On-line vacuum plasma cleaning machine

• Categories:Technical Support
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2020-11-14
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(Summary description)The main structure of on-line vacuum plasma cleaning machine includes: rack, automatic feeding equipment and automatic cleaning equipment; The upper and lower material pushing mechanism, the upper and lower material taking and placing platform, the upper and lower material conveying system, the upper and lower material shifting mechanism, reaction bin, main structure of equipment and electrical control system, etc. On-line vacuum plasma cleaning machine has simple structure, easy to use and high efficiency. The machine has compact structure, comprehensive performance, uniform and stable treatment effect, flexible configuration and high cost performance. And can be manually or before the process of automatic completion of feeding, feeding, positioning, open the material door, feeding, cleaning and discharging, and then by manual feeding or in accordance with the process of automatic completion of feeding, feeding, feeding. On-line vacuum plasma cleaning machine is a design concept of automatic material handling. Compared with the traditional plasma cleaning system, it reduces the cost of manual handling and improves the automation level of the equipment.   Online type vacuum plasma cleaning belongs to high precision dry cleaning, its principle is to use rf source to produce the high voltage ac electric field, such as oxygen, argon, hydrogen process gas into a highly active or high-energy ion, the workpiece surface by chemical reactions or physical function, at the molecular level of pollutant removal, improve the surface activity. The ideal cleaning effect can be achieved by adopting different cleaning techniques for different pollutants.   In the vacuum of vacuum plasma cleaning, the plasma reacts or collides with organic pollutants and micro-particle pollutants to form volatile substances, which are removed by working air stream and vacuum pump, so as to achieve surface cleaning effect of the workpiece. Plasma cleaning is a kind of stripping cleaning, which has no pollution to the environment after cleaning. On - line plasma equipment is based on mature plasma technology and equipment manufacturing, adding automatic functions such as feeding and feeding. Precleaning the lead frame in IC packaging, such as gluing pieces, chip bonding and plastic sealing before cleaning, greatly improves the performance of bonding and bonding strength, and avoids secondary pollution caused by human factors to long-term contact with the lead frame and damages to the chip at the same time.   On-line plasma cleaning is widely used in gluing, welding, printing, coating and other occasions, through plasma acting on the surface of the product, improve its surface activity, and activate the surface performance, can significantly improve the product, has become an essential equipment for the surface performance treatment of middle and high-grade products. On-line vacuum plasma cleaning machine focuses on plasma surface modification or plasma surface treatment applications. It is the high energy and instability of plasma that is used to clean, activate and activate the surface of treated materials, thus changing the microstructure, chemical properties and energy of the surface.   The interaction of plasma with the surface of an object can be divided into physical interaction (ion bombardment) and chemical interaction. The mechanism of physicochemical reaction is that the active particles are bombarded on the surface to be cleaned, so that the pollutants can be separated from the surface and sucked out by the vacuum pump. The chemical reaction mechanism is that all kinds of active particles react with pollutants to produce volatile substances, and then the volatile substances are sucked out by vacuum pumps.   Plasma cleaning is mainly based on physical reaction, and there is no chemical reaction on its own. No oxide is left on the surface of cleaning, which can keep the chemical purity of the cleaned object. The disadvantage is that there is a small amount of damage to the surface, which will produce a large thermal effect. The different substances on the surface of the object to be cleaned have poor selectivity and low corrosion rate.   Chemical reaction plasma is used for cleaning, which has the advantages of high cleaning speed, good selectivity, and can remove organic matters more effectively, while the disadvantage is that it can produce oxides on the surface. Compared with physical reaction, the disadvantage of chemical reaction is not easy to overcome. The influence of the two reaction mechanisms on the surface morphology is significantly different. The physical reaction can make the surface become more "rough" at the molecular level, thus changing the surface adhesion property.   In addition, the reaction mechanism of plasma cleaning on the surface, the physical and chemical reaction plays an important role, also is the reactive ion etching and reactive ion beam etching