The action of each gas in plasma cleaning machine

• Categories:Industry News
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2021-01-11
• Views:

(Summary description)Plasma cleaning machine equipment commonly used gases are compressed air, oxygen, argon, hydrogen, argon hydrogen mixed gas CF4, etc. Before cleaning objects with plasma cleaning equipment, it is necessary to analyze the cleaning objects and contaminants, and then select the appropriate gas. According to the basic principle of the equipment, the selective gas can be divided into hydrogen, oxygen and other special gases. Hydrogen is mainly used for cleaning compounds on the metal surface. The oxygen in the plasma cleaning device is used to clean the organic matter on the surface of the object, resulting in oxidation removal. Non-reactive gas in plasma cleaning machine equipment, such as argon, helium, nitrogen and so on. The hardness and wear resistance can be improved after nitrogen treatment. Argon and helium have stable properties, and the working voltage of molecular charge and discharge is low, so it is easy to generate metastable molecules. On the one hand, the high-energy particle physics effect is used to clean up objects that are easy to oxidize or reduce.   The AR gas bombarded the pollutants with volatile chemicals, which were expelled through the vacuum pump, preventing the surface chemicals from reacting. Argon is very easy to form metastable molecules, and when it collides with oxygen atoms, it will produce positive charge transformation and recombination. The application of pure hydrogen in plasma plasma equipment is very effective, but considering the reliability and safety of charge and discharge, argon hydrogen compounds can also be used in plasma cleaning machines. In addition, reverse oxygen and argon oxygen cleaning sequence can also be used, this cleaning method has the characteristics of easy oxidation and easy reduction.   1. Argon: The principle of argon cleaning is physical bombardment of the surface. Argon is physically efficient because it has a large atomic size and can penetrate the surface layer of a product with a great deal of energy. The positive argon ions are attracted to the negative plate, the impact force makes all the surface stains disappear, and then the gas pollutants will be discharged with the pump.   2. Oxygen: organic chemical reaction occurs with chemicals on the surface of the product. For example, oxygen can reasonably remove organic chemical pollutants and react with the pollutants to produce carbon dioxide, carbon monoxide, and water. In general, chemical reactions facilitate removal of organic contaminants.   3. Hydrogen: Hydrogen can be used to remove oxides from metal surfaces. Often mixed with argon to improve the ability to remove dirt. People generally pay attention to the flammability of hydrogen and the use of hydrogen storage, we can use hydrogen generator to produce hydrogen from water, to eliminate the potential safety hazards.   4.CF4 / SF6: Fluorinated gas is generally used in semiconductor materials and PWB (printed circuit board) and other industrial production. Fluorinated gas used in PADS process can convert oxides into chlorides, so as to achieve flow free welding.