Led plasma cleaning machine

• Categories:Industry News
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2021-01-06
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(Summary description)During the production of LED, metal oxides and air pollutants on the surface will reduce the stability of the product and cause harm to the product quality. If the surface is treated with plasma cleaner technology before packaging, contaminants and oxides can be removed. Led, the general name of the light emitting diode, generally used for display lights, broadcast messages, etc., it can not only instantly electromagnetic energy into light energy, but also has hundreds of thousands of hours of life cycle, has not broken, energy saving and other advantages. The difficulties in LED processing are as follows: 1. Unable to remove air pollutants and oxides. 2. There is a small gap between the support frame and the colloid, which will cause led oxidation failure after the gas enters the electric level and is stored on the surface of the bracket for a long time. Cleaning strategy using LED plasma cleaning machine: 1. Before applying the silver gel. The air pollutants on the substrate will make the silver adhesive spherical, which is not conducive to the integration of IC chip, easy to lead to chip damage, the selection of plasma cleaning machine cleaning can further improve the roughness and hydrophilicity of the product workpiece, is conducive to the dispersion of the silver adhesive and chip bonding, in addition, can greatly save the amount of silver adhesive, control the cost. 2. Lead bonding. When the LED chip is attached to the substrate, the pollutants will include particles and metal oxides produced by physical and chemical actions, resulting in incomplete chip and welding or poor bonding, and insufficient bonding compressive strength. In order to improve the compressive strength and tensile symmetry of the adhesive, plasma cleaning was carried out before the adhesive bonding to improve the adhesion ability. In addition, it can also reduce the bond temperature in some special cases, thus increasing the production control cost. 3. Before sealing. When injected with epoxy resin, the surface pollutants can produce a large number of bubbles, which can reduce the quality and service life of the product. Therefore, the prevention of bubbles in the sealed state is also a problem. By using plasma cleaning, LED chips and substrates will be inseparable with adhesive bonding, greatly reducing the generation of bubbles, and significantly improving the heat dissipation rate and light emission rate.