Application of plasma cleaning before adhesion in TP adhesion

• Categories:Industry News
• Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
• Origin:
• Time of issue:2020-11-03
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(Summary description)In the production process of camera modules, plasma plasma cleaning process can significantly improve the quality of camera modules. In the production process of the new generation of camera modules, plasma cleaning is an essential link. Plasma cleaning is widely used in the pre and post links of camera modules DB, WB and HM, and before TP bonding, greatly improving the binding, bonding strength and uniformity.   With the emergence of more and more terminal products, based on the public aesthetic and market demand, the screen takes up an increasing proportion of the width, various "narrow frame", "ultra-narrow frame", "no frame" and other concepts have also swept the whole industry, the pursuit of consumers is no less than metal and glass fuselage. However, due to the current limitations of liquid crystal and structure technology, it is difficult to realize the real bezel-less mobile phone in industrial design, and it is far from being popularized. By contrast, the "narrow border" and "ultra-narrow border" technologies are comparable in terms of structural stability and user experience. Moreover, this technology benefits from the extensive application in terminal products in the past two years, which is relatively mature compared with curved screen technology.   However, there are still some details in the production of ultra-narrow border. Because this technology minimizes the frame as much as possible, the binding surface of TP module and mobile phone shell will be smaller (width less than 1mm), which also leads to problems such as poor adhesion, glue overflow and uneven expansion of hot melt adhesive in the production process. It is worth noting that plasma processing technology has found a way to solve these problems that beset both component and terminal plants. The application of plasma surface processor in the process of fitting the TP module mentioned above with the mobile phone shell has been greatly improved after plasma surface treatment.   The plasma and the surface of the material have microphysical and chemical reactions (the depth of action is only tens to hundreds of nanometers, which will not affect the properties of the material itself), so that the surface of the material can be greatly improved, thus increasing the adhesion between the product and the glue. After plasma processing, the TP module shows the following advantages: 1. Enhanced surface activity, stronger adhesion to the shell, avoiding degumming; 2. The hot melt adhesive is evenly spread to form a continuous adhesive surface, and there is no gap between TP and the shell; 3, due to the increase in the surface energy of the hot melt adhesive, it can be spread thin without weakening the adhesive force, at this time can reduce the amount of glue applied, reduce the cost (about 1/3 of the glue used); In addition, compared with similar cleaning machine equipment, plasma surface processor has obvious advantages in processing technology.   First, the plasma flame width is small, can be designed to 2mm processing range, does not affect other areas do not need to be treated, to reduce accidents;   Second, the temperature is low, in normal use conditions, the plasma flame temperature at room temperature or so, will not reflect the film, LCD and TP surface caused high temperature damage;   Third, the equipment adopts low potential discharge structure, the flame is electrically neutral, does not damage the TP and LCD functions, the product after continuous processing, will not affect the TP capacity and display performance.   With the development of smart phones today, every time the terminal manufacturers launch a product, they must pursue high-quality experience on the basis of the past. For module enterprises, although different processes used in the traditional production process can complete the same production task, but through the continuous improvement of the entire production process, to achieve the overall increase in product yield, is the goal that should be achieved.