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PCB plasma surface cleaning machine Printed circuit board processing technology

  • Categories:Company Dynamics
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2020-10-28
  • Views:

(Summary description)Plasma processing technology is a new semiconductor manufacturing technology. This technology has been applied in semiconductor manufacturing field earlier and is an essential semiconductor manufacturing process. Therefore, IC processing is a long - term and mature technology. Plasma is a kind of high-energy and highly active material, which has a good etching effect on any organic material, etc. The production of plasma is processed by dry method and will not cause pollution, so it has been widely used in the production of PCB printed circuit board in recent years.   With the application of plasma processing technology becoming more and more popular today, PCB manufacturing process mainly has the following functions:   (1) Activation treatment of ptFE materials: Anyone who has ever been engaged in the hole metallization of PTFE material has the experience that using the hole metallization method on the common FR-4 multi-layer printed wire circuit board is not successful in the hole metallization of PTFE. Among them, PTFE activation pretreatment before chemical copper sink is the biggest difficulty and also the key step.   In the activation treatment of PTFE material before chemical deposition of copper, there are many methods that can be adopted, but in general, the product quality can be guaranteed and there are two purposes suitable for mass production as follows:   A) Chemical processing method: Metal sodium and naphthalene, in the solution of non-aqueous solvents such as tetrahydrofuran or glycol dimethyl ether reaction, the formation of naphthalene - sodium complex, the sodium naphthalene treatment solution, can make the surface of the polytetrafluoroethylene atoms etch, thereby achieving the purpose of wetting the hole wall. This is a typical method with good effect and stable quality, which is most widely used at present.   B) Plasma treatment: This process is easy to operate, stable and reliable, suitable for batch production, using dry process production. The sodium - naphthalene treatment solution prepared by chemical treatment is difficult to synthesize, toxic, short shelf life, and needs to be prepared according to the production situation, with high safety requirements.Therefore, at present, the activation treatment of PTFE surface mostly adopts plasma treatment method, which is easy to operate and greatly reduces the treatment of wastewater.   (2) Erosion of hole wall/removal of resin drilling dirt on hole wall: For fr-4 multilayer printed circuit board processing, the removal of material such as resin drilling dirt, etc. after nc drilling is usually performed by concentrated sulfuric acid treatment, chromic acid treatment, alkaline potassium permanganate treatment and plasma treatment.   But, at the beginning of flexible printed circuit boards and flexible printed circuit board to remove the dirt on the processing of drilling, due to the difference of material properties, if the chemical treatment method is used, the effect is not ideal, and using plasma to remove dirt and pitting drilling, you can get a better hole wall roughness, is advantageous to the hole metallization plating, and also has a "three-dimensional" pitting connection properties.   (3) Removal of carbide: Plasma treatment not only has obvious effect on drilling pollution of various plates, but also shows its superiority in drilling pollution treatment of composite resin materials and microholes. In addition, due to the increasing demand for the production of multilayer printed circuit boards with high interconnect density, many drilling blind holes are manufactured using laser technology. This is a by-product of laser drilling blind hole applications -- carbon, which needs to be removed before the hole metallization production process. At this point, plasma processing technology does not hesitate to take on the task of removing carbon.   (4) Internal pretreatment: Due to the increasing production demand of printed circuit boards, the corresponding processing technology requirements are also higher and higher. The inner layer pretreatment of flexible PCB and rigid flexible PCB can increase the surface roughness and activation degree, increase the bonding strength between the inner layers, and also have important significance to improve the yield of production.   Plasma treatment process is a dry process, compared with the wet process has many advantages, these advantages are determined by the characteristics of plasma itself. The whole reactive neutral plasma from high voltage ionization has a high degree of activity, and can continuously react with the atoms on the surface of the material, so that the surface material is constantly excited into gas, volatilization, in order to achieve the purpose of cleaning. It has good practicability in the process of PCB printed circuit board production, and is a clean, environme

PCB plasma surface cleaning machine Printed circuit board processing technology

(Summary description)Plasma processing technology is a new semiconductor manufacturing technology. This technology has been applied in semiconductor manufacturing field earlier and is an essential semiconductor manufacturing process. Therefore, IC processing is a long - term and mature technology. Plasma is a kind of high-energy and highly active material, which has a good etching effect on any organic material, etc. The production of plasma is processed by dry method and will not cause pollution, so it has been widely used in the production of PCB printed circuit board in recent years.

 

With the application of plasma processing technology becoming more and more popular today, PCB manufacturing process mainly has the following functions:

 

(1) Activation treatment of ptFE materials:

Anyone who has ever been engaged in the hole metallization of PTFE material has the experience that using the hole metallization method on the common FR-4 multi-layer printed wire circuit board is not successful in the hole metallization of PTFE. Among them, PTFE activation pretreatment before chemical copper sink is the biggest difficulty and also the key step.

 

In the activation treatment of PTFE material before chemical deposition of copper, there are many methods that can be adopted, but in general, the product quality can be guaranteed and there are two purposes suitable for mass production as follows:

 

A) Chemical processing method:

Metal sodium and naphthalene, in the solution of non-aqueous solvents such as tetrahydrofuran or glycol dimethyl ether reaction, the formation of naphthalene - sodium complex, the sodium naphthalene treatment solution, can make the surface of the polytetrafluoroethylene atoms etch, thereby achieving the purpose of wetting the hole wall. This is a typical method with good effect and stable quality, which is most widely used at present.

 

B) Plasma treatment:

This process is easy to operate, stable and reliable, suitable for batch production, using dry process production. The sodium - naphthalene treatment solution prepared by chemical treatment is difficult to synthesize, toxic, short shelf life, and needs to be prepared according to the production situation, with high safety requirements.Therefore, at present, the activation treatment of PTFE surface mostly adopts plasma treatment method, which is easy to operate and greatly reduces the treatment of wastewater.

 

(2) Erosion of hole wall/removal of resin drilling dirt on hole wall:

For fr-4 multilayer printed circuit board processing, the removal of material such as resin drilling dirt, etc. after nc drilling is usually performed by concentrated sulfuric acid treatment, chromic acid treatment, alkaline potassium permanganate treatment and plasma treatment.

 

But, at the beginning of flexible printed circuit boards and flexible printed circuit board to remove the dirt on the processing of drilling, due to the difference of material properties, if the chemical treatment method is used, the effect is not ideal, and using plasma to remove dirt and pitting drilling, you can get a better hole wall roughness, is advantageous to the hole metallization plating, and also has a "three-dimensional" pitting connection properties.

 

(3) Removal of carbide:

Plasma treatment not only has obvious effect on drilling pollution of various plates, but also shows its superiority in drilling pollution treatment of composite resin materials and microholes. In addition, due to the increasing demand for the production of multilayer printed circuit boards with high interconnect density, many drilling blind holes are manufactured using laser technology. This is a by-product of laser drilling blind hole applications -- carbon, which needs to be removed before the hole metallization production process. At this point, plasma processing technology does not hesitate to take on the task of removing carbon.

 

(4) Internal pretreatment:

Due to the increasing production demand of printed circuit boards, the corresponding processing technology requirements are also higher and higher. The inner layer pretreatment of flexible PCB and rigid flexible PCB can increase the surface roughness and activation degree, increase the bonding strength between the inner layers, and also have important significance to improve the yield of production.

 

Plasma treatment process is a dry process, compared with the wet process has many advantages, these advantages are determined by the characteristics of plasma itself. The whole reactive neutral plasma from high voltage ionization has a high degree of activity, and can continuously react with the atoms on the surface of the material, so that the surface material is constantly excited into gas, volatilization, in order to achieve the purpose of cleaning. It has good practicability in the process of PCB printed circuit board production, and is a clean, environme

  • Categories:Company Dynamics
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2020-10-28 09:17
  • Views:
Information

PCB plasma surface cleaning machine Printed circuit board processing technology:

 

Plasma processing technology is a new semiconductor manufacturing technology. This technology has been applied in semiconductor manufacturing field earlier and is an essential semiconductor manufacturing process. Therefore, IC processing is a long - term and mature technology. Plasma is a kind of high-energy and highly active material, which has a good etching effect on any organic material, etc. The production of plasma is processed by dry method and will not cause pollution, so it has been widely used in the production of PCB printed circuit board in recent years.

 

With the application of plasma processing technology becoming more and more popular today, PCB manufacturing process mainly has the following functions:

 

(1) Activation treatment of ptFE materials:

Anyone who has ever been engaged in the hole metallization of PTFE material has the experience that using the hole metallization method on the common FR-4 multi-layer printed wire circuit board is not successful in the hole metallization of PTFE. Among them, PTFE activation pretreatment before chemical copper sink is the biggest difficulty and also the key step.

 

In the activation treatment of PTFE material before chemical deposition of copper, there are many methods that can be adopted, but in general, the product quality can be guaranteed and there are two purposes suitable for mass production as follows:

 

A) Chemical processing method:

Metal sodium and naphthalene, in the solution of non-aqueous solvents such as tetrahydrofuran or glycol dimethyl ether reaction, the formation of naphthalene - sodium complex, the sodium naphthalene treatment solution, can make the surface of the polytetrafluoroethylene atoms etch, thereby achieving the purpose of wetting the hole wall. This is a typical method with good effect and stable quality, which is most widely used at present.

 

B) Plasma treatment:

This process is easy to operate, stable and reliable, suitable for batch production, using dry process production. The sodium - naphthalene treatment solution prepared by chemical treatment is difficult to synthesize, toxic, short shelf life, and needs to be prepared according to the production situation, with high safety requirements.Therefore, at present, the activation treatment of PTFE surface mostly adopts plasma treatment method, which is easy to operate and greatly reduces the treatment of wastewater.

 

(2) Erosion of hole wall/removal of resin drilling dirt on hole wall:

For fr-4 multilayer printed circuit board processing, the removal of material such as resin drilling dirt, etc. after nc drilling is usually performed by concentrated sulfuric acid treatment, chromic acid treatment, alkaline potassium permanganate treatment and plasma treatment.

 

But, at the beginning of flexible printed circuit boards and flexible printed circuit board to remove the dirt on the processing of drilling, due to the difference of material properties, if the chemical treatment method is used, the effect is not ideal, and using plasma to remove dirt and pitting drilling, you can get a better hole wall roughness, is advantageous to the hole metallization plating, and also has a "three-dimensional" pitting connection properties.

 

(3) Removal of carbide:

Plasma treatment not only has obvious effect on drilling pollution of various plates, but also shows its superiority in drilling pollution treatment of composite resin materials and microholes. In addition, due to the increasing demand for the production of multilayer printed circuit boards with high interconnect density, many drilling blind holes are manufactured using laser technology. This is a by-product of laser drilling blind hole applications -- carbon, which needs to be removed before the hole metallization production process. At this point, plasma processing technology does not hesitate to take on the task of removing carbon.

 

(4) Internal pretreatment:

Due to the increasing production demand of printed circuit boards, the corresponding processing technology requirements are also higher and higher. The inner layer pretreatment of flexible PCB and rigid flexible PCB can increase the surface roughness and activation degree, increase the bonding strength between the inner layers, and also have important significance to improve the yield of production.

 

Plasma treatment process is a dry process, compared with the wet process has many advantages, these advantages are determined by the characteristics of plasma itself. The whole reactive neutral plasma from high voltage ionization has a high degree of activity, and can continuously react with the atoms on the surface of the material, so that the surface material is constantly excited into gas, volatilization, in order to achieve the purpose of cleaning. It has good practicability in the process of PCB printed circuit board production, and is a clean, environmental friendly and efficient cleaning method.

PCB plasma surface cleaning machine

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