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Surface treatment of PCB board in atmospheric plasma cleaning machine

  • Categories:Industry News
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2020-11-14
  • Views:

(Summary description)Atmospheric plasma has been used for many years, and before the next conversion operation, the surface cleaning and functionalization of the substrate and the benefits of plasma treatment are fully recognized, reducing surface morphology degradation, increasing treatment (Dyne) levels, and eliminating negative treatment. Due to the complexity, low speed and high cost of vacuum plasma systems, production requirements are sometimes not met. The atmospheric plasma cleaner, on the other hand, enables PCB substrates to be cleaned on a continuous coil treatment system, just like corona treatment system. Atmospheric plasmas can be treated with different reactive gases and have been successfully tested on metals, films, paper, foams and powders. In addition, according to cleaning requirements and material types, the reel-to-reel processing speed can exceed the current VACUUM processing speed of PCB. Atmospheric plasma cleaning machine for circuit board manufacturing industry provides a special solution, that is, without damaging the sensitive surface to remove the residual pollutants, so as to increase production. Application of atmospheric plasma technology in the manufacture of plasma PCB to improve the processing speed of sheet and coil.   Atmospheric plasma treatment:   When ionized gas is used to treat polymer films, there are three main effects on their surfaces:   Electron bombardment: Electrons produced by plasma electric fields are distributed over the surface of a material at high energies and velocities. This causes the upper chain of the treated material to break, resulting in cross-linking, thus strengthening the material.   Ion bombardment: Ions generated in the plasma electric field are distributed at different energies and velocities on the polymer surface, which will lead to etching and sputtering, thus cleaning the surface substrate and effectively reducing the molecular weight structure.   Gaseous excitation: Ionization of a gas also means that there are many exciting substances in the gas. These stimulated substances, using an appropriate mixture of gases, react with the surface to produce functional groups such as hydroxyl (-OH), carbonyl (-C=O), carboxyl (-COOH), or amino (NHx), which are highly polar and can alter the surface alkali/acid interactions.   Atmospheric plasma glow discharge can be used as an etching process to remove borehole smear and pitting. De-drilling refers to the removal of the epoxy resin from the hole tube, including grease that may be coated on the copper contact surface during drilling. If contaminants are not removed from the surface of the copper sheet, they may interfere with the connection to non-plated copper plated in the plating holes. With the improvement of the property of decontination chemicals, most specifications of standard materials are less relaxed, mainly to remove a large amount of epoxy resin and glass fiber, so that the copper interface protrudes into the hole. The protruding copper surface allows large surface areas to be used to interconnect with subsequent copper coatings, and the exposed epoxy surfaces can be removed during drilling to avoid being daubed.   Atmospheric plasma is used to remove the photoresist residue that may remain after the circuit forms a long distance between the panel and the inner layer. Humidification is used to remove the photoresist from the outer layer, usually in the same bath or spray chamber as the inner layer. Although corrosion resistant stripping is a single tank operation, both the developer and stripper have a short cleaning life (usually in hours), and these operations produce a large amount of waste liquid treatment liquid that can be significantly reduced by treatment with an atmospheric plasma cleaner.

Surface treatment of PCB board in atmospheric plasma cleaning machine

(Summary description)Atmospheric plasma has been used for many years, and before the next conversion operation, the surface cleaning and functionalization of the substrate and the benefits of plasma treatment are fully recognized, reducing surface morphology degradation, increasing treatment (Dyne) levels, and eliminating negative treatment. Due to the complexity, low speed and high cost of vacuum plasma systems, production requirements are sometimes not met. The atmospheric plasma cleaner, on the other hand, enables PCB substrates to be cleaned on a continuous coil treatment system, just like corona treatment system. Atmospheric plasmas can be treated with different reactive gases and have been successfully tested on metals, films, paper, foams and powders. In addition, according to cleaning requirements and material types, the reel-to-reel processing speed can exceed the current VACUUM processing speed of PCB. Atmospheric plasma cleaning machine for circuit board manufacturing industry provides a special solution, that is, without damaging the sensitive surface to remove the residual pollutants, so as to increase production. Application of atmospheric plasma technology in the manufacture of plasma PCB to improve the processing speed of sheet and coil.

 

Atmospheric plasma treatment:

 

When ionized gas is used to treat polymer films, there are three main effects on their surfaces:

 

Electron bombardment: Electrons produced by plasma electric fields are distributed over the surface of a material at high energies and velocities. This causes the upper chain of the treated material to break, resulting in cross-linking, thus strengthening the material.

 

Ion bombardment: Ions generated in the plasma electric field are distributed at different energies and velocities on the polymer surface, which will lead to etching and sputtering, thus cleaning the surface substrate and effectively reducing the molecular weight structure.

 

Gaseous excitation: Ionization of a gas also means that there are many exciting substances in the gas. These stimulated substances, using an appropriate mixture of gases, react with the surface to produce functional groups such as hydroxyl (-OH), carbonyl (-C=O), carboxyl (-COOH), or amino (NHx), which are highly polar and can alter the surface alkali/acid interactions.

 

Atmospheric plasma glow discharge can be used as an etching process to remove borehole smear and pitting. De-drilling refers to the removal of the epoxy resin from the hole tube, including grease that may be coated on the copper contact surface during drilling. If contaminants are not removed from the surface of the copper sheet, they may interfere with the connection to non-plated copper plated in the plating holes. With the improvement of the property of decontination chemicals, most specifications of standard materials are less relaxed, mainly to remove a large amount of epoxy resin and glass fiber, so that the copper interface protrudes into the hole. The protruding copper surface allows large surface areas to be used to interconnect with subsequent copper coatings, and the exposed epoxy surfaces can be removed during drilling to avoid being daubed.

 

Atmospheric plasma is used to remove the photoresist residue that may remain after the circuit forms a long distance between the panel and the inner layer. Humidification is used to remove the photoresist from the outer layer, usually in the same bath or spray chamber as the inner layer. Although corrosion resistant stripping is a single tank operation, both the developer and stripper have a short cleaning life (usually in hours), and these operations produce a large amount of waste liquid treatment liquid that can be significantly reduced by treatment with an atmospheric plasma cleaner.


  • Categories:Industry News
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2020-11-14 09:02
  • Views:
Information

Surface treatment of PCB board in atmospheric plasma cleaning machine:

 

Atmospheric plasma has been used for many years, and before the next conversion operation, the surface cleaning and functionalization of the substrate and the benefits of plasma treatment are fully recognized, reducing surface morphology degradation, increasing treatment (Dyne) levels, and eliminating negative treatment. Due to the complexity, low speed and high cost of vacuum plasma systems, production requirements are sometimes not met. The atmospheric plasma cleaner, on the other hand, enables PCB substrates to be cleaned on a continuous coil treatment system, just like corona treatment system. Atmospheric plasmas can be treated with different reactive gases and have been successfully tested on metals, films, paper, foams and powders. In addition, according to cleaning requirements and material types, the reel-to-reel processing speed can exceed the current VACUUM processing speed of PCB. Atmospheric plasma cleaning machine for circuit board manufacturing industry provides a special solution, that is, without damaging the sensitive surface to remove the residual pollutants, so as to increase production. Application of atmospheric plasma technology in the manufacture of plasma PCB to improve the processing speed of sheet and coil.

 

Atmospheric plasma treatment:

 

When ionized gas is used to treat polymer films, there are three main effects on their surfaces:

 

Electron bombardment: Electrons produced by plasma electric fields are distributed over the surface of a material at high energies and velocities. This causes the upper chain of the treated material to break, resulting in cross-linking, thus strengthening the material.

 

Ion bombardment: Ions generated in the plasma electric field are distributed at different energies and velocities on the polymer surface, which will lead to etching and sputtering, thus cleaning the surface substrate and effectively reducing the molecular weight structure.

 

Gaseous excitation: Ionization of a gas also means that there are many exciting substances in the gas. These stimulated substances, using an appropriate mixture of gases, react with the surface to produce functional groups such as hydroxyl (-OH), carbonyl (-C=O), carboxyl (-COOH), or amino (NHx), which are highly polar and can alter the surface alkali/acid interactions.

 

Atmospheric plasma glow discharge can be used as an etching process to remove borehole smear and pitting. De-drilling refers to the removal of the epoxy resin from the hole tube, including grease that may be coated on the copper contact surface during drilling. If contaminants are not removed from the surface of the copper sheet, they may interfere with the connection to non-plated copper plated in the plating holes. With the improvement of the property of decontination chemicals, most specifications of standard materials are less relaxed, mainly to remove a large amount of epoxy resin and glass fiber, so that the copper interface protrudes into the hole. The protruding copper surface allows large surface areas to be used to interconnect with subsequent copper coatings, and the exposed epoxy surfaces can be removed during drilling to avoid being daubed.

 

Atmospheric plasma is used to remove the photoresist residue that may remain after the circuit forms a long distance between the panel and the inner layer. Humidification is used to remove the photoresist from the outer layer, usually in the same bath or spray chamber as the inner layer. Although corrosion resistant stripping is a single tank operation, both the developer and stripper have a short cleaning life (usually in hours), and these operations produce a large amount of waste liquid treatment liquid that can be significantly reduced by treatment with an atmospheric plasma cleaner.

Surface treatment of PCB board in atmospheric plasma cleaning machine

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