What gas is used for plasma surface treatment to remove surface residues and dirt

• Categories:Technical Support
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2021-01-27
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(Summary description)Plasma surface treatment machine in the cleaning process with different gases, the cleaning residual dirt effect is also very different. One of the commonly used gases is the inert gas argon (AR), which can effectively remove nanoscale surface pollutants in the cleaning process of vacuum equipment. If you want to strengthen the etching effect, you can pass oxygen (O2), can effectively remove organic pollutants, such as photoresist, etc. Some hydrogen (H2) can be used in combination with other oxides that are more difficult to remove. A mixture of hydrogen and nitrogen gas (95% nitrogen and 5% hydrogen) is usually chosen. The widely used gas is nitrogen (N2), which is cheap to produce. The gas is mainly used for surface activation modification of materials in combination with on-line plasma surface treatment technology. It can also be used in a vacuum. Nitrogen (N2) is a good gas to improve the surface wetting property of materials. In addition, there are also carbon tetrafluoride (CF4), sulfur hexafluoride (SF6) and other similar special gases, plasma surface treatment machine using these gases on the etching and removal of organic matter is more significant. But the premise of the use of these gases is that they must have a good anti-corrosion gas path structure, and they must wear protective cover and gloves to work normally, although there will be no danger but protection or do enough.