Welcome to Shenzhen Sing Fung Intelligent Manufacturing Co., Ltd.
E-mail：shaobo@sfi-crf.com
FPC/PCB field
- Categories:FPC/PCB field
- Author:
- Origin:
- Time of issue:2020-07-28
- Views:
(Summary description)The main material of FPC printed circuit board (soft board) is composed of polyimide resin. Due to the heat generated during drilling, it is easy to leave a large amount of resin slag in the hole, resulting in the copper plating layer on the hole wall and the inner The layers of the circuit are poorly connected, and even break and open circuits. At present, the industry mostly uses resin leavening agents and potassium permanganate liquids to remove slag in the holes.
FPC/PCB field
(Summary description)The main material of FPC printed circuit board (soft board) is composed of polyimide resin. Due to the heat generated during drilling, it is easy to leave a large amount of resin slag in the hole, resulting in the copper plating layer on the hole wall and the inner The layers of the circuit are poorly connected, and even break and open circuits. At present, the industry mostly uses resin leavening agents and potassium permanganate liquids to remove slag in the holes.
- Categories:FPC/PCB field
- Author:
- Origin:
- Time of issue:2020-07-28 09:28
- Views:
Information
1. FPC board
The main material of FPC printed circuit board (soft board) is composed of polyimide resin. Due to the heat generated during drilling, it is easy to leave a large amount of resin slag in the hole, resulting in the copper plating layer on the hole wall and the inner The layers of the circuit are poorly connected, and even break and open circuits. At present, the industry mostly uses resin leavening agents and potassium permanganate liquids to remove slag in the holes. Because potassium permanganate is extremely destructive to the properties of polyimide wax. The use of low-temperature plasma treatment can effectively remove the residual glue on the hole wall to achieve the effect of cleaning, activation and uniform etching, which is beneficial to the connection of the inner circuit and the copper plating layer on the hole wall and enhances the bonding force.
2. Soft and hard board
Because the rigid-flex board is composed of several different materials laminated together, due to the inconsistency of its thermal expansion coefficient, the hole wall and the line connection between the layers are prone to fracture and tear, which improves the rigid-flex board The reliability of the hole metallization and the bonding force between the circuit laminations are the key technologies for the quality of the rigid-flex board.
The traditional process adopts the chemical syrup wet process, and the characteristics of the syrup are not strong acidic or strong alkaline, which will cause disadvantages to polyimide resin and acrylic resin. The dry treatment technology that uses plasma to clean, roughen and activate the surface of the material can not only obtain good reliability and bonding force, but also overcome the defects of traditional processes to achieve a green and environmentally friendly process without emissions
3. Teflon board
PTFE (Teflon) high-frequency microwave board hole wall surface modification activation (Modification) before copper sinking: improve the bonding force of the hole wall and the copper plating layer, and eliminate the high temperature of the hole copper and the inner copper layer by the black hole after the current sinking copper Phenomena such as fracture and blast hole improve reliability. Activation of the front panel before applying solder mask ink and silk screen characters: effectively prevent solder mask ink and printed characters from falling off.
Scan the QR code to read on your phone
Previous:
None
Next:
None
Previous:
None
Next:
None
TEL：0755-3367 3020 / 0755-3367 3019
E-mail：sales-sfi@sfi-crf.com
ADD：Mabao Industrial Zone, Huangpu, Baoan District, Shenzhen
