Analysis of the discoloration of the semiconductor copper support in the vacuum plasma treatment system

• Categories:Company Dynamics
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2021-06-20
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(Summary description)Analysis of the discoloration of the semiconductor copper bracket in the vacuum plasma treatment system:         The semiconductor packaging industry, including the packaging of integrated circuits, discrete devices, sensors and optoelectronic devices, usually uses copper lead frames. In order to improve the reliability of welding and encapsulation, copper brackets are generally processed by a vacuum plasma processing system to remove the surface The organic substances and contaminants of this kind increase the solderability and adhesion of the surface. Vacuum plasma processing system         Sometimes we will find that the copper bracket is not handled properly in the vacuum environment of the vacuum plasma processing system, and the surface is prone to discoloration and blackening, and in severe cases, burning and other phenomena may occur. Is this because the air in the air chamber is not sucked up enough? After the oxygen molecules in the remaining air are excited, they chemically react with the copper surface to form oxygen plasma. The result is copper oxide? Is the reason really that simple? Combining many years of practical experience in plasma cleaning of copper brackets, Chengfeng Intelligent Manufacturing engineers will analyze it with you.         1. The vacuum degree of the plasma affects the cleaning effect and color change of the copper bracket:         The vacuum factor of the plasma cleaner related to the vacuum degree includes the leakage rate of the vacuum chamber, the background vacuum, the speed of the vacuum pump, and the air inlet flow rate. The faster the vacuum pumping speed, the lower the background vacuum value, the less air is left, and the less chances of the copper stent reacting with the oxygen plasma; when the process gas enters, the formed plasma can fully react with the copper stent. The non-excited process gas can easily take away the reactants, and the copper support has a good cleaning effect and is not easy to fade.         2. The influence of the power of the vacuum plasma treatment system on the cleaning effect and discoloration of the copper bracket:         The related factors of vacuum plasma processing system power include energy power and unit power density. The greater the power, the higher the plasma energy, and the greater the bombardment force on the surface of the copper stent; when the power is the same, the fewer copper stents are processed, the greater the unit power density, the better the cleaning effect, but there is also excess energy. The risk of discoloration or burning of the board surface.         3. The influence of the electrode of the vacuum plasma treatment system on the discoloration of the copper bracket:         The plasma distribution of the vacuum plasma processing system is related to factors such as the electrode structure, the direction of the air flow, and the placement of the copper bracket. Due to different processing materials, process requirements and capacity requirements, the electrode structure design is also different; therefore, the gas field formed by the gas flow in the electrode affects the plasma movement, reaction, and uniformity; the placement of the copper bracket affects the electric field And the characteristics of the gas field, leading to unbalanced energy distribution, local plasma density is too high, burning sintering.         Experimental results show that the processing time, power frequency, and equipment type of the vacuum plasma processing system will affect the processing effect and color of the copper bracket.