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IC production integrated circuit manufacturing plasma cleaning equipment process
- Categories:Company Dynamics
- Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
- Origin:
- Time of issue:2021-03-05
- Views:
(Summary description)In the IC production of integrated circuit manufacturing process, organic and inorganic combination is a necessary condition to realize the IC production, therefore, how to apply the plasma cleaning equipment technology in the IC production process? First introduce the IC production process. Integrated circuit production process is in a limited environment, artificial participation, that is, the purification room, due to its environmental problems here, a variety of bad environment on the silicon wafer caused by pollution is unpredictable. In general, the common particles, as well as organic matter, and metal residual pollutants and oxides, etc. Plasma cleaning equipment is used to treat the surface of silicon wafer, which can make its adhesive force change, and the physical and chemical reaction is mainly used to reduce the contact between silicon wafer and particle surface, so as to achieve the effect of surface cleaning treatment. In general, impurities in organic matter are produced and exist in many forms, so it is recommended to use plasma cleaning equipment in the production process to clean its surface first, to avoid a large number of problems.
IC production integrated circuit manufacturing plasma cleaning equipment process
(Summary description)In the IC production of integrated circuit manufacturing process, organic and inorganic combination is a necessary condition to realize the IC production, therefore, how to apply the plasma cleaning equipment technology in the IC production process? First introduce the IC production process. Integrated circuit production process is in a limited environment, artificial participation, that is, the purification room, due to its environmental problems here, a variety of bad environment on the silicon wafer caused by pollution is unpredictable.
In general, the common particles, as well as organic matter, and metal residual pollutants and oxides, etc. Plasma cleaning equipment is used to treat the surface of silicon wafer, which can make its adhesive force change, and the physical and chemical reaction is mainly used to reduce the contact between silicon wafer and particle surface, so as to achieve the effect of surface cleaning treatment. In general, impurities in organic matter are produced and exist in many forms, so it is recommended to use plasma cleaning equipment in the production process to clean its surface first, to avoid a large number of problems.
- Categories:Company Dynamics
- Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
- Origin:
- Time of issue:2021-03-05 10:42
- Views:
IC production integrated circuit manufacturing plasma cleaning equipment process:
In the IC production of integrated circuit manufacturing process, organic and inorganic combination is a necessary condition to realize the IC production, therefore, how to apply the plasma cleaning equipment technology in the IC production process? First introduce the IC production process. Integrated circuit production process is in a limited environment, artificial participation, that is, the purification room, due to its environmental problems here, a variety of bad environment on the silicon wafer caused by pollution is unpredictable.
In general, the common particles, as well as organic matter, and metal residual pollutants and oxides, etc. Plasma cleaning equipment is used to treat the surface of silicon wafer, which can make its adhesive force change, and the physical and chemical reaction is mainly used to reduce the contact between silicon wafer and particle surface, so as to achieve the effect of surface cleaning treatment. In general, impurities in organic matter are produced and exist in many forms, so it is recommended to use plasma cleaning equipment in the production process to clean its surface first, to avoid a large number of problems.
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