Use of semiconductor plasma cleaning equipment in semiconductor wafer industry

• Categories:Industry News
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2020-11-11
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(Summary description)In the semiconductor industry chain, plasma cleaning equipment is an important link, it applies to raw materials and semi-finished products on every step possible impurity cleaning, in order to avoid impurity affecting the product quality and the performance of the downstream products, plasma cleaning equipment for monocrystalline silicon production, lithography, etching, deposition and other key process and packaging process of using are indispensable.   There are two cleaning technologies commonly used: wet cleaning and dry cleaning. At present, wet cleaning is still the mainstream in the industry, accounting for more than 90% of the cleaning steps. Wet production is to spray, scrub, etch and dissolve silicon wafers with chemical solvents to make the impurities on the surface react with the solvent to produce soluble substances and gases or fall off directly. Then, ultra-pure water is used to clean the surface of silicon wafers to make them dry and meet the requirements of cleanliness. In order to improve the cleaning effect of silicon chip, ultrasonic, heating, vacuum and other auxiliary technologies can be used. Wet cleaning includes pure solution dipping, mechanical wiping, ultrasonic/Meg cleaning, rotating spray, etc. Relatively speaking, dry cleaning refers to the cleaning technology that does not depend on chemical agents, including plasma cleaning, gas phase cleaning, beam cleaning, etc.   Due to the different technology and application conditions, there are obvious differences in the semiconductor cleaning equipment in the market. At present, the main cleaning equipment in the market is single wafer cleaning equipment, automatic cleaning table and washing machine equipment. From the 21st century to now, to single wafer cleaning equipment, automatic cleaning table, washing machine as the main cleaning equipment.   Semiconductor single wafer cleaning equipment is a kind of equipment that USES rotary spray to clean single wafer by chemical spray. Compared with automatic cleaning equipment, the cleaning efficiency is lower, but it has extremely high treatment environment control ability and particle removal ability. Automatic cleaning table, also known as slot automatic cleaning equipment, refers to the equipment cleaning multiple wafers at one time. Its advantage is strong cleaning ability, suitable for mass production, but can not reach the cleaning precision of single piece of cleaning equipment, it is difficult to meet the current technical advanced requirements of the whole process parameters. And because many pieces are cleaned at the same time, the automatic cleaning table cannot avoid the disadvantage of cross contamination. The washer adopts rotary spray, with mechanical wiping, high pressure, soft spray and other adjustable modes, suitable for deionized water cleaning process, including saw wafer, wafer wafer thinning, polishing, CVD, etc., especially plays an important role in the cleaning after wafer polishing.   There is no significant difference between the single wafer cleaning equipment and the automatic cleaning platform device in the use process. The main difference lies in the cleaning method and precision requirements, and the key dividing point lies in the semiconductor 45 nanometer process. In short, the automatic cleaning platform is multi-chip simultaneous cleaning, which has the advantage of mature equipment and high productivity, while the single-chip cleaning equipment is piece-by-piece cleaning, which has the advantage of high cleaning accuracy, can effectively clean the back side, slope and edge, while avoiding cross contamination between wafers. Before 45nm, the automatic cleaning table can meet the cleaning requirements. When it is below 45nm, the cleaning precision is achieved by relying on the single wafer cleaning equipment. With the number of post-semiconductor process nodes decreasing, single wafer cleaning equipment has become the main cleaning equipment under the predictable technology.   Process points reduce extrusion yield and increase the demand for cleaning equipment. Due to the reduction of process nodes, economic benefits require semiconductor enterprises to make continuous breakthroughs in cleaning technology and improve the requirements of cleaning equipment process parameters. Effective non-destructive cleaning will be a major challenge for manufacturers, especially for 10nm chips, 7nm chips and even smaller chips. To popularize Moore's Law, chip makers must be able to eliminate not only small, random defects on flat wafer surfaces, but also to adapt to more complex, fine-grained 3D chip structures that do not cause damage or material loss.