Packaging plasma cleaning machine pretreatment technology semiconductor field application

• Categories:Company Dynamics
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2021-02-24
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(Summary description)Optimized lead connection (wiring) : The bonding quality of the chip leads is a key factor affecting the reliability of the device. The lead bonding area must be guaranteed to be free of contaminants and have good bonding performance. The presence of oxides, organic residues and other contaminants will seriously weaken the tensile value of the lead connection. The conventional wet cleaning method can not completely or completely remove the contaminants in the bonding zone, but the plasma cleaning method can effectively remove the dirt on the surface of the bonding zone and activate the surface of the bonding zone, which can significantly improve the bonding tension of the lead wire and greatly improve the reliability of the package device. Wafer and packaging substrate bonding, often are two different nature of the material, the material surface is characterized by a hydrophobic and inertia, adhesive performance is poor, the adhesive interface, easy to produce gap brings chip great hidden trouble, the wafer plasma processing and packaging substrate surface, can effectively improve the activity of the surface of the wafer, and greatly improve chip encapsulation adhesive liquid epoxy resin on the surface of the substrate, improve chip encapsulation of substrate binding and invasive, reduce the chip and the substrate layer, improve the heat conduction ability, improve the reliability of chip packaging, stability, prolong the service life of the product. The advantages of plasma pretreatment flip chip packaging, improve the reliability of the welding: flip chip packages, using plasma processing technology to chip and loading board processing, not only can make weld surface ultra purification, and can significantly improve the activity of weld, can effectively prevent welding, reduce hole, improve the reliability of welding, at the same time can improve the edge of the weld height and inclusive, improve packaging mechanical strength, decrease due to the thermal expansion coefficient of different materials in the interface between the formation of the gel, improve product reliability and life expectancy. Packaging plasma cleaning machine pretreatment lead frame surface treatment: In the field of microelectronics packaging, lead frame encapsulation forms still accounted for more than 80%, it mainly adopts thermal conductivity copper alloy materials, conductive, processing the good performance of the lead frame, as a result of the copper oxide and other organic pollutants can cause seal forming copper lead frame in the process of layering, encapsulate the sealing performance variation and chronic permeability gas phenomenon, but also affects the bonding and wire bonding of the chip quality, to ensure that the lead frame for ultra clean packaging reliability and the yield is the key, by plasma treatment can achieve lead frame surface super purification and activation, finished product yield than the traditional wet cleaning has greatly improved, And does not produce waste water discharge, reduces the procurement cost of chemical solution. Packaging plasma cleaning machine pretreatment technology for semiconductor packaging: improve the coating quality of ceramic packaging: in the packaging of ceramic products, usually use the metal paste printed circuit board as the bonding area, sealing sealing area. Using plasma to clean the surface of these materials before electroplating can remove the drill dirt in organic matter and improve the coating quality significantly.