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Linear automatic plasma cleaning machine improves the bonding force of PI polyimide sputtering copper plating
- Categories:Company Dynamics
- Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
- Origin:
- Time of issue:2021-07-05
- Views:
(Summary description)Linear automatic plasma cleaning machine improves the bonding force of PI polyimide sputtering copper plating: PI polyimide material is one of the important materials in the preparation of FPC, but the surface of polyimide material has poor hydrophilicity and poor bonding strength with copper film, which greatly affects the quality of FPC products. How does the automatic plasma cleaner solve the problem of poor bonding strength between polyimide material and copper film! On the linear automatic plasma cleaner, oxygen or argon plasma can physically bombard the PI surface, changing the surface from smooth to rough, thereby increasing the surface area combined with the copper film and increasing the free energy of the polyimide surface. When bombarded with argon plasma, certain chemical bonds on the surface of the PI material can be broken, so that some of them overlap to form chemical crosslinks, and the other part is combined with metal atoms, which is beneficial to improve the bonding force of the sputtered copper film. The linear automatic plasma cleaner introduces a large number of hydrophilic compounds, and uses an oxygen plasma cleaner to treat the PI substrate. After plasma activation, a large number of hydrophilic hydroxyl groups can be generated on the surface of the PI substrate to improve the hydrophilicity of the PI substrate. When magnetron sputtering copper produces hydroxyl, it can react with copper to generate Cu-O bond, which enhances the bonding force between copper and polyimide.
Linear automatic plasma cleaning machine improves the bonding force of PI polyimide sputtering copper plating
(Summary description)Linear automatic plasma cleaning machine improves the bonding force of PI polyimide sputtering copper plating:
PI polyimide material is one of the important materials in the preparation of FPC, but the surface of polyimide material has poor hydrophilicity and poor bonding strength with copper film, which greatly affects the quality of FPC products. How does the automatic plasma cleaner solve the problem of poor bonding strength between polyimide material and copper film!
On the linear automatic plasma cleaner, oxygen or argon plasma can physically bombard the PI surface, changing the surface from smooth to rough, thereby increasing the surface area combined with the copper film and increasing the free energy of the polyimide surface.
When bombarded with argon plasma, certain chemical bonds on the surface of the PI material can be broken, so that some of them overlap to form chemical crosslinks, and the other part is combined with metal atoms, which is beneficial to improve the bonding force of the sputtered copper film.
The linear automatic plasma cleaner introduces a large number of hydrophilic compounds, and uses an oxygen plasma cleaner to treat the PI substrate. After plasma activation, a large number of hydrophilic hydroxyl groups can be generated on the surface of the PI substrate to improve the hydrophilicity of the PI substrate. When magnetron sputtering copper produces hydroxyl, it can react with copper to generate Cu-O bond, which enhances the bonding force between copper and polyimide.
- Categories:Company Dynamics
- Author:Plasma cleaning machine-CRF plasma plasma equipment-plasma surface treatment machine manufacturer-chengfeng intelligent manufacturing
- Origin:
- Time of issue:2021-07-05 22:26
- Views:
Information
Linear automatic plasma cleaning machine improves the bonding force of PI polyimide sputtering copper plating:
PI polyimide material is one of the important materials in the preparation of FPC, but the surface of polyimide material has poor hydrophilicity and poor bonding strength with copper film, which greatly affects the quality of FPC products. How does the automatic plasma cleaner solve the problem of poor bonding strength between polyimide material and copper film!
On the linear automatic plasma cleaner, oxygen or argon plasma can physically bombard the PI surface, changing the surface from smooth to rough, thereby increasing the surface area combined with the copper film and increasing the free energy of the polyimide surface.
When bombarded with argon plasma, certain chemical bonds on the surface of the PI material can be broken, so that some of them overlap to form chemical crosslinks, and the other part is combined with metal atoms, which is beneficial to improve the bonding force of the sputtered copper film.
The linear automatic plasma cleaner introduces a large number of hydrophilic compounds, and uses an oxygen plasma cleaner to treat the PI substrate. After plasma activation, a large number of hydrophilic hydroxyl groups can be generated on the surface of the PI substrate to improve the hydrophilicity of the PI substrate. When magnetron sputtering copper produces hydroxyl, it can react with copper to generate Cu-O bond, which enhances the bonding force between copper and polyimide.
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