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E-mail:shaobo@sfi-crf.com

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Application field

Application field

Professional plasma plasma high-tech enterprise dedicated to providing manufacturing equipment and process solutions for the electronics industry
Application field
FPC/PCB field
The main material of FPC printed circuit board (soft board) is composed of polyimide resin. Due to the heat generated during drilling, it is easy to leave a large amount of resin slag in the hole, resulting in the copper plating layer on the hole wall and the inner The layers of the circuit are poorly connected, and even break and open circuits. At present, the industry mostly uses resin leavening agents and potassium permanganate liquids to remove slag in the holes.
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Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd.

Adhere to quality as the foundation, honesty as the way of business, innovation as the source of development, and service as the pinnacle of value

©Shenzhen Sing Fung Intelligent Manufacturing Co., Ltd. All rights reserved
粤ICP备19006998号
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TEL:0755-3367 3020 / 0755-3367 3019

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E-mail:sales-sfi@sfi-crf.com

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ADD:Mabao Industrial Zone, Huangpu, Baoan District, Shenzhen