application areas of plasma plasma flame treatment machine

application areas of plasma plasma flame treatment machine:
The plasma plasma flame treatment machine is mainly suitable for surface modification treatment of various materials: surface cleaning, surface activation, surface etching, surface grafting, surface deposition, surface polymerization and plasma-assisted chemical vapor deposition.
Surface modification: paper bonding, plastic bonding, metal soldering, surface treatment before electroplating;
Surface activation: surface modification of biological materials, surface treatment before printing, coating or bonding, such as surface treatment of textiles;
Surface etching: micro-processing of silicon, surface etching treatment in solar energy fields such as glass, and surface etching treatment of medical utensils;
Surface grafting: the generation of specific groups on the surface of the material and the fixation of surface activation;
Surface deposition: plasma polymerization deposition of hydrophobic or hydrophilic layer;
Plasma plasma flame treatment machine is widely used in metal, microelectronics, polymers, biological functional materials, low temperature sterilization and pollution control and other fields. It is the ideal equipment for plasma surface treatment of enterprises and research institutes.
1. Application of plasma plasma flame processor in microelectronic packaging
In the production process of microelectronic packaging, various surface contaminations, including organic matter, epoxy resin, photoresist and solder, metal salt, etc., will be formed due to various fingerprints, fluxes, cross-contamination, natural oxidation, devices and materials. These stains will have a significant impact on the packaging production process and quality. The use of plasma cleaning machine can easily remove the contamination formed in the molecular-level production process to ensure that atoms and atoms are in close contact with the surface of the workpiece, thereby effectively improving the bonding strength, improving the quality of wafer bonding, and reducing the leakage rate , Improve packaging performance, output and component reliability.
The choice of the cleaning process of plasma plasma flame treatment machine for electronic packaging depends on the requirements of subsequent processes on the surface of the material, the original characteristic chemical composition and the nature of the contaminants on the surface of the material. Commonly used in plasma cleaning gas argon, oxygen, hydrogen, carbon tetrafluoride and their mixed gases. Table, choice of plasma cleaning technology application.
Small silver glue village bottom: Pollutants will cause the colloidal silver to be spherical, which is not conducive to chip sticking, and it is easy to stab the chip manual. The use of radio frequency plasma cleaning can greatly improve the surface roughness and hydrophilicity, which is beneficial to the silver colloid and Tiles are pasted with chips, and the amount of use at the same time can save silver glue and reduce costs.
Wire bonding: Before the chip is bonded to the substrate and after high temperature curing, the existing contaminants may contain microparticles and oxides. The physical and chemical reactions of these contaminants lead and the soldering between the chip and the substrate is incomplete, and the bonding strength is poor. , Adhesion is not enough. Before wire bonding, plasma cleaning by plasma plasma flame treatment machine can significantly improve the surface activity and increase the bonding strength and tensile strength of the bonding wire. The pressure on the welding head can be low (when there are contaminants, the welding head penetrates the contaminants, more pressure is required), and in some cases, the bonding temperature can also be lowered, thereby increasing production and reducing costs.
Sealing glue: In the epoxy resin process, pollutants will cause high foaming rate, resulting in low product quality and service life, so in order to avoid the formation of sealing foam, we also pay attention to it. After the radio frequency plasma cleaning, the chip and the substrate will be more closely combined with the colloid, the foam formed will be greatly reduced, and the heat dissipation rate and light emissivity will be significantly improved.
⒉The mechanism of plasma plasma flame treatment machine in rubber and plastic industry products
I have found in industrial applications that some rubber and plastic parts have difficulty in bonding when they are connected to the surface. This is because polypropylene, PTFE and other rubber and plastic materials have no polarity. These materials have not undergone surface treatment. The effect of printing, bonding, coating, etc. in the state of being very poor, or even impossible.
Some processes use some chemicals to treat these stolen plastic surfaces, which can change the bonding effect of the material, but this method is not easy to master. The chemicals themselves are toxic, the operation is very troublesome, and the cost is high. The original excellent properties of plastic materials also have an impact.
Use plasma plasma flame treatment machine plasma technology to perform surface treatment on these materials. Under the bombardment of high-speed and high-energy plasma, the surface of these materials can be enlarged, and an active layer is formed on the surface of the material, so that rubber and plastic can be processed. Printing, bonding, coating and other operations. The application of plasma technology to the surface treatment of rubber and plastic has simple operation, no harmful substances before and after treatment, good treatment effect, high efficiency and low operating cost.
3. The role of plasma plasma flame treatment machine to clean tiny holes
With the miniaturization of the diameter of the HD plate, the traditional chemical cleaning process can no longer meet the cleaning of the blind hole structure. The surface tension of the liquid makes it difficult for the liquid to penetrate into the hole, especially when processing the laser drilled micro blind hole plate. It is not good. Currently, the main hole cleaning processes used in micro-holes include ultrasonic cleaning and plasma cleaning. Ultrasonic cleaning is mainly based on the cavitation effect to achieve the purpose of cleaning. It belongs to wet processing, and the cleaning time is longer and depends on the cleaning. The decontamination performance of the liquid increases the problem of the disposal of the waste liquid.
The commonly used process at this stage is mainly the plasma cleaning process of plasma plasma flame treatment machine. The plasma treatment process is simple, environmentally friendly, and has obvious cleaning effects. It is very effective for blind hole structures.
Plasma cleaning refers to the directional movement of highly activated plasma under the action of an electric field, and a gas-solidification reaction with the drilling dirt on the hole wall. At the same time, the generated gas products and some unreacted particles are discharged by the air pump. Plasma is generally divided into three steps when cleaning the blind holes of HD boards. In the first stage, high-purity N2 is used to generate plasma, while the printed board is preheated to make the polymer material in a certain activated state; the second stage is with O2, CF4 is the original gas. After mixing, it produces 0, F plasma, which reacts with acrylic acid, PI, FR4, glass fiber, etc., to achieve the purpose of de-drilling; the third stage uses O2 as the original gas, and the generated plasma and reaction residues Make the hole wall clean.
In the plasma cleaning process, in addition to the plasma chemical reaction, the plasma of the plasma plasma flame treatment machine also physically reacts with the surface of the material. The plasma particles knock off the atoms on the surface of the material or the atoms on the surface of the attached material, which is helpful for cleaning the etching reaction.
With the development of materials and technology, the realization of the buried straight hole structure will become smaller and more refined; when the blind hole is electroplated and filled, it will be more and more difficult to use the traditional chemical de-smear method , And the cleaning method of plasma treatment can well overcome the shortcomings of wet desmears, can achieve a better cleaning effect on blind holes and micro holes, so as to ensure that a good effect is achieved when the blind holes are electroplated and filled.
4. Plasma plasma flame treatment machine technology is applied to the treatment of ignition coils
With the development of the automotive industry, its performance requirements in all aspects are getting higher and higher. Ignition wire casting can improve power, and the obvious effect is to improve the low-to-medium-speed torque when traveling; eliminate carbon deposits, better protect the engine, and extend the life of the engine; reduce or eliminate the resonance of the engine; fully burn the fuel and reduce emissions, etc. Many functions. To make the ignition wire fully play its role, its quality, reliability, service life and other requirements must meet the standards, but the current ignition coil production process still has a big problem-after the ignition coil frame is poured with epoxy resin, Because the skeleton contains volatile oil stains on the front surface of the mold, the bonding between the skeleton and the epoxy resin is not reliable. When the finished product is used, the temperature rises at the moment of ignition, which will cause bubbles and damage in the tiny gaps on the bonding surface. Ignition coils may explode in serious cases.
After the ignition coil skeleton is plasma treated by a plasma plasma flame treatment machine, it can not only remove the hardly volatile oil on the surface, but also greatly improve the surface activity of the skeleton, that is, it can improve the bonding strength of the skeleton and the epoxy resin, avoid the generation of bubbles, and at the same time Improve the welding strength between the enameled wire and the skeleton contact after winding. As a result, the performance of the ignition coil in all aspects of the production process is significantly improved, and the reliability and service life are improved.
The major feature of plasma cleaning technology of plasma plasma flame treatment machine is that regardless of the type of substrate to be treated, it can be processed. It can treat metals, semiconductors, oxides and most polymer materials, such as polypropylene, polyester, and polyamide. Imine, polyvinyl chloride, epoxy, and even polytetrafluoroethylene can be handled well, and can be used to clean the whole, part and complex structure. The application of plasma cleaning technology has matured first, and its related output value has increased year by year. The output value of foreign markets is higher than that of the domestic market, but the domestic development space is large and the application prospects are attractive.