The main material of FPC printed circuit board (soft board) is composed of polyimide resin. Due to the heat generated during drilling, it is easy to leave a large amount of resin slag in the hole, resulting in the copper plating layer on the hole wall and the inner The layers of the circuit are poorly connected, and even break and open circuits. At present, the industry mostly uses resin leavening agents and potassium permanganate liquids to remove slag in the holes.
©Shenzhen Sing Fung Intelligent Manufacturing Co., Ltd. All rights reserved
TEL：0755-3367 3020 / 0755-3367 3019
ADD：Mabao Industrial Zone, Huangpu, Baoan District, Shenzhen