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The role of plasma cleaning machine equipment plasma surface treatment of tiny holes

  • Categories:Technical Support
  • Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing Origin
  • Origin:
  • Time of issue:2021-07-25
  • Views:

(Summary description)The role of plasma cleaning machine equipment plasma surface treatment of tiny holes: Plasma cleaning equipment is mainly suitable for surface modification treatment of various materials: surface cleaning, surface activation, surface etching, surface deposition, surface treatment and plasma-assisted chemical vapor deposition. With the miniaturization of the diameter of HDI plates, traditional chemical cleaning processes can no longer meet the requirements of cleaning blind hole structures. The surface tension of the liquid makes it difficult for the liquid to penetrate into the holes, especially when processing laser-drilled micro blind holes. not good. At present, the hole cleaning process applied to micro-buried blind holes mainly includes ultrasonic cleaning and plasma cleaning of plasma cleaning machine equipment. Ultrasonic cleaning is mainly based on the cavitation effect to achieve the purpose of cleaning. It belongs to wet processing, and the cleaning time is longer and depends on The decontamination performance of the cleaning liquid increases the problem of waste liquid treatment. The commonly used process at this stage is mainly the plasma cleaning process. The plasma treatment process is simple and environmentally friendly, the cleaning effect is obvious, and it is very effective for the blind hole structure. Plasma cleaner equipment cleaning refers to the directional movement of highly activated plasma under the action of an electric field, and the gas curing reaction occurs with the drilling dirt on the hole wall, and the generated gas products and some unreacted particles are discharged by the air pump. Plasma is generally divided into three steps when cleaning the blind holes of HDI boards. In the first stage, high-purity N2 is used to generate plasma, while the printed board is preheated to make the polymer material in a certain activated state; the second stage is with O2, CF4 is the original gas, which produces O and F plasma after mixing, which reacts with acrylic acid, PI, FR4, glass fiber, etc. to achieve the purpose of de-drilling; the third stage uses O2 as the original gas, and the generated plasma and reaction residues Make the hole wall clean. In the plasma cleaning process, in addition to the plasma chemical reaction, the plasma also physically reacts with the surface of the material. The plasma particles knock off the atoms on the surface of the material or the atoms on the surface of the attached material, which is helpful for cleaning the etching reaction. With the development of materials and technology, the realization of the buried blind hole structure will become smaller and more refined; when the blind hole is electroplated and filled, it will be more and more difficult to use the traditional chemical desmear method , And the cleaning method of plasma treatment of plasma cleaning machine equipment can well overcome the shortcomings of wet desmear, and can achieve a better cleaning effect on blind holes and micro holes, so as to ensure that the blind holes are electroplated and filled. good effect.

The role of plasma cleaning machine equipment plasma surface treatment of tiny holes

(Summary description)The role of plasma cleaning machine equipment plasma surface treatment of tiny holes:
Plasma cleaning equipment is mainly suitable for surface modification treatment of various materials: surface cleaning, surface activation, surface etching, surface deposition, surface treatment and plasma-assisted chemical vapor deposition.
With the miniaturization of the diameter of HDI plates, traditional chemical cleaning processes can no longer meet the requirements of cleaning blind hole structures. The surface tension of the liquid makes it difficult for the liquid to penetrate into the holes, especially when processing laser-drilled micro blind holes. not good. At present, the hole cleaning process applied to micro-buried blind holes mainly includes ultrasonic cleaning and plasma cleaning of plasma cleaning machine equipment. Ultrasonic cleaning is mainly based on the cavitation effect to achieve the purpose of cleaning. It belongs to wet processing, and the cleaning time is longer and depends on The decontamination performance of the cleaning liquid increases the problem of waste liquid treatment.
The commonly used process at this stage is mainly the plasma cleaning process. The plasma treatment process is simple and environmentally friendly, the cleaning effect is obvious, and it is very effective for the blind hole structure.
Plasma cleaner equipment cleaning refers to the directional movement of highly activated plasma under the action of an electric field, and the gas curing reaction occurs with the drilling dirt on the hole wall, and the generated gas products and some unreacted particles are discharged by the air pump. Plasma is generally divided into three steps when cleaning the blind holes of HDI boards. In the first stage, high-purity N2 is used to generate plasma, while the printed board is preheated to make the polymer material in a certain activated state; the second stage is with O2, CF4 is the original gas, which produces O and F plasma after mixing, which reacts with acrylic acid, PI, FR4, glass fiber, etc. to achieve the purpose of de-drilling; the third stage uses O2 as the original gas, and the generated plasma and reaction residues Make the hole wall clean.
In the plasma cleaning process, in addition to the plasma chemical reaction, the plasma also physically reacts with the surface of the material. The plasma particles knock off the atoms on the surface of the material or the atoms on the surface of the attached material, which is helpful for cleaning the etching reaction.
With the development of materials and technology, the realization of the buried blind hole structure will become smaller and more refined; when the blind hole is electroplated and filled, it will be more and more difficult to use the traditional chemical desmear method , And the cleaning method of plasma treatment of plasma cleaning machine equipment can well overcome the shortcomings of wet desmear, and can achieve a better cleaning effect on blind holes and micro holes, so as to ensure that the blind holes are electroplated and filled. good effect.

  • Categories:Technical Support
  • Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing Origin
  • Origin:
  • Time of issue:2021-07-25 08:53
  • Views:
Information

The role of plasma cleaning machine equipment plasma surface treatment of tiny holes:
Plasma cleaning equipment is mainly suitable for surface modification treatment of various materials: surface cleaning, surface activation, surface etching, surface deposition, surface treatment and plasma-assisted chemical vapor deposition.

 plasma surface treatment With the miniaturization of the diameter of HDI plates, traditional chemical cleaning processes can no longer meet the requirements of cleaning blind hole structures. The surface tension of the liquid makes it difficult for the liquid to penetrate into the holes, especially when processing laser-drilled micro blind holes. not good. At present, the hole cleaning process applied to micro-buried blind holes mainly includes ultrasonic cleaning and plasma cleaning of plasma cleaning machine equipment. Ultrasonic cleaning is mainly based on the cavitation effect to achieve the purpose of cleaning. It belongs to wet processing, and the cleaning time is longer and depends on The decontamination performance of the cleaning liquid increases the problem of waste liquid treatment.
The commonly used process at this stage is mainly the plasma cleaning process. The plasma treatment process is simple and environmentally friendly, the cleaning effect is obvious, and it is very effective for the blind hole structure.
Plasma cleaner equipment cleaning refers to the directional movement of highly activated plasma under the action of an electric field, and the gas curing reaction occurs with the drilling dirt on the hole wall, and the generated gas products and some unreacted particles are discharged by the air pump. Plasma is generally divided into three steps when cleaning the blind holes of HDI boards. In the first stage, high-purity N2 is used to generate plasma, while the printed board is preheated to make the polymer material in a certain activated state; the second stage is with O2, CF4 is the original gas, which produces O and F plasma after mixing, which reacts with acrylic acid, PI, FR4, glass fiber, etc. to achieve the purpose of de-drilling; the third stage uses O2 as the original gas, and the generated plasma and reaction residues Make the hole wall clean.
In the plasma cleaning process, in addition to the plasma chemical reaction, the plasma also physically reacts with the surface of the material. The plasma particles knock off the atoms on the surface of the material or the atoms on the surface of the attached material, which is helpful for cleaning the etching reaction.
With the development of materials and technology, the realization of the buried blind hole structure will become smaller and more refined; when the blind hole is electroplated and filled, it will be more and more difficult to use the traditional chemical desmear method , And the cleaning method of plasma treatment of plasma cleaning machine equipment can well overcome the shortcomings of wet desmear, and can achieve a better cleaning effect on blind holes and micro holes, so as to ensure that the blind holes are electroplated and filled. good effect.

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