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Application of atmospheric pressure plasma cleaner surface treatment technology in microelectronics industry

  • Categories:Technical Support
  • Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
  • Origin:
  • Time of issue:2021-08-12
  • Views:

(Summary description)Application of atmospheric pressure plasma cleaner surface treatment technology in microelectronics industry: At present, the surface treatment technology of atmospheric pressure plasma cleaners has gradually become an indispensable type of technology in the production and processing process of the microelectronics industry. However, in the fields of microelectronics and automobile manufacturing, people often call plasma surface treatment equipment "plasma cleaning machine". With the development of process technology, plasma treatment equipment is more and more widely used, and plasma treatment technology is gradually becoming Familiar to the public. On this day, we would like to communicate with you about the application of atmospheric pressure plasma cleaner plasma surface treatment technology in the microelectronics industry. If you encounter problems in the manufacturing process, I hope this article can help you. Traditional cleaning methods, such as mechanical cleaning, water cleaning, solvent cleaning, etc., are not thoroughly cleaned, and the surface of the processed material will still have a thickness of several nanometers to tens of nanometers, which affects the welding and bonding properties of the device. In industrial production, the reliability requirements of products are not strict, and there is a certain amount of cleaning residues during use. However, with the gradual improvement of the requirements for precision and reliability, more and more microelectronics manufacturers Looking for new surface cleaning methods, and atmospheric pressure plasma surface treatment technology can achieve ultra-clean and thorough cleaning of the device surface, improve product reliability, increase product yield, and reduce production costs. In terms of pollution sources, the pollutants on the surface of microelectronic devices are mainly the adhesion of foreign molecules and the two kinds of oxide layers formed naturally on the surface of the device in contact with the environment. The surface treatment technology of the plasma cleaner can effectively treat these two types of surface contaminants, but the appropriate treatment gas must be selected first. Oxygen and argon are more common in the surface treatment of electronic components. Therefore, how do oxygen plasma cleaning equipment and argon plasma cleaning equipment achieve efficient cleaning? 1. Oxygen can be ionized under the action of alternating electric field to form a large number of oxygen-containing active groups, which can effectively remove organic pollutants on the surface of the component, and at the same time can adsorb the groups to the surface of the component, effectively improving the component For example, in microelectronic packaging technology, plasma treatment before plastic packaging is also a typical application. The surface of the component after plasma treatment has a higher surface energy, which can be combined with the molding compound, and reduce the delamination and pinholes that occur during the molding process. 2. Argon gas can form argon ions, and can use the self-biased sputtering generated on the surface of the material to eliminate foreign molecules adsorbed on the surface and effectively remove surface metal oxides. Plasma treatment before wire bonding of microelectronics is a typical process. On the surface of the pad after plasma treatment, organic pollutants and oxides are removed, which can effectively improve the reliability of the welding line and the welding line, and improve the yield rate. In addition to the selection of process gas, various factors such as plasma power supply, electrode structure, reaction pressure, etc., will have different effects on the treatment effect during the surface treatment process of the atmospheric pressure plasma cleaner. Chengfeng Zhizao focuses on the research and development and manufacturing of plasma technology. If you want to have a more detailed understanding of the equipment or have questions about the use of the equipment, please click on the online customer service of Chengfeng Zhizao. Chengfeng Zhizao is waiting for your call!

Application of atmospheric pressure plasma cleaner surface treatment technology in microelectronics industry

(Summary description)Application of atmospheric pressure plasma cleaner surface treatment technology in microelectronics industry:
At present, the surface treatment technology of atmospheric pressure plasma cleaners has gradually become an indispensable type of technology in the production and processing process of the microelectronics industry. However, in the fields of microelectronics and automobile manufacturing, people often call plasma surface treatment equipment "plasma cleaning machine". With the development of process technology, plasma treatment equipment is more and more widely used, and plasma treatment technology is gradually becoming Familiar to the public. On this day, we would like to communicate with you about the application of atmospheric pressure plasma cleaner plasma surface treatment technology in the microelectronics industry. If you encounter problems in the manufacturing process, I hope this article can help you.
Traditional cleaning methods, such as mechanical cleaning, water cleaning, solvent cleaning, etc., are not thoroughly cleaned, and the surface of the processed material will still have a thickness of several nanometers to tens of nanometers, which affects the welding and bonding properties of the device. In industrial production, the reliability requirements of products are not strict, and there is a certain amount of cleaning residues during use. However, with the gradual improvement of the requirements for precision and reliability, more and more microelectronics manufacturers Looking for new surface cleaning methods, and atmospheric pressure plasma surface treatment technology can achieve ultra-clean and thorough cleaning of the device surface, improve product reliability, increase product yield, and reduce production costs.
In terms of pollution sources, the pollutants on the surface of microelectronic devices are mainly the adhesion of foreign molecules and the two kinds of oxide layers formed naturally on the surface of the device in contact with the environment. The surface treatment technology of the plasma cleaner can effectively treat these two types of surface contaminants, but the appropriate treatment gas must be selected first. Oxygen and argon are more common in the surface treatment of electronic components. Therefore, how do oxygen plasma cleaning equipment and argon plasma cleaning equipment achieve efficient cleaning?
1. Oxygen can be ionized under the action of alternating electric field to form a large number of oxygen-containing active groups, which can effectively remove organic pollutants on the surface of the component, and at the same time can adsorb the groups to the surface of the component, effectively improving the component For example, in microelectronic packaging technology, plasma treatment before plastic packaging is also a typical application. The surface of the component after plasma treatment has a higher surface energy, which can be combined with the molding compound, and reduce the delamination and pinholes that occur during the molding process.
2. Argon gas can form argon ions, and can use the self-biased sputtering generated on the surface of the material to eliminate foreign molecules adsorbed on the surface and effectively remove surface metal oxides. Plasma treatment before wire bonding of microelectronics is a typical process. On the surface of the pad after plasma treatment, organic pollutants and oxides are removed, which can effectively improve the reliability of the welding line and the welding line, and improve the yield rate.
In addition to the selection of process gas, various factors such as plasma power supply, electrode structure, reaction pressure, etc., will have different effects on the treatment effect during the surface treatment process of the atmospheric pressure plasma cleaner.
Chengfeng Zhizao focuses on the research and development and manufacturing of plasma technology. If you want to have a more detailed understanding of the equipment or have questions about the use of the equipment, please click on the online customer service of Chengfeng Zhizao. Chengfeng Zhizao is waiting for your call!

  • Categories:Technical Support
  • Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
  • Origin:
  • Time of issue:2021-08-12 22:29
  • Views:
Information

Application of atmospheric pressure plasma cleaner surface treatment technology in microelectronics industry:
At present, the surface treatment technology of atmospheric pressure plasma cleaners has gradually become an indispensable type of technology in the production and processing process of the microelectronics industry. However, in the fields of microelectronics and automobile manufacturing, people often call plasma surface treatment equipment "plasma cleaning machine". With the development of process technology, plasma treatment equipment is more and more widely used, and plasma treatment technology is gradually becoming Familiar to the public. On this day, we would like to communicate with you about the application of atmospheric pressure plasma cleaner plasma surface treatment technology in the microelectronics industry. If you encounter problems in the manufacturing process, I hope this article can help you.

Plasma cleaning Traditional cleaning methods, such as mechanical cleaning, water cleaning, solvent cleaning, etc., are not thoroughly cleaned, and the surface of the processed material will still have a thickness of several nanometers to tens of nanometers, which affects the welding and bonding properties of the device. In industrial production, the reliability requirements of products are not strict, and there is a certain amount of cleaning residues during use. However, with the gradual improvement of the requirements for precision and reliability, more and more microelectronics manufacturers Looking for new surface cleaning methods, and atmospheric pressure plasma surface treatment technology can achieve ultra-clean and thorough cleaning of the device surface, improve product reliability, increase product yield, and reduce production costs.
In terms of pollution sources, the pollutants on the surface of microelectronic devices are mainly the adhesion of foreign molecules and the two kinds of oxide layers formed naturally on the surface of the device in contact with the environment. The surface treatment technology of the plasma cleaner can effectively treat these two types of surface contaminants, but the appropriate treatment gas must be selected first. Oxygen and argon are more common in the surface treatment of electronic components. Therefore, how do oxygen plasma cleaning equipment and argon plasma cleaning equipment achieve efficient cleaning?
1. Oxygen can be ionized under the action of alternating electric field to form a large number of oxygen-containing active groups, which can effectively remove organic pollutants on the surface of the component, and at the same time can adsorb the groups to the surface of the component, effectively improving the component For example, in microelectronic packaging technology, plasma treatment before plastic packaging is also a typical application. The surface of the component after plasma treatment has a higher surface energy, which can be combined with the molding compound, and reduce the delamination and pinholes that occur during the molding process.
2. Argon gas can form argon ions, and can use the self-biased sputtering generated on the surface of the material to eliminate foreign molecules adsorbed on the surface and effectively remove surface metal oxides. Plasma treatment before wire bonding of microelectronics is a typical process. On the surface of the pad after plasma treatment, organic pollutants and oxides are removed, which can effectively improve the reliability of the welding line and the welding line, and improve the yield rate.
In addition to the selection of process gas, various factors such as plasma power supply, electrode structure, reaction pressure, etc., will have different effects on the treatment effect during the surface treatment process of the atmospheric pressure plasma cleaner.
Chengfeng Zhizao focuses on the research and development and manufacturing of plasma technology. If you want to have a more detailed understanding of the equipment or have questions about the use of the equipment, please click on the online customer service of Chengfeng Zhizao. Chengfeng Zhizao is waiting for your call!

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