assembly, the potting process after PCBA soldering, the dispensing encapsulation of IC pins or soldering ends, the underfill of the chip, the "three-proof" coating on the surface of the circuit board, etc. Pretreatment for cleaning or cleaning. In the packaging process, effective cleaning of the chip (DIE), wire support, PCB soldering pad, PCBA "three-proof" coating, underfilling of the bottom solder end device BTC, and potting of the whole machine and devices, we only have to ensure Workpieces such as PCBA&PCB bonding interface pads are clean in order to obtain sufficient surface to achieve the effectiveness and durability of bonding. For this reason, it is very important to use proper cleaning processes for bonding chips, substrates or substrates. Adding a dry plasma cleaner process cleaning after the traditional solvent cleaning can more effectively eliminate organic residues and oxides. Dry plasma technology is very effective for removing organic photoresist (ashing) and other contaminants. In the integrated pretreatment step, the natural oxide layer can be removed, and the decontamination can be achieved through the chemical reaction of gas and plasma energy. Purpose. Plasma, as a refined new cleaning process, has its shortcomings: it has no obvious cleaning effect on hardened solder and other inorganic substances and deep grease dirt, but it has a more obvious cleaning effect on all slight organic substances, so it is more effective. It is used for fine cleaning or replenishment after solvent cleaning. Plasma cleaners do not need to use solvents and water for cleaning, and there is no pollution problem; the process is relatively simple, and there is no need for operation steps such as drying after cleaning, and it is especially suitable for fine and high-quality cleaning of the surface of precision workpieces. Plasma cleaners can be used to clean all kinds of PCB through holes, solder pads, substrates and optical glass touch screens, and surface activation, cleaning, coating, and coating before printing, laminating, spraying, inkjet, and electroplating , Modification, connection technique, roughening, etc. Activation: greatly improve the wetting performance of the surface to form an active surface; cleaning: remove dust and oil, fine cleaning and electrostatic discharge (ESD); coating: provide a functional surface through surface coating treatment and improve surface adhesion Capability and reliability and durability of surface bonding. Plasma can not only effectively remove organic dirt on the surface of high molecular polymers, but also can be used to finely clean the surface of PCBA and PCB, ceramic panels, glass panels, metal panels and other materials. Plasma cleaners can treat the surfac

Plasma cleaner precision electronic package packaging and coating substrate surface cleanliness activation

(Summary description)Plasma cleaner precision electronic package packaging and coating substrate surface cleanliness activation:
As a traditional mainstream high-efficiency cleaning process, solvent cleaning is widely used in various industries, but it is more complicated in the management of the cleaning process of precision electronic devices; and with the precision microelectronics process technology and coating film on the surface cleanliness of the substrate The strict requirements of activation energy and their application limitations are self-evident.
Plasma cleaner technology, as a new type of surface treatment and dry cleaning process, has been well-known to everyone in recent years with the continuous intensification of its application research in various industries, especially the precision electronics industry. Plasma's solvent-free dry fine cleaning can play an important role in the elimination of ODS and organic volatile VOC cleaning agents. Compared with solvent cleaning, it has the characteristics of simple process, low cost, environmental protection and energy saving. It can also be used as a solvent type. An important supplement to deep cleaning.
Plasma cleaner cleaning can be applied to various substrates and optical glass, such as surface activation, modification, and cleaning treatment before touch screen, printing, laminating, spraying, inkjet and other processes, thereby improving the surface of the material Joint durability and strength. The physical and chemical cleaning methods that have been widely used at present can be roughly divided into two categories: wet cleaning and dry cleaning. Wet cleaning is mainly based on solvent-based cleaning as the mainstream, and dry cleaning is characterized by plasma cleaning and is popular. Pay attention to.
With the high requirements for surface cleanliness and activation energy of precision electronic assembly (encapsulation) and coated substrates, precision cleaning has become indispensable in related manufacturing processes. For example, before high-density interconnect HDI, PCB PTH plating, semiconductor chips, solar panels, touch screen glass, plastic, ceramic, metal and polymer panels are coated or bonded, BGAFip Chip, LCD, LED, IC chips And bracket packaging or assembly, the potting process after PCBA soldering, the dispensing encapsulation of IC pins or soldering ends, the underfill of the chip, the "three-proof" coating on the surface of the circuit board, etc. Pretreatment for cleaning or cleaning.
In the packaging process, effective cleaning of the chip (DIE), wire support, PCB soldering pad, PCBA "three-proof" coating, underfilling of the bottom solder end device BTC, and potting of the whole machine and devices, we only have to ensure Workpieces such as PCBA&PCB bonding interface pads are clean in order to obtain sufficient surface to achieve the effectiveness and durability of bonding. For this reason, it is very important to use proper cleaning processes for bonding chips, substrates or substrates.
Adding a dry plasma cleaner process cleaning after the traditional solvent cleaning can more effectively eliminate organic residues and oxides.
Dry plasma technology is very effective for removing organic photoresist (ashing) and other contaminants. In the integrated pretreatment step, the natural oxide layer can be removed, and the decontamination can be achieved through the chemical reaction of gas and plasma energy. Purpose. Plasma, as a refined new cleaning process, has its shortcomings: it has no obvious cleaning effect on hardened solder and other inorganic substances and deep grease dirt, but it has a more obvious cleaning effect on all slight organic substances, so it is more effective. It is used for fine cleaning or replenishment after solvent cleaning.
Plasma cleaners do not need to use solvents and water for cleaning, and there is no pollution problem; the process is relatively simple, and there is no need for operation steps such as drying after cleaning, and it is especially suitable for fine and high-quality cleaning of the surface of precision workpieces. Plasma cleaners can be used to clean all kinds of PCB through holes, solder pads, substrates and optical glass touch screens, and surface activation, cleaning, coating, and coating before printing, laminating, spraying, inkjet, and electroplating , Modification, connection technique, roughening, etc.
Activation: greatly improve the wetting performance of the surface to form an active surface; cleaning: remove dust and oil, fine cleaning and electrostatic discharge (ESD); coating: provide a functional surface through surface coating treatment and improve surface adhesion Capability and reliability and durability of surface bonding.
Plasma can not only effectively remove organic dirt on the surface of high molecular polymers, but also can be used to finely clean the surface of PCBA and PCB, ceramic panels, glass panels, metal panels and other materials. Plasma cleaners can treat the surfac

  • Categories:Industry News
  • Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
  • Origin:
  • Time of issue:2021-11-07 22:34
  • Views:
Information

Plasma cleaner precision electronic package packaging and coating substrate surface cleanliness activation:
As a traditional mainstream high-efficiency cleaning process, solvent cleaning is widely used in various industries, but it is more complicated in the management of the cleaning process of precision electronic devices; and with the precision microelectronics process technology and coating film on the surface cleanliness of the substrate The strict requirements of activation energy and their application limitations are self-evident.

PlasmaPlasma cleaner technology, as a new type of surface treatment and dry cleaning process, has been well-known to everyone in recent years with the continuous intensification of its application research in various industries, especially the precision electronics industry. Plasma's solvent-free dry fine cleaning can play an important role in the elimination of ODS and organic volatile VOC cleaning agents. Compared with solvent cleaning, it has the characteristics of simple process, low cost, environmental protection and energy saving. It can also be used as a solvent type. An important supplement to deep cleaning.
Plasma cleaner cleaning can be applied to various substrates and optical glass, such as surface activation, modification, and cleaning treatment before touch screen, printing, laminating, spraying, inkjet and other processes, thereby improving the surface of the material Joint durability and strength. The physical and chemical cleaning methods that have been widely used at present can be roughly divided into two categories: wet cleaning and dry cleaning. Wet cleaning is mainly based on solvent-based cleaning as the mainstream, and dry cleaning is characterized by plasma cleaning and is popular. Pay attention to.
With the high requirements for surface cleanliness and activation energy of precision electronic assembly (encapsulation) and coated substrates, precision cleaning has become indispensable in related manufacturing processes. For example, before high-density interconnect HDI, PCB PTH plating, semiconductor chips, solar panels, touch screen glass, plastic, ceramic, metal and polymer panels are coated or bonded, BGAFip Chip, LCD, LED, IC chips And bracket packaging or assembly, the potting process after PCBA soldering, the dispensing encapsulation of IC pins or soldering ends, the underfill of the chip, the "three-proof" coating on the surface of the circuit board, etc. Pretreatment for cleaning or cleaning.
In the packaging process, effective cleaning of the chip (DIE), wire support, PCB soldering pad, PCBA "three-proof" coating, underfilling of the bottom solder end device BTC, and potting of the whole machine and devices, we only have to ensure Workpieces such as PCBA&PCB bonding interface pads are clean in order to obtain sufficient surface to achieve the effectiveness and durability of bonding. For this reason, it is very important to use proper cleaning processes for bonding chips, substrates or substrates.
Adding a dry plasma cleaner process cleaning after the traditional solvent cleaning can more effectively eliminate organic residues and oxides.
Dry plasma technology is very effective for removing organic photoresist (ashing) and other contaminants. In the integrated pretreatment step, the natural oxide layer can be removed, and the decontamination can be achieved through the chemical reaction of gas and plasma energy. Purpose. Plasma, as a refined new cleaning process, has its shortcomings: it has no obvious cleaning effect on hardened solder and other inorganic substances and deep grease dirt, but it has a more obvious cleaning effect on all slight organic substances, so it is more effective. It is used for fine cleaning or replenishment after solvent cleaning.
Plasma cleaners do not need to use solvents and water for cleaning, and there is no pollution problem; the process is relatively simple, and there is no need for operation steps such as drying after cleaning, and it is especially suitable for fine and high-quality cleaning of the surface of precision workpieces. Plasma cleaners can be used to clean all kinds of PCB through holes, solder pads, substrates and optical glass touch screens, and surface activation, cleaning, coating, and coating before printing, laminating, spraying, inkjet, and electroplating , Modification, connection technique, roughening, etc.
Activation: greatly improve the wetting performance of the surface to form an active surface; cleaning: remove dust and oil, fine cleaning and electrostatic discharge (ESD); coating: provide a functional surface through surface coating treatment and improve surface adhesion Capability and reliability and durability of surface bonding.
Plasma can not only effectively remove organic dirt on the surface of high molecular polymers, but also can be used to finely clean the surface of PCBA and PCB, ceramic panels, glass panels, metal panels and other materials. Plasma cleaners can treat the surface of these materials. Removal of contaminants, increase of surface energy, surface modification, thereby improving the bonding or bonding process in the subsequent process.

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