Wafer plasma cleaner can clean multi-chip contaminants

• Categories:Technical Support
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2021-06-09
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(Summary description)        The advanced applications of wafer-level packaging plasma processing in wafer-level packaging are increasing. As semiconductor device manufacturers further reduce the size and improve the reliability of packaged devices, plasma processing technology is obtained in higher-level wafer-level packaging. More and more applications. Chengfeng Zhizuo wafer plasma cleaning machine can handle a variety of sizes of wafers, large-capacity, automated processing. Wafer Plasma Cleaner         Sheet cleaning Plasma cleaning is a good method to eliminate contaminants generated during wafer-level equipment manufacturing or upstream assembly. In either case, cleaning products to remove fluorine, oxide or metal pollution will greatly improve the output, reliability and performance of integrated circuits.         Deslagging means that the amount of photoresist residue is still developing and processing. In plasma treatment, a small amount of resist is uniformly removed on the entire surface of the wafer before further processing. Wafer plasma cleaner plasma treatment can be used for batch stripping, materials include photoresist, oxide, nitride etching, and dielectric. The uniformity of the etching rate is greater than 97%, and 1 micron per minute can be achieved. Stripping and etching processes can be used for wafer-level packaging, MEMS manufacturing and disk drive processing. Plasma treatment of silicon wafer pretreatment removes pollutants and oxidation, improves bonding rate and reliability. In addition, the plasma also improves the adhesion between the passivation layers of the wafer for micro-roughness.         In UBM, the adhesion plasma treatment of BCB and UBM changes the morphology and wetting effect of the passivation layer of the wafer. Polymer materials, such as benzocyclobutene (BCB) and UBM, are redistributed in the dielectric layer of the wafer. Plasma treatment changes the shape of the initial passivation layer of the silicon wafer and enhances the wettability. The typical method of forming the redistribution layer by patterning the medium includes patterning the redistribution material of the medium using a typical photolithography method. Wafer plasma cleaning machine plasma cleaning is a viable alternative to dielectric patterning, and can avoid traditional wet processing.         Using the cleaning of the WLP holes, the wafers are assembled on the stacked chips, and residual products are often produced through the forming process. By optimizing the structure of the plasma, the through holes can be processed without damaging the surface of the wafer. Indentation plasma cleaning can improve indentation adhesion and increase indentation shear strength. By improving the uneven adhesion of the wafer surface, the plasma cleaner can significantly improve the uneven shear strength. The punch material includes different components of solder and gold nails.