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Application of plasma cleaning machine in the photoelectric industry

  • Categories:Technical Support
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2020-12-03
  • Views:

(Summary description)Before the silver adhesive is applied: the pollutants on the substrate will cause the silver adhesive to be spherical, which is not conducive to the adhesion of the chip, and it is easy to cause damage to the chip in use. Using plasma cleaning can greatly improve the surface roughness and hydrophilicity of the workpiece, which is conducive to tile and patch, and can greatly save the amount of silver adhesive and reduce the cost.   Before lead bonding: the chip is attached to the substrate. After curing at high temperature, the pollutants on the substrate may contain particles and oxides, etc. Due to physical and chemical reactions, the welding between the lead and the chip and the substrate is incomplete or poorly adhered, resulting in insufficient connection strength. Plasma cleaning machine can improve the surface activity of the lead before connection, so as to improve the bonding strength and tension uniformity of the lead.   Before LED sealant: When LED is injected with epoxy glue, pollutants will lead to higher bubble formation rate, thus reducing product quality and service life. Therefore, it is also worth paying attention to avoid bubble formation during post-sealant. Plasma cleaning machine after plasma treatment, chip and substrate close combination, better combination with colloid, the formation of bubbles will be greatly reduced, but also significantly improve the heat dissipation and light rate.   It can be seen from the above points that the surface activation of the material, the removal of oxides and particulate pollutants can be demonstrated by the tensile strength and infiltration characteristics of the bonded leads on the surface of the material.   Plasma cleaning machine has nanoscale cleaning capacity, the surface characteristics of the sample will change under certain conditions. As gas is used as cleaning medium, it can effectively avoid the re-contamination of the sample. Plasma cleaning machine can not only enhance the adhesion, compatibility and wettability of samples. At present, plasma cleaning machine has been widely used in the fields of optics, optoelectronics, electronics, materials, polymers, biomedicine, microfluidics and so on.

Application of plasma cleaning machine in the photoelectric industry

(Summary description)Before the silver adhesive is applied: the pollutants on the substrate will cause the silver adhesive to be spherical, which is not conducive to the adhesion of the chip, and it is easy to cause damage to the chip in use. Using plasma cleaning can greatly improve the surface roughness and hydrophilicity of the workpiece, which is conducive to tile and patch, and can greatly save the amount of silver adhesive and reduce the cost.

 

Before lead bonding: the chip is attached to the substrate. After curing at high temperature, the pollutants on the substrate may contain particles and oxides, etc. Due to physical and chemical reactions, the welding between the lead and the chip and the substrate is incomplete or poorly adhered, resulting in insufficient connection strength. Plasma cleaning machine can improve the surface activity of the lead before connection, so as to improve the bonding strength and tension uniformity of the lead.

 

Before LED sealant: When LED is injected with epoxy glue, pollutants will lead to higher bubble formation rate, thus reducing product quality and service life. Therefore, it is also worth paying attention to avoid bubble formation during post-sealant. Plasma cleaning machine after plasma treatment, chip and substrate close combination, better combination with colloid, the formation of bubbles will be greatly reduced, but also significantly improve the heat dissipation and light rate.

 

It can be seen from the above points that the surface activation of the material, the removal of oxides and particulate pollutants can be demonstrated by the tensile strength and infiltration characteristics of the bonded leads on the surface of the material.

 

Plasma cleaning machine has nanoscale cleaning capacity, the surface characteristics of the sample will change under certain conditions. As gas is used as cleaning medium, it can effectively avoid the re-contamination of the sample. Plasma cleaning machine can not only enhance the adhesion, compatibility and wettability of samples. At present, plasma cleaning machine has been widely used in the fields of optics, optoelectronics, electronics, materials, polymers, biomedicine, microfluidics and so on.


  • Categories:Technical Support
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2020-12-03 09:05
  • Views:
Information

Application of plasma cleaning machine in the photoelectric industry:

 

Before the silver adhesive is applied: the pollutants on the substrate will cause the silver adhesive to be spherical, which is not conducive to the adhesion of the chip, and it is easy to cause damage to the chip in use. Using plasma cleaning can greatly improve the surface roughness and hydrophilicity of the workpiece, which is conducive to tile and patch, and can greatly save the amount of silver adhesive and reduce the cost.

 

Before lead bonding: the chip is attached to the substrate. After curing at high temperature, the pollutants on the substrate may contain particles and oxides, etc. Due to physical and chemical reactions, the welding between the lead and the chip and the substrate is incomplete or poorly adhered, resulting in insufficient connection strength. Plasma cleaning machine can improve the surface activity of the lead before connection, so as to improve the bonding strength and tension uniformity of the lead.

 

Before LED sealant: When LED is injected with epoxy glue, pollutants will lead to higher bubble formation rate, thus reducing product quality and service life. Therefore, it is also worth paying attention to avoid bubble formation during post-sealant. Plasma cleaning machine after plasma treatment, chip and substrate close combination, better combination with colloid, the formation of bubbles will be greatly reduced, but also significantly improve the heat dissipation and light rate.

 

It can be seen from the above points that the surface activation of the material, the removal of oxides and particulate pollutants can be demonstrated by the tensile strength and infiltration characteristics of the bonded leads on the surface of the material.

 

Plasma cleaning machine has nanoscale cleaning capacity, the surface characteristics of the sample will change under certain conditions. As gas is used as cleaning medium, it can effectively avoid the re-contamination of the sample. Plasma cleaning machine can not only enhance the adhesion, compatibility and wettability of samples. At present, plasma cleaning machine has been widely used in the fields of optics, optoelectronics, electronics, materials, polymers, biomedicine, microfluidics and so on.

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