Application of packaging plasma cleaning machine manufacturer's technology in microelectronic packaging

• Categories:Technical Support
• Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
• Origin:
• Time of issue:2021-07-21
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(Summary description)Application of packaging plasma cleaning machine manufacturer's technology in microelectronic packaging: Chengfeng Zhizhi plasma cleaning machine manufacturer equipment is widely used in metal, microelectronics, polymers, biological functional materials, low-temperature sterilization and pollution control and other fields. It is an ideal equipment for plasma surface treatment of enterprises and scientific research institutes. In the production process of microelectronic packaging, due to various fingerprints, fluxes, cross-contamination, natural oxidation, devices and materials will form various surface pollution, including organic matter, epoxy resin, photoresist and solder, metal salt, etc. These stains will have a significant impact on the packaging production process and quality. The use of encapsulated plasma cleaning machine can be easily removed through the formation of contamination in the molecular-level production process, ensuring that atoms and atoms are in close contact with the surface of the workpiece, thereby effectively improving the bonding strength, improving the quality of wafer bonding, and reducing leakage Rate, improve packaging performance, output and component reliability. The choice of plasma cleaning process in microelectronic packaging depends on the requirements of subsequent processes on the surface of the material, the original characteristic chemical composition of the surface of the material and the nature of the primer. Commonly used in plasma cleaning gas argon, oxygen, hydrogen, carbon tetrafluoride and their mixed gases. The choice of plasma cleaning technology application. Small silver glue village bottom: Pollutants will cause the colloidal silver to be spherical, which is not conducive to chip sticking, and it is easy to stab the chip. The use of radio frequency plasma cleaning can greatly improve the surface roughness and hydrophilicity, which is beneficial to silver glue and tile sticking. Chips, while using the amount can save silver glue and reduce costs. Bow-wire bonding: Before the chip is bonded to the substrate and after high-temperature curing, the existing contaminants may contain microparticles and oxides. The physical and chemical reactions of these contaminants are lead and the bonding between the chip and the substrate is incomplete and the bonding strength is poor. , Adhesion is not enough. Before wire bonding, radio frequency plasma cleaning can significantly increase the surface activity and increase the bonding strength and tensile strength of the bonding wire. The pressure on the welding head can be low (when there are contaminants. The welding head penetrates the contaminants, more pressure is required), and in some cases, the bonding temperature can also be lowered, thereby increasing production and reducing costs. Gluing: In the epoxy resin process, pollutants will cause high foaming rate, resulting in low product quality and service life, so in order to avoid problems in the formation of the sealing foam. After cleaning the high daughter body such as radio frequency, the bonding of the chip and the substrate with the colloid will be closer. The foam formed will be greatly reduced, and the heat dissipation and light emissivity will be significantly improved.