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Risk control methods required in the application of vacuum low-temperature plasma processor

  • Categories:Company Dynamics
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2021-03-13
  • Views:

(Summary description)Vacuum cryogenic plasma processor is a new high-tech technology. By injecting enough energy into the gas, the gas can be separated into plasma state. The "activation" of the active ions in the plasma is used to remove the stains on the surface of the object. The vacuum low-temperature plasma processor is connected to a vacuum pump. During the cleaning process, the plasma in the cleaning room is cleaned to clean the surface of the object. Short-time cleaning can completely clean organic matter, pollutants can be removed by vacuum pump, cleaning degree can reach the molecular level. It can effectively avoid the secondary pollution of the liquid cleaning medium to the object to be cleaned. In the process of application, there should be a certain sense of risk control. 1. The following are the risks of vacuum low-temperature plasma processor: (1) Leakage risk of cleaning medium: The cleaning medium is usually gas, and a gas cylinder is often used and delivered to equipment that passes through a pipe. Leakage of pipes and gas equipment may cause accidents if cylinders or gas charges leak. If hydrogen, methane and other flammable and explosive gases are used, fire and explosion accidents may occur in the room with open fire and static electricity. If argon gas is used, it may cause poor ventilation in the room and cause asphyxiation accidents. Accident: If oxygen is used, oxygen is an oxidizing gas that can increase combustible material. If there is too much oxygen in the room, a fire may occur. (2) Risk of electric shock: Electrical insulation failure due to failure, aging, corrosion, mechanical damage, etc. The leakage protection device is not installed or the leakage protection device fails. 2. Control methods of vacuum low-temperature plasma processor: (1) Fire, explosion and asphyxiation measures: standardize the use of gas cylinders, gas cylinder accessories should be complete, and there are measures to prevent dumping. Cylinders should be tested periodically to ensure that they are within their validity period. The air supply pipeline is firmly connected with the air supply equipment. If oxygen is used, cylinders, joints, pressure reducers, hoses and equipment must be isolated from oil, grease and other flammable and explosive substances. Do not touch oxygen cylinders or oxygen devices with oily hands or gloves. If hydrogen is used, it is recommended to install a hydrogen leak alarm device near the equipment being used. (2) maintain indoor air circulation. If ventilation is poor, install a mechanical exhaust device. (3) Anti-electric shock measures, equipment must be grounded, power cord must be free from damage, no aging phenomenon.

Risk control methods required in the application of vacuum low-temperature plasma processor

(Summary description)Vacuum cryogenic plasma processor is a new high-tech technology. By injecting enough energy into the gas, the gas can be separated into plasma state. The "activation" of the active ions in the plasma is used to remove the stains on the surface of the object. The vacuum low-temperature plasma processor is connected to a vacuum pump. During the cleaning process, the plasma in the cleaning room is cleaned to clean the surface of the object. Short-time cleaning can completely clean organic matter, pollutants can be removed by vacuum pump, cleaning degree can reach the molecular level. It can effectively avoid the secondary pollution of the liquid cleaning medium to the object to be cleaned. In the process of application, there should be a certain sense of risk control.


1. The following are the risks of vacuum low-temperature plasma processor:
(1) Leakage risk of cleaning medium:
The cleaning medium is usually gas, and a gas cylinder is often used and delivered to equipment that passes through a pipe. Leakage of pipes and gas equipment may cause accidents if cylinders or gas charges leak. If hydrogen, methane and other flammable and explosive gases are used, fire and explosion accidents may occur in the room with open fire and static electricity. If argon gas is used, it may cause poor ventilation in the room and cause asphyxiation accidents. Accident: If oxygen is used, oxygen is an oxidizing gas that can increase combustible material. If there is too much oxygen in the room, a fire may occur.
(2) Risk of electric shock:
Electrical insulation failure due to failure, aging, corrosion, mechanical damage, etc. The leakage protection device is not installed or the leakage protection device fails.


2. Control methods of vacuum low-temperature plasma processor:
(1) Fire, explosion and asphyxiation measures: standardize the use of gas cylinders, gas cylinder accessories should be complete, and there are measures to prevent dumping. Cylinders should be tested periodically to ensure that they are within their validity period. The air supply pipeline is firmly connected with the air supply equipment. If oxygen is used, cylinders, joints, pressure reducers, hoses and equipment must be isolated from oil, grease and other flammable and explosive substances. Do not touch oxygen cylinders or oxygen devices with oily hands or gloves. If hydrogen is used, it is recommended to install a hydrogen leak alarm device near the equipment being used.
(2) maintain indoor air circulation. If ventilation is poor, install a mechanical exhaust device.
(3) Anti-electric shock measures, equipment must be grounded, power cord must be free from damage, no aging phenomenon.

  • Categories:Company Dynamics
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2021-03-13 10:27
  • Views:
Information

Risk control methods required in the application of vacuum low-temperature plasma processor:
Vacuum cryogenic plasma processor is a new high-tech technology. By injecting enough energy into the gas, the gas can be separated into plasma state. The "activation" of the active ions in the plasma is used to remove the stains on the surface of the object. The vacuum low-temperature plasma processor is connected to a vacuum pump. During the cleaning process, the plasma in the cleaning room is cleaned to clean the surface of the object. Short-time cleaning can completely clean organic matter, pollutants can be removed by vacuum pump, cleaning degree can reach the molecular level. It can effectively avoid the secondary pollution of the liquid cleaning medium to the object to be cleaned. In the process of application, there should be a certain sense of risk control.

CRF vacuum low-temperature
1. The following are the risks of vacuum low-temperature plasma processor:
(1) Leakage risk of cleaning medium:
The cleaning medium is usually gas, and a gas cylinder is often used and delivered to equipment that passes through a pipe. Leakage of pipes and gas equipment may cause accidents if cylinders or gas charges leak. If hydrogen, methane and other flammable and explosive gases are used, fire and explosion accidents may occur in the room with open fire and static electricity. If argon gas is used, it may cause poor ventilation in the room and cause asphyxiation accidents. Accident: If oxygen is used, oxygen is an oxidizing gas that can increase combustible material. If there is too much oxygen in the room, a fire may occur.
(2) Risk of electric shock:
Electrical insulation failure due to failure, aging, corrosion, mechanical damage, etc. The leakage protection device is not installed or the leakage protection device fails.


2. Control methods of vacuum low-temperature plasma processor:
(1) Fire, explosion and asphyxiation measures: standardize the use of gas cylinders, gas cylinder accessories should be complete, and there are measures to prevent dumping. Cylinders should be tested periodically to ensure that they are within their validity period. The air supply pipeline is firmly connected with the air supply equipment. If oxygen is used, cylinders, joints, pressure reducers, hoses and equipment must be isolated from oil, grease and other flammable and explosive substances. Do not touch oxygen cylinders or oxygen devices with oily hands or gloves. If hydrogen is used, it is recommended to install a hydrogen leak alarm device near the equipment being used.
(2) maintain indoor air circulation. If ventilation is poor, install a mechanical exhaust device.
(3) Anti-electric shock measures, equipment must be grounded, power cord must be free from damage, no aging phenomenon.

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