The bonding between the chip and the package substrate is often two materials with different properties. The surface of the material is usually hydrophobic and inert, and its surface bonding performance is poor. The interface is prone to voids during the bonding process. After sealing and packaging The chip brings great hidden dangers. Plasma treatment on the surface of the chip and the package substrate can effectively increase the surface activity, greatly improve the fluidity of the bonding epoxy resin on the surface, and improve the adhesion of the chip and the package substrate. Junction wettability reduces the delamination between the chip and the substrate, improves the thermal conductivity, improves the reliability and stability of the IC package, and increases the life of the product.