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Cu surface modification in atmospheric plasma surface treatment system inhibits micro-discharge

  • Categories:Industry News
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2021-05-08
  • Views:

(Summary description) Cu surface modification to suppress microdischarge in atmospheric plasma surface treatment system: In power transmission lines, conductors may be damaged during line construction (such as on-site production of cable joints, erection of high-voltage overhead lines, etc.), which is easy to cause serious distortion of local electric field. Under the action of strong field, the air around the conductor will be ionized, and even the electrons in the metal body will be pulled out, thus leading to local micro-discharge. Atmospheric plasma surface treatment system Long-term partial microdischarge is one of the important factors causing insulation failure of transmission lines, which seriously affects the safe and stable operation of transmission lines. Therefore, finding an effective method to suppress the microdischarge caused by microdefects on the surface of conductors has become a research hotspot. The plasma of atmospheric plasma surface treatment system has the advantages of high concentration of highly active particles and low excitation temperature, which has been widely used in many fields. With the rise and development of the subject of material surface modification, the method of using plasma surface modification has been widely concerned. Plasma surface modification uses the energetic active particles in the plasma to bombard the surface of the material and endue the surface with new properties. Since it only acts on the surface, the original bulk properties of the material remain unchanged. It should be pointed out that plasma has no requirement on the substrate material, so it can be used for surface modification of metal materials as well as insulating materials. Atmospheric plasma surface treatment system technology is used to modify insulating materials, fluorine treatment and SiO film deposition, which can effectively regulate the modified groups and improve the insulating properties of materials. After the surface modification of epoxy resin by atmospheric plasma, the surface roughness of the material increases, and the introduction of fluorine-containing groups increases the voltage of the epoxy in vacuum. Plasma jet driven by RF power supply deposited silicon oxide thin films on silicon wafer, using HMDSO and O2 as reaction precursors, the thin films were obtained under favorable treatment conditions by optimizing O2 flow rate and RF power supply. The surface of copper and copper was treated by air dispersion discharge. It was found that the surface hydrophilicity and surface energy of copper and copper were effectively improved by plasma treatment in the atmospheric plasma surface treatment system. Li Wenyao et al. used the method of atmospheric pressure plasma enhanced chemical vapor deposition to deposit SiO2-like insulating film on copper and copper, and made use of the good dielectric properties and high resistivity of the silicon oxide film itself to suppress the occurrence of corona. The work function of metals is the main factor affecting the field emission threshold electric field. With a slight change in the work function, titanium tetrachloride (TiC4) is a common precursor for the preparation of TiO2. TiO2 can be generated through hydrolysis, and the reaction is easy to proceed at room temperature without producing organic waste. Using titanium tetrachlide (TiCl4) as a titanium source, low temperature plasma jet was used to deposit TiO2 films on the surface of copper and copper to change the surface characteristics of the conductor and block the microdefects, so as to inhibit the occurrence of microdischarge. After plasma treatment, the surface work function of Cu wafers is increased from 4.65eV to 4.87eV, the electric field distortion is improved, and the field intensity is reduced from 1.4x106 V/m to 9.89x105V/m. The plasma treatment method can improve the electric field distortion to a certain extent and inhibit the occurrence of local microdischarge.

Cu surface modification in atmospheric plasma surface treatment system inhibits micro-discharge

(Summary description)
Cu surface modification to suppress microdischarge in atmospheric plasma surface treatment system:

In power transmission lines, conductors may be damaged during line construction (such as on-site production of cable joints, erection of high-voltage overhead lines, etc.), which is easy to cause serious distortion of local electric field. Under the action of strong field, the air around the conductor will be ionized, and even the electrons in the metal body will be pulled out, thus leading to local micro-discharge.

Atmospheric plasma surface treatment system

Long-term partial microdischarge is one of the important factors causing insulation failure of transmission lines, which seriously affects the safe and stable operation of transmission lines. Therefore, finding an effective method to suppress the microdischarge caused by microdefects on the surface of conductors has become a research hotspot.

The plasma of atmospheric plasma surface treatment system has the advantages of high concentration of highly active particles and low excitation temperature, which has been widely used in many fields. With the rise and development of the subject of material surface modification, the method of using plasma surface modification has been widely concerned. Plasma surface modification uses the energetic active particles in the plasma to bombard the surface of the material and endue the surface with new properties. Since it only acts on the surface, the original bulk properties of the material remain unchanged. It should be pointed out that plasma has no requirement on the substrate material, so it can be used for surface modification of metal materials as well as insulating materials.

Atmospheric plasma surface treatment system technology is used to modify insulating materials, fluorine treatment and SiO film deposition, which can effectively regulate the modified groups and improve the insulating properties of materials. After the surface modification of epoxy resin by atmospheric plasma, the surface roughness of the material increases, and the introduction of fluorine-containing groups increases the voltage of the epoxy in vacuum.

Plasma jet driven by RF power supply deposited silicon oxide thin films on silicon wafer, using HMDSO and O2 as reaction precursors, the thin films were obtained under favorable treatment conditions by optimizing O2 flow rate and RF power supply.

The surface of copper and copper was treated by air dispersion discharge. It was found that the surface hydrophilicity and surface energy of copper and copper were effectively improved by plasma treatment in the atmospheric plasma surface treatment system. Li Wenyao et al. used the method of atmospheric pressure plasma enhanced chemical vapor deposition to deposit SiO2-like insulating film on copper and copper, and made use of the good dielectric properties and high resistivity of the silicon oxide film itself to suppress the occurrence of corona. The work function of metals is the main factor affecting the field emission threshold electric field. With a slight change in the work function, titanium tetrachloride (TiC4) is a common precursor for the preparation of TiO2. TiO2 can be generated through hydrolysis, and the reaction is easy to proceed at room temperature without producing organic waste. Using titanium tetrachlide (TiCl4) as a titanium source, low temperature plasma jet was used to deposit TiO2 films on the surface of copper and copper to change the surface characteristics of the conductor and block the microdefects, so as to inhibit the occurrence of microdischarge.

After plasma treatment, the surface work function of Cu wafers is increased from 4.65eV to 4.87eV, the electric field distortion is improved, and the field intensity is reduced from 1.4x106 V/m to 9.89x105V/m. The plasma treatment method can improve the electric field distortion to a certain extent and inhibit the occurrence of local microdischarge.

  • Categories:Industry News
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2021-05-08 10:53
  • Views:
Information


Cu surface modification to suppress microdischarge in atmospheric plasma surface treatment system:

In power transmission lines, conductors may be damaged during line construction (such as on-site production of cable joints, erection of high-voltage overhead lines, etc.), which is easy to cause serious distortion of local electric field. Under the action of strong field, the air around the conductor will be ionized, and even the electrons in the metal body will be pulled out, thus leading to local micro-discharge.

Atmospheric plasma surface treatment system

Long-term partial microdischarge is one of the important factors causing insulation failure of transmission lines, which seriously affects the safe and stable operation of transmission lines. Therefore, finding an effective method to suppress the microdischarge caused by microdefects on the surface of conductors has become a research hotspot.

The plasma of atmospheric plasma surface treatment system has the advantages of high concentration of highly active particles and low excitation temperature, which has been widely used in many fields. With the rise and development of the subject of material surface modification, the method of using plasma surface modification has been widely concerned. Plasma surface modification uses the energetic active particles in the plasma to bombard the surface of the material and endue the surface with new properties. Since it only acts on the surface, the original bulk properties of the material remain unchanged. It should be pointed out that plasma has no requirement on the substrate material, so it can be used for surface modification of metal materials as well as insulating materials.

Atmospheric plasma surface treatment system technology is used to modify insulating materials, fluorine treatment and SiO film deposition, which can effectively regulate the modified groups and improve the insulating properties of materials. After the surface modification of epoxy resin by atmospheric plasma, the surface roughness of the material increases, and the introduction of fluorine-containing groups increases the voltage of the epoxy in vacuum.

Plasma jet driven by RF power supply deposited silicon oxide thin films on silicon wafer, using HMDSO and O2 as reaction precursors, the thin films were obtained under favorable treatment conditions by optimizing O2 flow rate and RF power supply.

Atmospheric plasma surface treatment

The surface of copper and copper was treated by air dispersion discharge. It was found that the surface hydrophilicity and surface energy of copper and copper were effectively improved by plasma treatment in the atmospheric plasma surface treatment system. Li Wenyao et al. used the method of atmospheric pressure plasma enhanced chemical vapor deposition to deposit SiO2-like insulating film on copper and copper, and made use of the good dielectric properties and high resistivity of the silicon oxide film itself to suppress the occurrence of corona. The work function of metals is the main factor affecting the field emission threshold electric field. With a slight change in the work function, titanium tetrachloride (TiC4) is a common precursor for the preparation of TiO2. TiO2 can be generated through hydrolysis, and the reaction is easy to proceed at room temperature without producing organic waste. Using titanium tetrachlide (TiCl4) as a titanium source, low temperature plasma jet was used to deposit TiO2 films on the surface of copper and copper to change the surface characteristics of the conductor and block the microdefects, so as to inhibit the occurrence of microdischarge.

After plasma treatment, the surface work function of Cu wafers is increased from 4.65eV to 4.87eV, the electric field distortion is improved, and the field intensity is reduced from 1.4x106 V/m to 9.89x105V/m. The plasma treatment method can improve the electric field distortion to a certain extent and inhibit the occurrence of local microdischarge.

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