Influence of Low Temperature Plasma Technology Treatment Process Design on the Performance of Fabric Sputtered Copper Film

• Categories:Company Dynamics
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2021-06-04
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(Summary description)The influence of low-temperature plasma technology treatment process design on the performance of fabric sputtered copper film:         Nano-copper film is a new type of functional material with surface effect, quantum effect and other characteristics, and its good electrical conductivity is widely used in chemical, textile, medical and electronic industries. Low-temperature plasma treatment technology is an environmentally friendly surface treatment technology that can be applied to the surface treatment of different materials to achieve cleaning, etching, or grafting. Low temperature plasma technology treatment process design         The surface of the textile material is treated with low-temperature plasma technology and the nano-copper film is deposited on the surface of the textile material as a matrix, which can be used as an ideal functional material and increase the added value of textiles. The surface of polyester substrate without plasma pretreatment is smoother and the deposited nano-copper particles are unevenly distributed. However, the surface is uneven after argon plasma pretreatment, and the nano-copper particles can basically cover the surface of the substrate to form a complete film. This indicates that the argon plasma pretreatment has a certain etching effect on the polyester substrate, which increases the surface roughness of the fiber, and the increase in the specific surface area of ​​the nano-copper particles is easier to adsorb on the surface of the fiber.         When the surface of the substrate is not treated by low-temperature plasma technology, the sheet resistance value of the nano-copper film is 215.2 2/0. After argon and oxygen plasma treatment, the sheet resistance of the copper film is 192.7 and 137.6 0/0, respectively, which are reduced by 10 6% and 36.1% conductivity is significantly improved. This is due to the increased probability of nano copper particles reaching the surface of the polyester substrate after the polyester substrate is treated with oxygen plasma; on the other hand, it is also related to the free carrier concentration and mobility in the copper film.         After the substrate is treated by low-temperature plasma technology, the oxygen plasma treatment is designed to desorb the oxygen vacancies or interstitial copper atoms in the film due to the desorption of negatively charged oxygen groups. The increase in the concentration of free carriers causes the resistivity to decrease. After the substrate is plasma treated, the sputtered copper atoms or atomic groups reach the surface of the substrate, and the frequency increases and its energy is significantly enhanced. Deposited on the substrate has enough energy to crystallize and migrate, so the mobility of free carriers is also higher. The film is relatively dense and the particle size is relatively large. At the same time, the strong indirect scattering of the crystal grains also causes the resistivity of the film to decrease.         The contact angle of distilled water droplets on the copper-plated surface of polyester fabric without plasma treatment was 97.42° after about 20 s, and the state was similar to a spherical shape. It was difficult to spread on the surface of the fabric, indicating that the wettability of copper-plated polyester fabric was extremely poor. This is because the molecular structure of polyester fiber lacks hydrophilic functional groups such as hydroxyl and carboxyl groups. There is no direct force between water molecules and polyester fiber macromolecules, so the fabric cannot be wetted for a long time.         The wettability of distilled water droplets on the copper-plated surface of polyester fabric treated with low-temperature argon and oxygen plasma. The droplet shape gradually changed from a spherical non-wetting state to a spreading wet state. The contact angles decreased to 85. 09 ° and 36, respectively. . 79. It can be seen that the plasma treatment improves the penetration effect of droplets on the surface of the copper-plated polyester fabric.         This is because the etching effect of plasma treatment increases the roughness of the fiber surface and also introduces some oxygen-containing polar groups (such as hydroxyl, carboxyl, etc.) on the surface of the fabric, thereby increasing the gap between the copper nanoparticles and the polyester fiber. Interaction. The oxygen plasma pretreatment makes the surface change of the polyester substrate more obvious than that of the argon plasma treatment. The contact angle of droplets on the surface of the copper-plated polyester fabric is smaller and the hydrophilic performance is obviously improved.