Welcome to Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd.

E-mail:shaobo@sfi-crf.com

img
搜索
确认
取消
News Center

News Center

Professional plasma plasma high-tech enterprise dedicated to providing manufacturing equipment and process solutions for the electronics industry
News

Application of on-line plasma cleaning machine in cleaning process

  • Categories:Industry News
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2020-10-14
  • Views:

(Summary description)What are the advantages of plasma equipment compared with traditional processing technology? The efficiency link of plasma is gas-solid coherent chemical reaction, which does not consume water and chemical agents, and is environmentally friendly to the natural environment. In the whole process, the gas drying treatment method does not need the anticoagulant and water, which will hardly cause environmental problems, save energy and environmental protection, and save more costs. On-line plasma cleaning machine adopts automatic cleaning method, which is suitable for large production line, saves labor, reduces labor cost, and improves cleaning efficiency greatly, especially its advantages are obvious. With the development of the industry and consumer electronics market, electronic devices are getting thinner and thinner, and the volume is getting smaller. This market demand promotes the miniaturization of microelectronic packaging, and at the same time, it puts forward higher requirements for the reliability of packaging. High-quality packaging technology can extend the service life of products. The bonding gap, the low bonding strength of the lead wire, and the lamination or shedding of the welding ball in the process of wafer packaging have become important factors restricting the reliability of packaging. Therefore, it is necessary to effectively remove all kinds of dirt without damaging the surface properties and electrical properties of the material. There are two main cleaning methods that have been widely used: wet method and dry method. Considering environmental impact, raw material consumption and future development, wet cleaning has great limitations, and dry cleaning is obviously superior to wet cleaning. Among them, plasma cleaning develops rapidly and has obvious advantages. A plasma is an ionized gas. It is a collection of electrons, ions, atoms, molecules, or free radicals. In the process of cleaning, high-energy electrons will collide with gas molecules to make them dissociative or ionizing. Various particles generated will be used to bombate the cleaned surface or have chemical reactions with the cleaned surface to effectively remove various pollutants. At the same time, it can also improve the surface performance of the material itself, such as improving the wettability of the surface, improving the adhesion of the film, etc., which is of great significance in many applications. After plasma cleaning, the surface of the device is dried and no further treatment is required, which can improve the processing efficiency of the whole process line. It can prevent the operator from being hurt by harmful solvent. The plasma can be cleaned deep into the small holes and depressions inside the object, so the shape of the object to be cleaned does not need to be considered too much. It can also handle all kinds of materials, especially for high temperature and solvent resistant materials. All these advantages make plasma cleaning widely concerned.

Application of on-line plasma cleaning machine in cleaning process

(Summary description)What are the advantages of plasma equipment compared with traditional processing technology? The efficiency link of plasma is gas-solid coherent chemical reaction, which does not consume water and chemical agents, and is environmentally friendly to the natural environment. In the whole process, the gas drying treatment method does not need the anticoagulant and water, which will hardly cause environmental problems, save energy and environmental protection, and save more costs. On-line plasma cleaning machine adopts automatic cleaning method, which is suitable for large production line, saves labor, reduces labor cost, and improves cleaning efficiency greatly, especially its advantages are obvious.

With the development of the industry and consumer electronics market, electronic devices are getting thinner and thinner, and the volume is getting smaller. This market demand promotes the miniaturization of microelectronic packaging, and at the same time, it puts forward higher requirements for the reliability of packaging. High-quality packaging technology can extend the service life of products. The bonding gap, the low bonding strength of the lead wire, and the lamination or shedding of the welding ball in the process of wafer packaging have become important factors restricting the reliability of packaging. Therefore, it is necessary to effectively remove all kinds of dirt without damaging the surface properties and electrical properties of the material. There are two main cleaning methods that have been widely used: wet method and dry method. Considering environmental impact, raw material consumption and future development, wet cleaning has great limitations, and dry cleaning is obviously superior to wet cleaning. Among them, plasma cleaning develops rapidly and has obvious advantages.

A plasma is an ionized gas. It is a collection of electrons, ions, atoms, molecules, or free radicals. In the process of cleaning, high-energy electrons will collide with gas molecules to make them dissociative or ionizing. Various particles generated will be used to bombate the cleaned surface or have chemical reactions with the cleaned surface to effectively remove various pollutants. At the same time, it can also improve the surface performance of the material itself, such as improving the wettability of the surface, improving the adhesion of the film, etc., which is of great significance in many applications.

After plasma cleaning, the surface of the device is dried and no further treatment is required, which can improve the processing efficiency of the whole process line. It can prevent the operator from being hurt by harmful solvent. The plasma can be cleaned deep into the small holes and depressions inside the object, so the shape of the object to be cleaned does not need to be considered too much. It can also handle all kinds of materials, especially for high temperature and solvent resistant materials. All these advantages make plasma cleaning widely concerned.


  • Categories:Industry News
  • Author:plasma cleaning machine-surface treatment equipment-CRF plasma machine-Sing Fung Intelligent Manufacturing
  • Origin:
  • Time of issue:2020-10-14 09:34
  • Views:
Information

Application of on-line plasma cleaning machine in cleaning process:

What are the advantages of plasma equipment compared with traditional processing technology? The efficiency link of plasma is gas-solid coherent chemical reaction, which does not consume water and chemical agents, and is environmentally friendly to the natural environment. In the whole process, the gas drying treatment method does not need the anticoagulant and water, which will hardly cause environmental problems, save energy and environmental protection, and save more costs. On-line plasma cleaning machine adopts automatic cleaning method, which is suitable for large production line, saves labor, reduces labor cost, and improves cleaning efficiency greatly, especially its advantages are obvious.

With the development of the industry and consumer electronics market, electronic devices are getting thinner and thinner, and the volume is getting smaller. This market demand promotes the miniaturization of microelectronic packaging, and at the same time, it puts forward higher requirements for the reliability of packaging. High-quality packaging technology can extend the service life of products. The bonding gap, the low bonding strength of the lead wire, and the lamination or shedding of the welding ball in the process of wafer packaging have become important factors restricting the reliability of packaging. Therefore, it is necessary to effectively remove all kinds of dirt without damaging the surface properties and electrical properties of the material. There are two main cleaning methods that have been widely used: wet method and dry method. Considering environmental impact, raw material consumption and future development, wet cleaning has great limitations, and dry cleaning is obviously superior to wet cleaning. Among them, plasma cleaning develops rapidly and has obvious advantages.

A plasma is an ionized gas. It is a collection of electrons, ions, atoms, molecules, or free radicals. In the process of cleaning, high-energy electrons will collide with gas molecules to make them dissociative or ionizing. Various particles generated will be used to bombate the cleaned surface or have chemical reactions with the cleaned surface to effectively remove various pollutants. At the same time, it can also improve the surface performance of the material itself, such as improving the wettability of the surface, improving the adhesion of the film, etc., which is of great significance in many applications.

After plasma cleaning, the surface of the device is dried and no further treatment is required, which can improve the processing efficiency of the whole process line. It can prevent the operator from being hurt by harmful solvent. The plasma can be cleaned deep into the small holes and depressions inside the object, so the shape of the object to be cleaned does not need to be considered too much. It can also handle all kinds of materials, especially for high temperature and solvent resistant materials. All these advantages make plasma cleaning widely concerned.

on-line plasma cleaning machine

Scan the QR code to read on your phone

Relevant Information

Shenzhen Sing Fung Intelligent  Manufacturing Co., Ltd.

Adhere to quality as the foundation, honesty as the way of business, innovation as the source of development, and service as the pinnacle of value

©Shenzhen Sing Fung Intelligent Manufacturing Co., Ltd. All rights reserved
粤ICP备19006998号
dh

TEL:0755-3367 3020 / 0755-3367 3019

dh

E-mail:sales-sfi@sfi-crf.com

dh

ADD:Mabao Industrial Zone, Huangpu, Baoan District, Shenzhen