Application of plasma cleaning of pcb plasma cleaning machine in FPCB assembly

• Categories:Industry News
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2021-05-16
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(Summary description)Application of plasma cleaning of pcb plasma cleaning machine in FPCB assembly:         The market demand for flexible printed boards and rigid-flex printed boards is increasing. It places high requirements on board requirements such as surface roughness and surface material modification. Plasma cleaners and PI surface modification can be used to achieve The purpose of roughening and surface modification. pcb plasma cleaner cleaning         With the development of electronic products toward miniaturization, lightness and thinness, portability, and multi-function, flexible printed circuit boards (FPCB) and rigid-flex printed circuit boards (R-FPCB) are increasingly used.         Because the material used in FPCB and R-FPCB is polyimide (PI), its hydrophilicity is poor, and its smooth surface results in poor bonding performance. It is necessary to modify the PI surface without changing the overall performance of PI. It can improve the roughness and improve the bonding performance to meet the long-term requirements of terminal electronic products.         Plasma cleaning machine can meet the requirements of PI surface roughening and surface modification. Plasma cleaning is a dry process. Plasma cleaning mechanism and characteristics: The high-frequency generator separates the processing gas under the electric field energy and vacuum conditions to establish plasma. In the plasma state, the electrons are free from the bond of the central atom, and the neutral atoms, neutral molecules and positive and negative ions make irregular movements. It has a very high energy, but overall it is apparently neutral. The gas molecules in the vacuum are excited by electric energy and the accelerated electrons collide with each other to excite the outer electrons of the atoms and molecules, from the ground state to the excited state, and transition to a more stable orbit. The electrons leaving the ground state orbit generate ions or reaction activity. Relatively high free radicals.         The resulting free radicals, positive and negative ions collide with the surface of the material under the continuous acceleration of the electric field and under the collision of high motion, destroying the van der Waals force between the molecules and the original bonding between the molecules at a depth of several microns. A certain depth of surface material on the PI surface is shaved off to form fine unevenness, and the gas generated at the same time becomes a functional group, which will continue to induce physical and chemical changes on the surface of the material. In general, the whole process is the process of continuous gas ionization and continuous recombination reaction, so as to ensure the continuous progress of the entire reaction, and then achieve the purpose of roughening the PI surface and modifying the PI surface.         In the FPCB assembly process, the reinforcement will be assembled on the PI cover film, and it is required to improve the bonding force between the reinforcement and PI. In the case that the reinforcement surface cannot be processed, the PI surface should be roughened and modified to meet the reliability requirements. Sexual requirements.         Treating PI surface with plasma cleaner has the following characteristics:         (1) The PI surface after plasma cleaning is already very dry, and there is no need to go through subsequent drying treatments         (2) The use of gas solvents will not produce harmful pollutants on the PI surface, which is an environmentally friendly green cleaning method;         (3) The plasma generated by the high-voltage electric field has no direction and can penetrate into the tiny holes and depressions on the PI surface;         (4) While cleaning the PI surface, it can also change the surface properties of the PI material itself, improve the wetting performance of the surface, and increase the bonding force.